# US 10,483,175 B2 · Power semiconductor device

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- Number: US 10,483,175 B2
- Document ID: US10483175B2
- Status: Granted
- Kind: B2
- Application number: 15/758,349
- Filed: 2015-12-04
- Published: 2018-09-13
- Granted: 2019-11-19
- Earliest claimed: 2015-12-04
- Assignees: Mitsubishi Electric Corporation
- Applicants: Mitsubishi Electric Corporation
- Inventors: Shoko Araki; Yukimasa Hayashida; Ryutaro Date
- Web page: https://patentgrep.com/patent/US10483175B2

## CPC

- H10W 76/12: characterised by their shape
- H10W 76/15: Containers comprising an insulating or insulated base
- H05K 7/06: on insulating boards {, e.g. wiring harnesses (for printed circuits H05K1/18, H05K3/30)}
- H10W 72/00: Interconnections or connectors in packages
- H10W 90/00: Package configurations
- H10W 72/07551: {characterised by changes in properties of the bond wires during the connecting}
- H10W 72/50: Bond wires
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

An object of the present invention to provide a technique which can put flexibility into positions, positional relationships, and sizes of constituent elements. A power semiconductor device includes: a substrate on which a semiconductor chip is disposed; an electrode which has one end fixed to the substrate and stands upright on the substrate; and an insulating case which houses the electrode and has a part opposed to the other end of the electrode. The power semiconductor device includes a conductive nut which is inserted into the case in the part of the case and a conductive component which electrically connects the other end of the electrode and the nut.

## Claims

### Claim 1

A power semiconductor device, comprising:
a substrate on which a semiconductor chip is disposed;
an electrode which has one end fixed to the substrate and stands upright on the substrate;
an insulating case which houses the electrode and has a part opposed to another end of the electrode;
a conductive nut which is inserted into the case in the part of the case; and
a conductive component which directly connects the another end of the electrode and the nut, wherein
the conductive component connects to the another end of the electrode at a position on an inner-surface side of the insulating case.

### Claim 2

A power semiconductor device, comprising:
a substrate on which a semiconductor chip is disposed;
an electrode which has one end fixed to the substrate and stands upright on the substrate;
an insulating case which houses the electrode and has a part opposed to another end of the electrode;
a conductive nut which is inserted into the case in the part of the case; and
a conductive component which electrically connects the another end of the electrode and the nut, wherein
one end of the conductive component is connected to the another end of the electrode, and
another end of the conductive component is attached to the nut only partway.

### Claim 3 (depends on 2)

The power semiconductor device according to claim 2, wherein
the conductive component includes a stud bolt, a bolt, or a banana plug.

### Claim 4 (depends on 1)

The power semiconductor device according to claim 1, wherein
the conductive component includes a bolt for being connected to an external wiring, in which a head is disposed on an outer side of the case, a middle portion is inserted into the nut, and a screw point is connected to the another end of the electrode.

### Claim 5 (depends on 4)

The power semiconductor device according to claim 4, wherein
an elastic portion is provided on the another end of the electrode, and
the screw point of the bolt is connected to the elastic portion of the electrode.

### Claim 6

A power semiconductor device, comprising:
a substrate on which a semiconductor chip is disposed;
an electrode which has one end fixed to the substrate and stands upright on the substrate;
an insulating case which houses the electrode and has a part opposed to another end of the electrode;
a conductive nut which is inserted into the case in the part of the case; and
a conductive component which electrically connects the another end of the electrode and the nut, wherein
the nut protrudes from an outer surface of the case, and protrudes through an inner surface of the case.

### Claim 7 (depends on 1)

The power semiconductor device according to claim 1, wherein
the semiconductor chip is made of silicon carbide.