# US 10,483,184 B1 · Recursive metal embedded chip assembly > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,483,184 B1 - Document ID: US10483184B1 - Status: Granted - Kind: B1 - Application number: 15/951,875 - Filed: 2018-04-12 - Granted: 2019-11-19 - Earliest claimed: 2015-10-21 - Assignees: HRL Laboratories, LLC - Applicants: HRL Laboratories, LLC - Inventors: Florian G. Herrault; Miroslav Micovic - Web page: https://patentgrep.com/patent/US10483184B1 ## CPC - H10W 40/258: {Metallic materials (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence)} - H10W 40/037: {Assembling together parts thereof} - H10W 40/10: Arrangements for heating - H10W 40/22: characterised by their shape, e.g. having conical or cylindrical projections - H10W 72/0198: {batch processes} - H10W 74/019: {using temporary auxiliary substrates (H10W74/017 takes precedence)} - H10W 74/111: {the semiconductor body being completely enclosed} - H10W 74/014: {using batch processing} - H10W 90/00: Package configurations - H10W 90/10: Configurations of laterally-adjacent chips - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A recursive metal-embedded chip assembly (R-MECA) process and method is described for heterogeneous integration of multiple die from diverse device technologies. The recursive aspect of this integration technology enables integration of increasingly-complex subsystems while bridging different scales for devices, interconnects and components. Additionally, the proposed concepts include high thermal management performance that is maintained through the multiple recursive levels of R-MECA, which is a key requirement for high-performance heterogeneous integration of digital, analog mixed signal and RF subsystems. At the wafer-scale, chips from diverse technologies and different thicknesses are initially embedded in a metal heat spreader surrounded by a mesh wafer host. An embodiment uses metal embedding on the backside of the chips as a key differentiator for high-density integration, and built-in thermal management. After die embedding, wafer-level front side interconnects are fabricated to interconnect the various chips and with each other. The wafer is then diced into individual metal-embedded chip assembly (MECA) modules, and forms the level one for multi-scale R-MECA integration. These modules are subsequently integrated into another wafer or board using the same integration approach recursively. Additional components such as discrete passive resistors, capacitors and inductors can be integrated at the second level, once the high-resolution, high-density integration has been performed at level zero. This recursive integration offers a practical solution to build very large scale integrated systems and subsystems. ## Claims ### Claim 1 An assembly comprising: two or more component modules, wherein at least a first one of the component modules comprises a first embedded chip assembly, and at least a second one of the component modules comprises a second embedded chip assembly; a thermally conductive material, wherein the two or more component modules are embedded in the thermally conductive material; and interconnects coupling the two or more component modules to each other, wherein the first embedded chip assembly comprises at least two interconnected chips embedded in the thermally conductive material, and wherein the first embedded chip assembly further comprises a packaging substrate disposed at least partially around the at least two interconnected chips. ### Claim 2 (depends on 1) The assembly of claim 1, wherein the packaging substrate is disposed around the at least two interconnected chips, wherein the packaging substrate is made from one of silicon, quartz, PolyChlorinated Biphenyls (PCBs), Fiberglass reinforced epoxy laminates, Silicon Carbide (SiC) and polymer, and wherein the thermally conductive material provides a thermal heat sink. ### Claim 3 (depends on 1) The assembly of claim 1, wherein the packaging substrate is disposed around the at least two interconnected chips, wherein the packaging substrate is made of a material selected from silicon, quartz, PolyChlorinated Biphenyls (PCB), Silicon Carbide (SiC) and polymer. ### Claim 4 (depends on 1) The assembly of claim 1, wherein the second one of the component modules further comprises an integrated circuit chip. ### Claim 5 (depends on 1) The assembly of claim 1, wherein the two or more component modules have active faces, the interconnects coupling the active faces to each other. ### Claim 6 (depends on 5) The assembly of claim 5, further comprising discrete components connected to the two or more component modules by wire bonding, wherein the discrete components are elementary electronic devices constructed as single units, and wherein the assembly is electrically connected to a third embedded chip assembly. ### Claim 7 A metal-embedded multi-module device comprising: two or more component modules, wherein at least a first one of the component modules includes a first metal-embedded chip assembly and at least a second one of the component modules includes a second metal-embedded chip assembly; a heat spreader material embedding the two or more component modules; and interconnects between the two or more component modules, the interconnects being on a side of the two or more component modules; wherein the first metal-embedded chip assembly comprises: at least two chips embedded in the heat spreader material; and a packaging substrate disposed at least partially around the at least two interconnected chips. ### Claim 8 (depends on 7) The device of claim 7, wherein the packaging substrate is made of a material selected from silicon, quartz, PolyChlorinated Biphenyls (PCB), Silicon Carbide (SiC) and polymer. ### Claim 9 (depends on 7) The device of claim 7, wherein the at least one of the component modules further includes at least one of an Integrated Circuit chip, a macro cell, and a die. ### Claim 10 An assembly comprising: a thermally conductive material; a first embedded chip assembly comprising: two or more chips embedded together in the thermally conductive material; a packaging substrate disposed at least partially around the two or more chips; and first interconnects electrically connecting the two or more chips to each other, wherein the first embedded chip assembly is embedded in the thermally conductive material; a second embedded chip assembly embedded in the