Glass articles with non-planar features and alkali-free glass elements

A method of forming an electronic device assembly, comprising the steps:

• forming a backplane having a glass composition substantially free of alkali ions, an elastic modulus of about 40 GPa to about 100 GPa, an initial thickness that is at least 20 μm greater than a final thickness, a first primary surface, and a second primary surface;
• removing material from the initial thickness of the backplane to define the final thickness, the final thickness from about 20 μm to about 100 μm;
• forming a protect layer on the first primary surface of the backplane;
• after forming the protect layer, disposing a plurality of electronic components on the second primary surface of the backplane;
• forming at least one static bend in the backplane after the step of disposing the plurality of electronic components on the second primary surface of the backplane, the static bend having a bend radius between about 25 mm and about 5 mm;
• sealing the backplane with an encapsulant;
• and
• encapsulating the plurality of electronic components with the encapsulant, wherein the encapsulant comprises:
• (a) a thickness from about 25 μm to about 125 μm;
• (b) a glass layer having an optical transmissivity of at least 90%,
• (c) a first primary surface;
• (d) a compressive stress region extending from the first primary surface of the glass layer to a first depth in the glass layer, the region defined by a compressive stress of at least about 100 MPa at the first primary surface of the glass layer;
• and
• (e) at least one curved feature having a radius substantially equivalent to the bend radius of the static bend in the backplane.