# US 10,483,189 B2 · Power conversion apparatus > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,483,189 B2 - Document ID: US10483189B2 - Status: Granted - Kind: B2 - Application number: 16/151,365 - Filed: 2018-10-04 - Published: 2019-04-11 - Granted: 2019-11-19 - Earliest claimed: 2017-10-10 - Assignees: Honda Motor Co., Ltd. - Applicants: Honda Motor Co., Ltd. - Inventors: Takahiro Uneme; Yuko Yamada - Web page: https://patentgrep.com/patent/US10483189B2 ## CPC - H10W 40/613: {for stacked arrangements of a plurality of semiconductor devices} - B60L 53/20: characterised by converters located in the vehicle - H05K 7/20927: {Liquid coolant without phase change} - H10W 40/47: by flowing liquids, e.g. forced water cooling - H10W 40/778: {in encapsulations} - Y02T 10/70: Energy storage systems for electromobility, e.g. batteries - Y02T 10/7072: Electromobility specific charging systems or methods for batteries, ultracapacitors, supercapacitors or double-layer capacitors - Y02T 90/14: Plug-in electric vehicles - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - B60L: PROPULSION OF ELECTRICALLY-PROPELLED VEHICLES (arrangements or mounting of electrical propulsion units or of plural diverse prime-movers for mutual or common propulsion in vehicles B60K1/00, B60K6/20; arrangements or mounting of electrical gearing in vehicles B60K17/12, B60K17/14; preventing wheel slip by reducing power in rail vehicles B61C15/08; dynamo-electric machines H02K; control or regulation of electric motors H02P); SUPPLYING ELECTRIC POWER FOR AUXILIARY EQUIPMENT OF ELECTRICALLY-PROPELLED VEHICLES (electric coupling devices combined with mechanical couplings of vehicles B60D1/64; electric heating for vehicles B60H1/00); ELECTRODYNAMIC BRAKE SYSTEMS FOR VEHICLES IN GENERAL (control or regulation of electric motors H02P); MAGNETIC SUSPENSION OR LEVITATION FOR VEHICLES; MONITORING OPERATING VARIABLES OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRIC SAFETY DEVICES FOR ELECTRICALLY-PROPELLED VEHICLES - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - Y02T: CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION ## Abstract A power conversion apparatus mounted in a vehicle includes a semiconductor stack in which a plurality of semiconductor modules and a plurality of coolants including coolant passages are disposed by being alternately stacked, and a retaining unit which presses the semiconductor stack in a stacking direction to retain the semiconductor stack. The semiconductor modules and the coolants are attached to each other by a plate-shaped insulating resin adhesive member, and a roughened area on which a roughening treatment has been performed is formed in at least a part of the outer surface of the coolants to which the resin adhesive member is attached. ## Claims ### Claim 1 A power conversion apparatus mounted in a vehicle, comprising: a semiconductor stack in which a plurality of semiconductor modules and a plurality of coolant bodies are disposed by being alternately stacked, wherein the plurality of coolant bodies includes coolant passages; and a retaining unit which presses the semiconductor stack in a stacking direction to retain the semiconductor stack, wherein the plurality of semiconductor modules and the plurality of coolant bodies are attached to each other by a resin adhesive member, and a roughened area on which a roughening treatment has been performed is formed in at least a part of an outer surface of the plurality of coolant bodies to which the resin adhesive member is attached, and wherein the roughened area is formed on an entire outer surface of the plurality of coolant bodies. ### Claim 2 (depends on 1) The power conversion apparatus according to claim 1, wherein a surface roughness of the roughened area is less than a thickness of the resin adhesive member. ### Claim 3 (depends on 1) The power conversion apparatus according to claim 1, wherein a first metal plate is disposed at a first end of the plurality of semiconductor modules and a second metal plate is disposed at a second end of the plurality of semiconductor modules in the stacking direction, and the resin adhesive member covers a first surface of the first metal plate and a second surface of the second metal plate. ### Claim 4 (depends on 3) The power conversion apparatus according to claim 3, wherein the roughened area and a non-roughened area on which the roughening treatment has not been performed are formed on a surface facing the plurality of semiconductor modules in the outer surface of the plurality of coolant bodies, and the roughened area extends to an outer side of the first metal plate and the second metal plate in the plurality of semiconductor modules in a sectional view in the stacking direction. ### Claim 5 (depends on 1) The power conversion apparatus according to claim 1, wherein the resin adhesive member is formed by adding a filler having a higher thermal conductivity than that of a base material resin to the base material resin. ### Claim 6 (depends on 1) The power conversion apparatus according to claim 1, wherein the resin adhesive member is a plate-shaped insulating resin adhesive member. ### Claim 7 A power conversion apparatus mounted in a vehicle, comprising: a semiconductor stack in which a plurality of semiconductor modules and a plurality of coolant bodies are disposed by being alternately stacked, wherein the plurality of coolant bodies includes coolant passages; and a retaining unit which presses the semiconductor stack in a stacking direction to retain the semiconductor stack, wherein the plurality of semiconductor modules and the plurality of coolant bodies are attached to each other by a resin adhesive member, and a roughened area on which a roughening treatment has been performed is formed in at least a part of an outer surface of the plurality of coolant bodies to which the resin adhesive member is attached, and wherein the roughened area and a non-roughened area on which the roughening treatment has not been performed are formed on a surface facing the plurality of semiconductor modules in the outer surface of the plurality of coolant bodies, and the roughened area extends to an outer side of a first metal plate and a second metal plate in the plurality of semiconductor modules in a sectional view in the stacking direction. ### Claim 8 (depends on 7) The power conversion apparatus according to claim 7, wherein a surface roughness of the roughened area is less than a thickness of the resin adhesive member. ### Claim 9 (depends on 7) The power conversion apparatus according to claim 7, wherein the first metal plate is disposed at a first end of the plurality of semiconductor modules and the second metal plate is disposed at a second end of the plurality of semiconductor modules in the stacking direction, and the resin adhesive member covers a first surface of the first metal plate and a second surface of the second metal plate. ### Claim 10 (depends on 7) The power conversion apparatus according to claim 7, wherein the roughened area is formed on an entire outer surface of the plurality of coolant bodies. ### Claim 11 (depends on 7) The power conversion apparatus according to claim 7, wherein the resin adhesive member is formed by adding a filler having a higher thermal conductivity than that of a base material resin to the base material resin. ### Claim 12 (depends on 7) The power conversion apparatus according to claim 7, wherein the resin adhesive member is a plate-shaped insulating resin adhesive member.