# US 10,483,152 B2 · High resistivity semiconductor-on-insulator wafer and a method of manufacturing

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- Number: US 10,483,152 B2
- Document ID: US10483152B2
- Status: Granted
- Kind: B2
- Application number: 15/526,640
- Filed: 2015-11-16
- Published: 2017-11-02
- Granted: 2019-11-19
- Earliest claimed: 2014-11-18
- Assignees: GlobalWafers Co., Ltd.
- Applicants: SunEdison Semiconductor Limited (UEN201334164H)
- Inventors: Igor Peidous; Lu Fei; Jeffrey L. Libbert; Andrew M. Jones; Alex Usenko; Gang Wang; Shawn George Thomas; Srikanth Kommu
- Web page: https://patentgrep.com/patent/US10483152B2

## CPC

- H10P 90/1916: {with separation or delamination along an ion implanted layer, e.g. Smart-cut}
- H10P 90/1918: {including charge trapping layers, e.g. polycrystalline materials}
- H10W 10/181: {Semiconductor-on-insulator [SOI] isolation regions, e.g. buried oxide regions of SOI wafers}
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A semiconductor on insulator multilayer structure is provided. The multilayer comprises a high resistivity single crystal semiconductor handle substrate, an optionally relaxed semiconductor layer comprising silicon, germanium, or silicon germanium, an optional polycrystalline silicon layer, a dielectric layer, and a single crystal semiconductor device layer.

## Claims

### Claim 1

A multilayer structure comprising:
a single crystal semiconductor handle substrate comprising two major, generally parallel surfaces, one of which is a front surface of the single crystal semiconductor handle substrate and the other of which is a back surface of the single crystal semiconductor handle substrate, a circumferential edge joining the front and back surfaces of the single crystal semiconductor handle substrate, a central plane between the front surface and the back surface of the single crystal semiconductor handle substrate, and a bulk region between the front and back surfaces of the single crystal semiconductor handle substrate, wherein the single crystal semiconductor handle substrate has a minimum bulk region resistivity of at least about 3000 ohm-cm;
a relaxed semiconductor layer comprising germanium in a molar percent of germanium of at least 20 molar %, the relaxed semiconductor layer in interfacial contact with the front surface of the single crystal semiconductor handle substrate;
a charge trapping layer comprising a polycrystalline silicon layer in interfacial contact with the relaxed semiconductor layer, wherein the charge trapping layer has a resistivity of at least about 1000 ohm-cm;
a dielectric layer in interfacial contact with the charge trapping player comprising the polycrystalline silicon layer; and
a single crystal semiconductor device layer in interfacial contact with the dielectric layer.

### Claim 2 (depends on 1)

The multilayer structure of claim 1 wherein the single crystal semiconductor handle substrate comprises a single crystal silicon wafer, which has a bulk resistivity between about 3000 Ohm-cm and about 100,000 Ohm-cm.

### Claim 3 (depends on 1)

The multilayer structure of claim 1 wherein the single crystal semiconductor handle substrate has a bulk resistivity between about 3000 Ohm-cm and about 5,000 Ohm-cm.

### Claim 4 (depends on 1)

The multilayer structure of claim 1 wherein the relaxed semiconductor layer comprises silicon germanium, wherein the molar percent of germanium is at least 50 molar %.

### Claim 5 (depends on 1)

The multilayer structure of claim 1 wherein the relaxed semiconductor layer comprises silicon germanium, wherein the molar percent of germanium is at least 90 molar %.

### Claim 6 (depends on 1)

The multilayer structure of claim 1 wherein the relaxed semiconductor layer comprises silicon germanium, wherein the molar percent of germanium is at least 99.9 molar %.

### Claim 7 (depends on 1)

The multilayer structure of claim 1 wherein the relaxed semiconductor layer is thicker than a critical thickness.

### Claim 8 (depends on 1)

The multilayer structure of claim 1 wherein the average thickness of the relaxed semiconductor layer is at least about 10 nanometers.

### Claim 9 (depends on 1)

The multilayer structure of claim 1 wherein the average thickness of the relaxed semiconductor layer is between about 10 nanometers and about 3000 nanometers.

### Claim 10 (depends on 1)

The multilayer structure of claim 1 wherein the dielectric layer comprises a material selected from the group consisting of silicon dioxide, silicon nitride, hafnium oxide, titanium oxide, zirconium oxide, lanthanum oxide, barium oxide, and a combination thereof.

### Claim 11 (depends on 1)

The multilayer structure of claim 1 wherein the dielectric layer comprises a buried oxide layer having a thickness of at least about 10 nanometer thick, such as between about 10 nanometers and about 10,000 nanometers, between about 10 nanometers and about 5,000 nanometers, or between about 100 nanometers and about 400 nanometers.

### Claim 12 (depends on 1)

The multilayer structure of claim 1 wherein the dielectric layer comprises silicon dioxide.

### Claim 13 (depends on 12)

The multilayer structure of claim 12 wherein the silicon dioxide has a thickness of at least about 10 nanometer thick, such as between about 10 nanometers and about 10,000 nanometers, between about 10 nanometers and about 5,000 nanometers, or between about 100 nanometers and about 400 nanometers.

