# US 10,483,159 B2 · Multi-metal fill with self-align patterning

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- Number: US 10,483,159 B2
- Document ID: US10483159B2
- Status: Granted
- Kind: B2
- Application number: 16/010,007
- Filed: 2018-06-15
- Published: 2018-10-25
- Granted: 2019-11-19
- Earliest claimed: 2016-12-12
- Assignees: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicants: Taiwan Semiconductor Manufacturing Co., Ltd.
- Inventors: Wei-Chen Chu; Tai-I Yang; Cheng-Chi Chuang; Chia-Tien Wu
- Web page: https://patentgrep.com/patent/US10483159B2

## CPC

- H10W 20/089: {using processes for implementing desired shapes or dispositions of the openings, e.g. double patterning}
- H10P 50/283: {by chemical means}
- H10P 50/73: {using masks for insulating materials}
- H10W 20/087: {involving multiple stacked pre-patterned masks}
- H10W 20/088: {involving partial etching of via holes}
- H10W 20/438: {Interconnections with multiple fill metals, e.g. having different metals in wide and narrow interconnections, or having different metals in vias and in trenches}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10

## Abstract

The present disclosure describes methods which employ a patterning photolithography/etch operations to form self-aligned interconnects with multi-metal gap fill. For example, the method includes a first pattern structure and a second pattern structure formed over a dielectric layer. Each of the first and second pattern structures includes a pair of spacers, and a center portion between the pair of spacers. A first opening, self-aligned to a space between the first and second pattern structures, is formed in the dielectric layer. A first conductive material is deposited in the first opening. The center portion of the second pattern structure is removed to form a void above the dielectric layer and between the pair of spacers of the second pattern structure. A second opening, self-aligned to the void, is formed in the dielectric layer; and a second conductive material is deposited in the second opening.

## Claims

### Claim 1

A semiconductor device, comprising:
a substrate with a metallization layer;
a dielectric layer formed over the metallization layer;
first conductive structures formed of a first conductive material and embedded in the dielectric layer; and
second conductive structures formed of a second conductive material and embedded in the dielectric layer, wherein the first conductive material and the second conductive material are different from one another, the first and second conductive structures have an alternating arrangement, and the first and second conductive structures have coplanar top surfaces with the dielectric layer.

### Claim 2 (depends on 1)

The semiconductor device of claim 1, wherein the metallization layer is a back-end-of-line (BEOL) layer.

### Claim 3 (depends on 2)

The semiconductor device of claim 2, wherein at least one of the first and second conductive structures are in physical contact with conductive structures in the metallization layer.

### Claim 4 (depends on 1)

The semiconductor device of claim 1, wherein at least one of the first and second conductive structures comprise vias passing through the dielectric layer.

### Claim 5 (depends on 1)

The semiconductor device of claim 1, wherein at least one of the first and second conductive structures comprise lateral lines within the dielectric layer.

### Claim 6 (depends on 1)

The semiconductor device of claim 1, wherein the first and second conductive materials comprise cobalt or graphene.

### Claim 7 (depends on 1)

The semiconductor device of claim 1, wherein the alternating arrangement of the first and second conductive structures comprises a repetitive pattern of a first conductive structure with a second conductive structure so that the first conductive structure is disposed between a pair of second conductive structures and the second conductive structure is disposed between a pair of first conductive structures.

### Claim 8

A semiconductor device, comprising:
a first interconnect layer formed over a substrate, wherein the first interconnect layer comprises a first conductive structure formed of a first conductive material;
a second interconnect layer over the first interconnect layer, wherein the second interconnect layer comprises:
a second conductive structure formed of a second conductive material; and
a third conductive structure formed of a third conductive material, wherein the second and third conductive materials are different from one another, and wherein the second and third conductive structures have an alternating arrangement and coplanar top surfaces.

### Claim 9 (depends on 8)

The semiconductor device of claim 8, wherein the first interconnect layer comprises vertical and lateral conductive structures embedded in a dielectric material.

### Claim 10 (depends on 8)

The semiconductor device of claim 8, wherein the second and third conductive structures comprise vertical and lateral conductive structures in a dielectric material with a top surface coplanar with the top surfaces of the second and third conductive structures.

### Claim 11 (depends on 10)

The semiconductor device of claim 10, wherein the dielectric material comprises a low-k dielectric material.

### Claim 12 (depends on 10)

The semiconductor device of claim 10, wherein the vertical conductive structures electrically connect to the first interconnect layer.

### Claim 13 (depends on 10)

The semiconductor device of claim 10, wherein each of the vertical conductive structures from the second and third conductive structures have a first height and each of the lateral conductive structures from the second and third conductive structures have a second height different from the first height.

### Claim 14 (depends on 8)

The semiconductor device of claim 8, wherein each of the second and third conductive materials comprises graphene or cobalt.

### Claim 15

A semiconductor device, comprising:
a first interconnect layer formed over a substrate; and
a second interconnect layer disposed over the first interconnect layer; wherein the second interconnect layer comprises conductive structures formed of first and second conductive materials different from each other, wherein the conductive structures with the first and second conductive materials have an alternating arrangement and aligned top surfaces.

### Claim 16 (depends on 15)

The semiconductor device of claim 15, wherein the first conductive material comprises cobalt or graphene and the second conductive material comprises copper.

### Claim 17 (depends on 15)

The semiconductor device of claim 15, wherein the second conductive material comprises cobalt or graphene and the first conductive material comprises copper.

### Claim 18 (depends on 15)

The semiconductor device of claim 15, wherein each of the first and second conductive materials comprises cobalt or graphene.

### Claim 19 (depends on 15)

The semiconductor device of claim 15, wherein the second interconnect layer comprises a low-k interlayer dielectric that surrounds the conductive structures and has a top surface aligned with the top surfaces of the conductive structures.

### Claim 20 (depends on 15)

The semiconductor device of claim 15, wherein the substrate comprises one or more metal layers.