# US 10,483,181 B2 · Electronic package and fabrication method > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,483,181 B2 - Document ID: US10483181B2 - Status: Granted - Kind: B2 - Application number: 16/035,083 - Filed: 2018-07-13 - Published: 2019-01-24 - Granted: 2019-11-19 - Earliest claimed: 2017-07-18 - Assignees: STMicroelectronics (Grenoble 2) SAS - Applicants: STMicroelectronics (Grenoble 2) SAS - Inventors: Karine Saxod; Nicolas Mastromauro - Web page: https://patentgrep.com/patent/US10483181B2 ## CPC - H10W 74/127: {characterised by arrangements for sealing or adhesion} - H10W 74/124: {the encapsulations having cavities other than that occupied by chips} - H10W 74/129: {forming a chip-scale package [CSP]} - H10W 76/12: characterised by their shape - H10W 76/60: Seals - H10W 78/00: Detachable holders for supporting packaged chips in operation - H10W 72/884: {Die-attach connectors and bond wires} - H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract An integrated circuit chip is mounted to a front face of a support plate. An encapsulation cap in then mounted to the support plate. The encapsulation cap includes a front wall and a peripheral wall having an end edge at least partly facing a peripheral zone of the support plate. The support plate and the encapsulation cap delimit a chamber in which the integrated circuit chip is situated. To mount the encapsulation cap, a bead of glue is inserted between the peripheral zone and the end edge of the peripheral wall of the encapsulation cap. A peripheral outer face of the encapsulation cap includes a recess extending from the end edge which locally uncovers a part of the bead of glue. A local hardening of the glue at the recess is performed as a first attachment step. Further hardening of the remainder of the glue is then performed. ## Claims ### Claim 1 A package, comprising: a support plate having a front face; an electronic integrated circuit chip mounted on the front face of the support plate; an encapsulation cap comprising a front wall extending in front of the electronic integrated circuit chip and a peripheral wall having an end edge at least partly facing a peripheral zone of the support plate, the support plate and the encapsulation cap delimiting at least one chamber in which the electronic integrated circuit chip is situated; and at least one bead of glue inserted between said peripheral zone of the support plate and said end edge of the peripheral wall of the encapsulation cap; wherein the peripheral outer face of said encapsulation cap has at least one local hollowed-out recess extending from said end edge and only partially along at a local and limited portion of said peripheral wall in the peripheral direction of the peripheral wall, said at least one local recess locally uncovering said bead of glue in a local portion of the bead of glue in the peripheral direction of the peripheral wall. ### Claim 2 (depends on 1) The package according to claim 1, wherein said local hollowed-out recess extends over all of a height of said peripheral wall along the outer face of said encapsulation cap. ### Claim 3 (depends on 1) The package according to claim 1, wherein said local hollowed-out recess extends over only a part of a height of said peripheral wall along the outer face of said encapsulation cap. ### Claim 4 (depends on 1) The package according to claim 1, wherein the outer face of said encapsulation cap has at least two local hollowed-out recesses in the peripheral wall situated on opposite sides of the encapsulation cap from one another. ### Claim 5 (depends on 1) The package according to claim 1, wherein the outer face of said encapsulation cap has at least two local hollowed-out recesses in the peripheral wall situated at corners of the encapsulation cap. ### Claim 6 (depends on 1) The package according to claim 1, wherein the outer face of said encapsulation cap is situated beyond a peripheral edge of the support plate. ### Claim 7 (depends on 1) The package according to claim 1, wherein a front face of the electronic integrated circuit chip has at least one optical member and the front wall of the encapsulation cap has a through passage provided with an optical element capable of being passed through by light. ### Claim 8 A method for fabricating a package which includes a support plate, an encapsulation cap having a front wall and a peripheral wall with at least one local recess on an outer surface and at least one electronic integrated circuit chip, the method comprising the following steps: fixing said electronic integrated circuit chip onto a front face of said support plate; depositing a bead of glue over at least a part of a peripheral zone of said front face of the support plate; placing said encapsulation cap on top of the front face of said support plate in a position such that an end edge of said peripheral wall is placed at least partly on said bead of glue and at least one local point of said bead of glue is uncovered at said at least one local recess; locally hardening a first portion of the bead of glue by a first hardening process, said first portion positioned at the at least one local point where local recess is located; and hardening a second portion of the bead of glue different from the first portion by a second hardening process that is performed after completion of the first hardening process. ### Claim 9 (depends on 8) The method according to claim 8, wherein a peripheral face of the encapsulation cap includes said at least one local recess extending from said end edge. ### Claim 10 (depends on 8) The method according to claim 8, wherein said glue is configured for hardening under an effect of a light radiation and is configured for hardening under an effect of a heat application. ### Claim 11 (depends on 10) The method of claim 10, wherein the first hardening process is light radiation and the second hardening process is heat application. ### Claim 12 (depends on 11) The method of claim 11, wherein locally hardening comprises emitting the light radiation towards the at least one local point where local recess is located and wherein hardening comprises baking in an oven. ### Claim 13 (depends on 8) The method according to claim 8, wherein placing comprises using transfer and holding tool to position said encapsulation cap on top of said support plate. ### Claim 14 (depends on 13) The method according to claim 13, wherein said transfer and holding tool includes a hardening equipment configured for performing said locally hardening. ### Claim 15 A package, comprising: a support plate having a front face; an electronic integrated circuit chip mounted on the front face of the support plate; an encapsulation cap comprising a front wall extending in front of the electronic integrated circuit chip and a peripheral wall having an outer surface and having an end edge that extends parallel to the front face of the support plate, the support plate and the encapsulation cap delimiting at least one chamber in which the electronic integrated circuit chip is situated; a bead of glue inserted between said end edge of the peripheral wall of the encapsulation cap and the front face of the support plate; wherein a first portion of the end edge of the peripheral wall has a first thickness and wherein a second portion of the end edge of the peripheral wall has a second thickness that is less than the first thickness, said second thickness defined by a local hollowed-out recess present in the outer surface of the peripheral wall, said local hollowed-out recess uncovering a local portion of the bead of glue. ### Claim 16 (depends on 15) The package according to claim 15, wherein said local hollowed-out recess extends over all of a height of the outer surface of said peripheral wall. ### Claim 17 (depends on 15) The package according to claim 15, wherein said local hollowed-out recess extends over only a part of a height of the outer surface of said peripheral wall. ### Claim 18 (depends on 15) The package according to claim 15, wherein the outer face of said encapsulation cap has at least two local hollowed-out recesses in the outer surface of said peripheral wall situated on opposite sides of the encapsulation cap from one another. ### Claim 19 (depends on 15) The package according to claim 15, wherein the outer face of said encapsulation cap has at least two local hollowed-out recesses in the outer surface of said peripheral wall situated at corners of the encapsulation cap. ### Claim 20 (depends on 15) The package according to claim 15, wherein the outer surface of said encapsulation cap is situated beyond a peripheral edge of the support plate. ### Claim 21 (depends on 15) The package according to claim 15, wherein a front face of the electronic integrated circuit chip has at least one optical member and the front wall of the encapsulation cap has a through passage provided with an optical element capable of being passed through by light.