### Claim 14 (depends on 1)

The multilayer structure of claim 1 wherein the relaxed semiconductor layer comprises dislocations selected from the group consisting of misfit dislocations, threading dislocations, and a combination thereof, wherein a concentration of dislocations is between 1×105/cm2 and 1×1010/cm2.

### Claim 15 (depends on 1)

The multilayer structure of claim 1 wherein the relaxed semiconductor layer comprises carbon in a concentration between 0.1 molar % and 5 molar %.

### Claim 16 (depends on 1)

The multilayer structure of claim 1 wherein the relaxed semiconductor layer comprises carbon in a concentration between 0.5 molar % and 15 molar %.

### Claim 17

A method of preparing a multilayer structure, the method comprising:
forming a semiconductor layer to be in interfacial contact with a front surface of a single crystal semiconductor handle substrate, the single crystal semiconductor handle substrate comprising two major, generally parallel surfaces, one of which is the front surface of the single crystal semiconductor handle substrate and the other of which is a back surface of the single crystal semiconductor handle substrate, a circumferential edge joining the front and back surfaces of the single crystal semiconductor handle substrate, a central plane between the front surface and the back surface of the single crystal semiconductor handle substrate, and a bulk region between the front and back surfaces of the single crystal semiconductor handle substrate, wherein the single crystal semiconductor handle substrate has a minimum bulk region resistivity of at least about 3000 ohm-cm, and further wherein the semiconductor layer comprises germanium in a molar percent of germanium of at least 20 molar %;
annealing the single crystal semiconductor handle substrate having the semiconductor layer in interfacial contact with the front surface of the single crystal semiconductor handle substrate for a temperature and a duration sufficient to at least partially relax the semiconductor layer, thereby forming a relaxed semiconductor layer;
forming a charge trapping layer comprising a polycrystalline silicon layer in interfacial contact with the relaxed semiconductor layer, wherein the charge trapping layer has a resistivity of at least about 1000 ohm-cm; and
bonding a dielectric layer on a front surface of a single crystal semiconductor donor substrate to the polycrystalline silicon layer of the single crystal semiconductor handle substrate to thereby form a bonded structure, wherein the single crystal semiconductor donor substrate comprises two major, generally parallel surfaces, one of which is the front surface of the semiconductor donor substrate and the other of which is a back surface of the semiconductor donor substrate, a circumferential edge joining the front and back surfaces of the semiconductor donor substrate, and a central plane between the front and back surfaces of the semiconductor donor substrate, and further wherein the front surface of the semiconductor donor substrate comprises the dielectric layer.

### Claim 18 (depends on 17)

The method of claim 17 wherein the single crystal semiconductor handle substrate comprises a single crystal silicon wafer, which has a bulk resistivity between about 3000 Ohm-cm and about 100,000 Ohm-cm.

### Claim 19 (depends on 17)

The method of claim 17 wherein the single crystal semiconductor handle substrate has a bulk resistivity between about 3000 Ohm-cm and about 5,000 Ohm-cm.

### Claim 20 (depends on 17)

The method of claim 17 wherein the relaxed semiconductor layer comprises silicon germanium, wherein the molar percent of germanium is at least 50 molar %.

### Claim 21 (depends on 17)

The method of claim 17 wherein the relaxed semiconductor layer comprises silicon germanium, wherein the molar percent of germanium is at least 90 molar %.

### Claim 22 (depends on 17)

The method of claim 17 wherein the relaxed semiconductor layer comprises silicon germanium, wherein the molar percent of germanium is at least 99.9 molar %.

### Claim 23 (depends on 17)

The method of claim 17 further comprising oxidizing the charge trapping layer comprising the polycrystalline silicon layer prior to bonding with the dielectric layer on a front surface of a single crystal semiconductor donor substrate.

### Claim 24 (depends on 17)

The method of claim 17 further comprising heating the bonded structure at a temperature and for a duration sufficient to strengthen the bond between the dielectric layer of the semiconductor donor structure and the charge trapping layer comprising the polycrystalline silicon layer on the front surface of the single semiconductor handle substrate.

### Claim 25 (depends on 17)

The method of claim 17 wherein the single crystal semiconductor donor substrate comprises an ion implanted damage layer and the method further comprises:
mechanically cleaving the bonded structure at the ion implanted damage layer of the single crystal semiconductor donor substrate to thereby prepare a cleaved structure comprising the single crystal semiconductor handle substrate, the relaxed semiconductor layer, the charge trapping layer comprising the polycrystalline silicon layer in contact with the relaxed semiconductor layer, the dielectric layer, and a single crystal semiconductor device layer in contact with the dielectric layer; and
heating the cleaved structure at a temperature and for a duration sufficient to strengthen the bond between the single crystal semiconductor device layer and the single crystal semiconductor handle substrate.

### Claim 26 (depends on 17)

The method of claim 17 wherein the relaxed semiconductor layer comprises dislocations selected from the group consisting of misfit dislocations, threading dislocations, and a combination thereof, wherein a concentration of dislocations is between 1×105/cm2 and 1×1010/cm2.

### Claim 27 (depends on 17)

The method of claim 17 wherein the relaxed semiconductor layer comprises carbon in a concentration between 0.1 molar % and 5 molar %.

### Claim 28 (depends on 17)

The method of claim 17 wherein the relaxed semiconductor layer comprises carbon in a concentration between 0.5 molar % and 15 molar %.