# US 10,483,209 B2 · Impedance controlled electrical interconnection employing meta-materials

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- Number: US 10,483,209 B2
- Document ID: US10483209B2
- Status: Granted
- Kind: B2
- Application number: 14/685,432
- Filed: 2015-04-13
- Published: 2015-08-06
- Granted: 2019-11-19
- Earliest claimed: 2015-04-13
- Assignees: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicants: Taiwan Semiconductor Manufacturing Company, Ltd.
- Inventors: Christopher Wyland
- Web page: https://patentgrep.com/patent/US10483209B2

## CPC

- H10W 70/611: {for connecting multiple chips together}
- H01P 1/047: {Strip line joints}
- H05K 1/0243: {Printed circuits associated with mounted high frequency components}
- H10W 20/42: Vias, e.g. via plugs
- H10W 44/20: at high-frequency [HF] or radio frequency [RF]
- H10W 70/685: comprising multiple insulating layers
- H10W 70/688: {Flexible insulating substrates}
- H10W 72/077: {Connecting of TAB connectors}
- H10W 72/701: {Tape-automated bond [TAB] connectors}
- H10W 99/00: Subject matter not provided for in other groups of this subclass
- H05K 2203/049: Wire bonding
- H10W 44/206: {Wires}
- H10W 44/216: {Waveguides, e.g. strip lines}
- H10W 72/07533: {Ultrasonic bonding, e.g. thermosonic bonding}
- H10W 72/07553: {changes in shapes}
- H10W 72/07554: {changes in dispositions}
- H10W 72/531: {Shapes of wire connectors}
- H10W 72/534: {being rectangular}
- H10W 72/5363: {the connected ends being wedge-shaped}
- H10W 72/537: {Multiple bond wires having different shapes}
- H10W 72/5445: {being orthogonal to a side surface of the chip, e.g. parallel arrangements}
- H10W 72/5475: {multiple bond wires connected to common bond pads at both ends of the wires}
- H10W 72/5522: {comprising gold [Au]}
- H10W 72/5524: {comprising aluminium [Al]}
- H10W 72/5525: {comprising copper [Cu]}
- H10W 72/59: Bond pads specially adapted therefor
- H10W 72/884: {Die-attach connectors and bond wires}
- H10W 90/751: {of bond wires}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H01P: WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE (operating at optical frequencies G02B)
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

A method of improving electrical interconnections between two electrical elements is made available by providing a meta-material overlay in conjunction with the electrical interconnection. The meta-material overlay is designed to make the electrical signal propagating via the electrical interconnection to act as though the permittivity and permeability of the dielectric medium within which the electrical interconnection is formed are different than the real component permittivity and permeability of the dielectric medium surrounding the electrical interconnection. In some instances the permittivity and permeability resulting from the meta-material cause the signal to propagate as if the permittivity and permeability have negative values. Accordingly the method provides for electrical interconnections possessing enhanced control and stability of impedance, reduced noise, and reduced loss. Alternative embodiments of the meta-material overlay provide, the enhancements for conventional discrete wire bonds while also facilitating single integrated designs compatible with tape implementation.

## Claims

### Claim 1

A device comprising:
a plurality of layers to be secured to provide electrical interconnection between a plurality of first bond pads of a first device and a plurality of second bond pads of a second device, wherein the plurality of layers includes:
a first conductor layer arranged to extend continuously along a portion of a length of the first device and the second device, such that the first conductor layer physically contacts the plurality of first bond pads of the first device and the plurality of second bond pads of the second device when secured;
a second conductor layer disposed over the first conductor layer, wherein the second conductor layer includes a plurality of electrically independent conductors arranged to span a length that is about the portion of the length of the first device and the second device when secured; and
a third conductor layer disposed over the second conductor layer, such that the second conductor layer is disposed between the first conductor layer and the third conductor layer, wherein the third conductor layer is arranged to extend continuously along the portion of the length of the first device and the second device when secured.

### Claim 2 (depends on 1)

The device of claim 1, wherein the plurality of electrically independent conductors are a first plurality of electrically independent conductors, and the plurality of layers further includes a fourth conductor layer disposed between the third conductor layer and the second conductor layer, wherein the fourth conductor layer includes a second plurality of electrically independent conductors arranged to span a length that is about the portion of the length of the first device and the second device when secured.

### Claim 3 (depends on 2)

The device of claim 2, wherein each conductor of the second plurality of electrically independent conductors has a substantially linear shape and is arranged to extend substantially parallel to the portion of the length of the first device and the second device when secured.

### Claim 4 (depends on 1)

The device of claim 1, wherein the plurality of electrically independent conductors includes concentrically-shaped metal features arranged in an array in the second conductor layer.

