# US 10,483,131 B2 · Electronic-device-protecting film, electronic-device-protecting member, method for manufacturing electronic device, and method for manufacturing package

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- Number: US 10,483,131 B2
- Document ID: US10483131B2
- Status: Granted
- Kind: B2
- Application number: 15/578,876
- Filed: 2016-06-08
- Published: 2018-06-07
- Granted: 2019-11-19
- Earliest claimed: 2015-06-11
- Assignees: Mitsui Chemicals Tohcello, Inc.
- Applicants: Mitsui Chemicals Tohcello, Inc.
- Inventors: Eiji Hayashishita
- Web page: https://patentgrep.com/patent/US10483131B2

## CPC

- H10W 74/01: Manufacture or treatment
- B32B 27/04: as impregnant, bonding, or embedding substance {(not used)}
- B32B 27/08: of synthetic resin
- B32B 27/281: {comprising polyimides}
- B32B 27/283: {comprising polysiloxanes}
- B32B 27/308: {comprising acrylic (co)polymers}
- B32B 27/36: comprising polyesters
- C09J 7/20: characterised by their carriers
- C09J 201/00: Adhesives based on unspecified macromolecular compounds
- H10W 74/111: {the semiconductor body being completely enclosed}
- B32B 2307/306: Resistant to heat
- B32B 2307/54: Yield strength; Tensile strength
- B32B 2405/00: Adhesive articles, e.g. adhesive tapes
- B32B 2457/14: Semiconductor wafers
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H)

## Abstract

Provided are an electronic-device-protecting film used when semiconductor parts obtained by segmentation are to be sealed in the form of an array using a sealant after the semiconductor parts are rearranged, wherein the curing temperature of the sealant does not need to be adjusted downward; an electronic-device-protecting member; a method for manufacturing an electronic device; and a method for manufacturing a package. The electronic-device-protecting film includes a base layer and an adhesive layer, and the method includes: bonding the adhesive layer to one surface of a frame having an opening, the adhesive layer being bonded so as to cover the opening; subsequently bonding a plurality of semiconductor parts to the surface of the adhesive layer that is exposed via the opening with the semiconductor parts set apart from each other; subsequently covering the semiconductor parts and the surface of the adhesive layer with a sealant; and heat-curing the sealant.

## Claims

### Claim 1

A method for manufacturing an electronic device comprising:
a film bonding step of bonding an adhesive layer of an electronic-device-protecting film to one surface of a frame having an opening, the adhesive layer being bonded so as to cover the opening;
a semiconductor-part bonding step of bonding a plurality of semiconductor parts to the surface of the adhesive layer that is exposed via the opening with the semiconductor parts set apart from each other;
a sealant-covering step of covering the semiconductor parts and the surface of the adhesive layer with a sealant; and
a heat-curing step of heat-curing the sealant to obtain an electronic device, wherein a side of a base layer of the electronic-device-protecting film is fixed by suction to a heated vacuum suction chuck table, in which the semiconductor parts are sealed in an array configuration, wherein
the electronic-device-protecting film includes the base layer and the adhesive layer, and
in the base layer, a thickness of the base layer is 15 μm or more and 50 μm or less, the ratio RE (=E′(160)/E′(50)) of the tensile elastic modulus E′(160) at 160° C. to the tensile elastic modulus E′(50) at 50° C. is such that 0.05<RE<1 and 1×108≤E′(50)≤1×1010.

### Claim 2 (depends on 1)

The method for manufacturing an electronic device according to claim 1, wherein the adhesive constituting the adhesive layer has the storage elastic modulus G′(150) at 150° C. of 1×104 to 500×104 Pa.

### Claim 3 (depends on 1)

The method for manufacturing an electronic device according to claim 1, wherein the adhesive layer has an adhesive force to a silicon wafer of 0.1 to 10 N/25 mm which is measured according to JIS K 0237.

### Claim 4 (depends on 1)

The method for manufacturing an electronic device according to claim 1, wherein the base layer includes one or two or more resins selected from the group consisting of polyimide, polyethylene naphthalate and polyethylene terephthalate.

### Claim 5 (depends on 1)

The method for manufacturing an electronic device according to claim 1 further comprising an interconnection-layer forming step of forming an interconnection layer on the electronic device in which the semiconductor parts are sealed in an array configuration.

### Claim 6 (depends on 1)

The method for manufacturing an electronic device according to claim 1 further comprising a segmenting step of separating, into segments, the electronic device in which the semiconductor parts are sealed in an array configuration on which the interconnection layer is formed.

### Claim 7 (depends on 6)

A method for manufacturing a package comprising a mounting step of mounting the electronic device according to claim 6 on a substrate.

### Claim 8

A method for manufacturing an electronic device comprising:
an electronic-device-protecting member forming step of forming an electronic-device-protecting member by bonding an adhesive layer of an electronic-device-protecting film to one surface of a frame having an opening, the adhesive layer being bonded so as to cover the opening;
a semiconductor-part bonding step of bonding a plurality of semiconductor parts to the surface of the adhesive layer that is exposed via the opening with the semiconductor parts set apart from each other;
a sealant-covering step of covering the semiconductor parts and the surface of the adhesive layer with a sealant; and
a heat-curing step of heat-curing the sealant to obtain an electronic device, wherein a side of a base layer of the electronic-device-protecting film is fixed by suction to a heated vacuum suction chuck table, in which the semiconductor parts are sealed in an array configuration, wherein
the electronic-device-protecting film includes the base layer and the adhesive layer, and
in the base layer, a thickness of the base layer is 15 μm or more and 50 μm or less, the ratio RE (=E′(160)/E′(50)) of the tensile elastic modulus E′(160) at 160° C. to the tensile elastic modulus E′(50) at 50° C. is such that 0.05<RE<1 and 1×108≤E′ (50)≤1×1010.

### Claim 9 (depends on 8)

The method for manufacturing an electronic device according to claim 8, wherein the adhesive constituting the adhesive layer has the storage elastic modulus G′(150) at 150° C. of 1×104 to 500×104 Pa.

### Claim 10 (depends on 8)

The method for manufacturing an electronic device according to claim 8, wherein the adhesive layer has an adhesive force to a silicon wafer of 0.1 to 10 N/25 mm which is measured according to JIS Z 0237.

### Claim 11 (depends on 8)

The method for manufacturing an electronic device according to claim 8, wherein the base layer includes one or two or more resins selected from the group consisting of polyimide, polyethylene naphthalate and polyethylene terephthalate.

### Claim 12 (depends on 8)

The method for manufacturing an electronic device according to claim 8 further comprising an interconnection-layer forming step of forming an interconnection layer on the electronic device in which the semiconductor parts are sealed in an array configuration.

### Claim 13 (depends on 8)

The method for manufacturing an electronic device according to claim 8 further comprising a segmenting step of separating, into segments, the electronic device in which the semiconductor parts are sealed in an array configuration on which the interconnection layer is formed.

### Claim 14 (depends on 13)

A method for manufacturing a package comprising a mounting step of mounting the electronic device according to claim 13 on a substrate.