# US 10,483,180 B2 · Process for the wafer-scale fabrication of hermetic electronic modules

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- Number: US 10,483,180 B2
- Document ID: US10483180B2
- Status: Granted
- Kind: B2
- Application number: 15/829,699
- Filed: 2017-12-01
- Published: 2018-06-28
- Granted: 2019-11-19
- Earliest claimed: 2016-12-27
- Assignees: Packaging Sip
- Applicants: Packaging Sip
- Inventors: Christian Val; Alexandre Val
- Web page: https://patentgrep.com/patent/US10483180B2

## CPC

- H10W 74/121: {by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation}
- H05K 3/4676: {Single layer compositions}
- H10W 42/20: protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
- H10W 42/276: {the arrangements being on an external surface of the package, e.g. on the outer surface of an encapsulation}
- H10W 70/69: Insulating materials thereof
- H10W 74/117: {the substrate having spherical bumps for external connection}
- H05K 1/036: {Multilayers with layers of different types}
- H05K 3/284: {for encapsulating mounted components (H05K1/185 takes precedence)}
- H05K 2201/0175: Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
- H05K 2201/0179: Thin film deposited insulating layer, e.g. inorganic layer for printed capacitor
- H05K 2203/1327: Moulding over PCB locally or completely
- H10W 70/635: {Through-vias}
- H10W 72/536: {the connected ends being ball-shaped}
- H10W 72/5363: {the connected ends being wedge-shaped}
- H10W 72/884: {Die-attach connectors and bond wires}
- H10W 74/00: Encapsulations, e.g. protective coatings
- H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts}
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

An electronic module including one or more electronic components that are electrically connected to a multilayer PCB circuit comprises, on one face, electrical connection balls for the external electrical connection of the electronic module. The PCB circuit comprises a hermetically protective electrically insulating inorganic inner layer, and the module comprises six faces with an electrically insulating or conductive inorganic hermetic protection layer on the five faces other than that formed by the PCB circuit.

## Claims

### Claim 1

An electronic module comprising:
a multilayer PCB circuit that comprises:
on one face, electrical connection balls for external electrical connection of the electronic module; and
a hermetically protective electrically insulating inorganic inner layer;
an electrically insulating or conductive inorganic hermetic protection layer;
one or more electronic components that are electrically connected to the PCB circuit; and
six faces with the electrically insulating or conductive inorganic hermetic protection layer entirely covering the five faces other than that formed by the PCB circuit, wherein
the hermetically protective electrically insulating inorganic inner layer is in direct contact with the electrically insulating or conductive inorganic hermetic protection layer so as to form a continuous hermetical joint around the one or more electronic components.

### Claim 2 (depends on 1)

The electronic module according to claim 1, wherein the one or more electronic components are encapsulated on one face of the PCB circuit opposite the face with the connection balls.

### Claim 3 (depends on 2)

The electronic module according to claim 2, wherein the encapsulated electronic components are distributed over multiple levels in order to form a stack on the PCB circuit and thus to obtain a 3D electronic module.

### Claim 4 (depends on 1)

The electronic module according to claim 1, wherein the PCB circuit includes one or more electronic components that are incorporated within the PCB circuit.

### Claim 5 (depends on 1)

The electronic module according to claim 1, wherein the PCB circuit comprises another hermetically protective electrically insulating inorganic inner layer.

### Claim 6 (depends on 1)

The electronic module according to claim 1, wherein the electronic components are active components and/or passive components and/or MEMS.