thermally conductive material; and second interconnects electrically connecting the first embedded chip assembly to the second embedded chip assembly. ### Claim 11 (depends on 10) The assembly of claim 10, wherein the packaging substrate is made of a material selected from silicon, quartz, PolyChlorinated Biphenyls (PCB), Silicon Carbide (SiC) and polymer. ### Claim 12 (depends on 10) The assembly of claim 10, wherein the second embedded chip assembly comprises two or more chips embedded together in the thermally conductive material. ### Claim 13 (depends on 10) The assembly of claim 10, wherein the first embedded chip assembly has an active face opposite a back side, and wherein the thermally conductive material is electroplated on the backside of the first embedded chip assembly. ### Claim 14 (depends on 13) The assembly of claim 13, further comprising a discrete component, wherein the discrete component is one of: a resistor, a capacitor, and an inductor, and wherein the active face of the first embedded chip assembly is electrically connected to the discrete component by wire bonding. ### Claim 15 (depends on 14) The assembly of claim 14, wherein the first interconnects connect the two or more chips to the packaging substrate, and wherein the discrete component is disposed on the thermally conductive material. ### Claim 16 A multilevel device comprising: a first assembly having: at least two component modules, the component modules each comprising an embedded chip assembly; a first packaging substrate, the at least two component modules being at least partially contained by the first packaging substrate; a heat spreader material located at least partially around the at least two component modules and in the first packaging substrate; and interconnects coupled between the component modules, the first packaging substrate associating with the interconnects, wherein each embedded chip assembly comprises: at least two chips embedded in the heat spreader material; and a second packaging substrate disposed at least partially around the at least two interconnected chips. ### Claim 17 (depends on 16) The device of claim 16 wherein each of the component modules has a back side and a front side opposite of the back side, the interconnects connecting to the front side, the heat spreader material not being on the front sides of the at least two component modules. ### Claim 18 (depends on 16) The device of claim 16 wherein the at least two component modules comprise elements from diverse technologies, and wherein the interconnects connect to a delayered area of the component modules. ### Claim 19 (depends on 16) The device of claim 16, wherein the first and second packaging substrates are made of a material selected from silicon, quartz, PolyChlorinated Biphenyls (PCB), Silicon Carbide (SiC) and polymer. ### Claim 20 (depends on 16) The device of claim 16 wherein the interconnects connect to the first packaging substrate, the interconnects being suspended over the heat spreader material. ### Claim 21 (depends on 16) The device of claim 16, wherein the component modules each further comprise at least one of an Integrated Circuit chip, a macro cell, and a die. ### Claim 22 (depends on 16) The device of claim 16 wherein the at least two component modules comprise elements of different thicknesses. ### Claim 23 (depends on 16) The device of claim 16, wherein the at least two component modules are embedded in the heat spreader material. ### Claim 24 (depends on 16) The device of claim 16 wherein the heat spreader is metallic. ### Claim 25 (depends on 16) The device of claim 16 wherein the heat spreader material embeds the at least two component modules within the first packaging substrate and thereby achieves high density integration and thermal management of the device. ### Claim 26 (depends on 25) The device of claim 25 wherein the interconnects are comprised of conductors and dielectrics, the conductors being comprised of materials of high electrical conductivity, the dielectrics being comprised of one or a combination of BCB, SU-8, polyimide, air, SiO2, SiN, and Al2O3 and wherein the interconnects are of a thickness between 0.1 and 500 micro meters. ### Claim 27 (depends on 25) The device of claim 25 wherein for each embedded chip assembly: the heat spreader material is located within the second packaging substrate, the interconnects connecting the at least two chips to the second packaging substrate. ### Claim 28 (depends on 27) The device of claim 27 further comprising additional assemblies mirroring at least in part the construction of the first assembly, wherein the additional assemblies are connected to the first assembly. ### Claim 29 (depends on 25) The device of claim 25 wherein the first assembly is connected to at least one other component, the at least one other component being at least one of a component module, resistor, capacitor, and an inductor, wherein the first packaging substrate at least partially surrounds the at least two component modules and the at least one other component, the heat spreader material being within the first packaging substrate and embedding the at least two component modules, the interconnects interconnecting the first packaging substrate and the at least two component modules and the at least one other component. ### Claim 30 (depends on 29) The device of claim 29 wherein the first assembly is connected to at least another one other component. ### Claim 31 (depends on 30) The device of claim 30, wherein the first packaging substrate at least partially surrounds the another one other component, the interconnects connecting the first assembly and the at least another one other component. ### Claim 32 (depends on 25) The device of claim 25 wherein the chips of each embedded chip assembly are at least two diced pieces of technology; the second packaging substrate disposed around the at least two pieces of technology; the heat spreader material being in the second packaging substrate and embedding the at least two diced pieces of technology; and the interconnects connecting the second packaging substrate and the at least two diced pieces of technology. ### Claim 33 (depends on 32) The device of claim 32 wherein the at least two diced pieces of technology are from different technologies. ### Claim 34 (depends on 32) The device of claim 32 wherein the at least two diced pieces of technology are from the same technology.