### Claim 5 (depends on 4)

The device of claim 4, wherein the concentrically-shaped metal features each include a first set of two parallel lines and a second set of three parallel lines arranged perpendicular to the first set of two parallel lines, and wherein two lines of the second set of three parallel lines are aligned and physically separated from each other.

### Claim 6 (depends on 1)

The device of claim 1, wherein the plurality of layers further includes a resin material, wherein the second conductor layer is disposed in the resin material.

### Claim 7 (depends on 1)

The device of claim 1, wherein the plurality of layers includes a via structure that connects the first conductor layer to the third conductor layer.

### Claim 8 (depends on 1)

The device of claim 1, wherein the third conductor layer is electrically connected to a ground contact of the first device or the second device.

### Claim 9 (depends on 1)

The device of claim 1, wherein the third conductor layer extends beyond the plurality of layers, such that the third conductor layer physically contacts a bonding pad of the first device or the second device when secured.

### Claim 10

A device comprising:
a seven-layer meta-material overlay for providing electrical interconnection between at least one bonding area of the first device and at least one bonding area of the second device, wherein the seven-layer meta-material overlay includes:
a first conductor layer having a length that is about a length of the seven-layer meta-material overlay, wherein the first conductor layer is configured to physically contact the at least one bonding area of the first device and the at least one bonding area of the second device;
a first insulator layer disposed over the first conductor layer;
a second conductor layer disposed over the first insulator layer, wherein the second conductor layer includes an array of concentrically-shaped conductors and further wherein the array of concentrically-shaped conductors has a length that is about the length of the seven-layer meta-material overlay;
a second insulator layer disposed over the second conductor layer;
a third conductor layer disposed over the second insulator layer, wherein the third conductor layer includes an array of linear-shaped conductors and further wherein the array of linear-shaped conductors has a length that is about the length of the seven-layer meta-material overlay;
a third insulator layer disposed over the third conductor layer; and
a fourth conductor layer disposed over the third insulator layer, wherein the fourth conductor layer has a length that is about the length of the seven-layer meta-material overlay.

### Claim 11 (depends on 10)

The device of claim 10, wherein the second conductor layer and the third conductor layer include an insulating material, wherein the array of concentrically-shaped conductors and the array of linear-shaped conductors are disposed in the insulating material.

### Claim 12 (depends on 10)

The device of claim 10, wherein each of the concentrically-shaped conductors is rectangular-shaped.

### Claim 13 (depends on 10)

The device of claim 10, further comprising a via that extends through the seven-layer meta-material overlay, such that the via connects the first conductor layer to the fourth conductor layer.

### Claim 14 (depends on 10)

The device of claim 10, wherein the seven-layer meta-material overlay is a first seven-layer meta-material overlay providing electrical interconnection between a first bonding area of the first device and a first bonding area of the second device, the device further comprising:
a second seven-layer meta-material overlay providing electrical interconnection between a second bonding area of the first device and a second bonding area of the second device.

### Claim 15 (depends on 14)

The device of claim 14, wherein layers of the second seven-layer meta-material overlay are configured the same as layers of the first seven-layer meta-material overlay.

### Claim 16 (depends on 14)

The device of claim 14, wherein layers of the second seven-layer meta-material are configured different than layers of the first seven-layer meta-material overlay.

### Claim 17 (depends on 14)

The device of claim 14, wherein:
the first bonding area of the first device and the first bonding area of the second device each include more than one bonding pad; and
the second bonding area of the first device and the second bonding area of the second device each include one bonding pad.

### Claim 18

A device comprising:
a multi-layer meta-material overlay for providing electrical interconnection between at least one bonding area of a first device and at least one bonding area of a second device, wherein the multi-layer meta-material overlay includes:
an electrical trace layer having a length that is about a length of the multi-layer meta-material overlay, wherein the electrical trace layer is configured to physically connect to the at least one bonding area of the first device and the at least one bonding area of the second device when the multi-layer meta-material overlay is secured to the first device and the second device;
a conductor layer disposed over the electrical trace layer, wherein the conductor layer includes an array of concentrically-shaped conductors, wherein a length of the array of concentrically-shaped conductors is about the length of the multi-layer meta-material overlay; and
a signal conductor plane disposed over the conductor layer, wherein the signal conductor plane is configured to physically connect to ground when the multi-layer meta-material overlay is secured to the first device and the second device.

### Claim 19 (depends on 18)

The device of claim 18, wherein the multi-layer meta-material overlay further includes a conductive feature that connects the electrical trace layer to the signal conductor plane.

### Claim 20 (depends on 18)

The device of claim 18, wherein a length of the signal conductor plane is greater than a length of the multi-layer meta-material overlay.