# US 10,483,104 B2 · Method for producing stacked electrode and method for producing photoelectric conversion device

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- Number: US 10,483,104 B2
- Document ID: US10483104B2
- Status: Granted
- Kind: B2
- Application number: 14/874,569
- Filed: 2015-10-05
- Published: 2016-01-28
- Granted: 2019-11-19
- Earliest claimed: 2012-03-30
- Assignees: Kabushiki Kaisha Toshiba
- Applicants: Kabushiki Kaisha Toshiba
- Inventors: Katsuyuki Naito; Eishi Tsutsumi; Norihiro Yoshinaga; Yoshihiro Akasaka
- Web page: https://patentgrep.com/patent/US10483104B2

## CPC

- H10P 14/3462: {Nanowires}
- B82Y 10/00: Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
- C23C 16/06: characterised by the deposition of metallic material
- C23C 16/26: Deposition of carbon only
- H10D 64/205: {Nanosized electrodes, e.g. nanowire electrodes}
- H10F 10/167: comprising Group I-III-VI materials, e.g. CdS/CuInSe2 [CIS] heterojunction photovoltaic cells
- H10F 71/138: {Manufacture of transparent electrodes, e.g. transparent conductive oxides [TCO] or indium tin oxide [ITO] electrodes}
- H10F 77/244: {made of transparent conductive layers, e.g. transparent conductive oxide [TCO] layers}
- H10K 30/82: Transparent electrodes, e.g. indium tin oxide [ITO] electrodes
- B82Y 20/00: Nanooptics, e.g. quantum optics or photonic crystals
- B82Y 40/00: Manufacture or treatment of nanostructures
- H10K 85/20: Carbon compounds, e.g. carbon nanotubes or fullerenes
- Y02E 10/541: CuInSe2 material PV cells
- Y02E 10/549: Organic PV cells
- Y02P 70/50: Manufacturing or production processes characterised by the final manufactured product
- Y10S 977/755: Nanosheet or quantum barrier/well, i.e. layer structure having one dimension or thickness of 100 nm or less
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- B82Y: SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- C23C: COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion B21C23/22; covering with metal by connecting pre-existing layers to articles, see the relevant places, e.g. B21D39/00, B23K; metallising of glass C03C; metallising mortars, concrete, artificial stone, ceramics or natural stone C04B41/00; enamelling of, or applying a vitreous layer to, metals C23D; treating metal surfaces or coating of metals by electrolysis or electrophoresis C25D; single-crystal film growth C30B; by metallising textiles D06M11/83; decorating textiles by locally metallising D06Q1/04)
- H10D: INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10K: ORGANIC ELECTRIC SOLID-STATE DEVICES
- Y02E: REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y10S: TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS

## Abstract

A method for producing a stacked electrode of an embodiment includes preparing a multi-layered graphene film, applying a dispersion liquid of metal nanowires onto the multi-layered graphene film, and removing a solvent from the dispersion liquid to prepare a metal wiring on the multi-layered graphene film.

## Claims

### Claim 1

A method for producing a stacked electrode, comprising:
preparing a multi-layered graphene film directly on an insulating substrate;
applying a dispersion liquid of metal nanowires directly onto the multi-layered graphene film;
removing a solvent from the dispersion liquid to prepare a metal wiring on the multi-layered graphene film;
pressing the metal wiring to prepare a metal wiring on the multi-layered graphene filing and to strengthen the connection between the multi-layered graphene film and the metal nanowires;
forming a polymer directly on the multi-layered graphene film and the metal wiring to fill asperities of the metal nanowires, wherein the polymer covers the multi-layered graphene film and the metal wiring to obtain a stacked member including the insulating substrate, the multi-layered graphene film, the metal wire, and the polymer; and
cleaving a side of the stacked member where the multi-layered graphene and the insulating substrate are in direct contact and obtaining the stacked electrode including the multi-layered graphene film, the metal wire, and the polymer.

### Claim 2 (depends on 1)

The method according to claim 1, wherein the metal nanowires contain silver, gold, or copper.

### Claim 3 (depends on 1)

The method according to claim 1, wherein a thickness of the multi-layered graphene film is between 0.6 nm and 0.5 nm.

### Claim 4 (depends on 1)

The method according to claim 1, wherein the preparing of the multi-layered graphene film includes partially substituting carbon atoms of the multi-layered graphene film with nitrogen or boron.

### Claim 5 (depends on 1)

The method according to claim 1, wherein the preparing of the multi-layered graphene film includes applying a graphene oxide and reducing the graphene oxide to prepare the multi-layered graphene film on the insulating substrate.

### Claim 6 (depends on 1)

The method according to claim 1, wherein the preparing of the multi-layered graphene film includes transferring a graphene formed by a CVD process to prepare the multi-layered graphene film.

### Claim 7 (depends on 1)

The method according to claim 1, wherein the polymer is a conductive polymer.

### Claim 8 (depends on 1)

The method according to claim 1, wherein the polymer contains a graphene oxide.

### Claim 9 (depends on 1)

The method according to claim 1, wherein the polymer is a near-infrared transmission polymer.

### Claim 10 (depends on 1)

The method according to claim 1, wherein the insulating substrate is a polymer substrate, a resin substrate or glass.

### Claim 11 (depends on 1)

The method according to claim 1, wherein the insulating substrate is a polymer substrate or a resin substrate.

### Claim 12 (depends on 1)

The method according to claim 1, wherein the metal wiring formed from the dispersion liquid of the metal nanowires is a plurality of patterned strips, and
each of the patterned strips includes the metal nanowires.

### Claim 13 (depends on 1)

The method according to claim 1, wherein the metal nanowires are randomly oriented, and
the randomly oriented metal nanowires have a mesh structure.

### Claim 14 (depends on 1)

The method according to claim 1, wherein the stacked electrode consists of the multi-layered graphene film, the metal wire, and the polymer.

### Claim 15

A method for producing a photoelectric conversion device including, as constituents, a stacked electrode, a counter electrode facing the stacked electrode, and a photoelectric conversion layer interposed between the stacked electrode and the counter electrode, wherein
a method for producing the stacked electrode is the method for producing a stacked electrode comprising:
preparing a multi-layered graphene film directly on an insulating substrate;
applying a dispersion liquid of metal nanowires directly onto the multi-layered graphene film;
removing a solvent from the dispersion liquid to prepare a metal wiring on the multi-layered graphene film;
pressing the metal wiring to prepare a metal wiring on the multi-layered graphene film and to strengthen the connection between the multi-layered graphene film and the metal nanowires;
forming a polymer directly on the multi-layered graphene film and the metal wiring to fill asperities of the metal nanowires, wherein the polymer covers the multi-layered graphene film and the metal wiring to obtain a stacked member including the insulating substrate, the multi-layered graphene film, the metal wire, and the polymer, the multi-layered graphene being disposed between the insulating substrate and the metal wiring; and
cleaving a side where the multi-layered graphene and the insulating substrate are in direct contact and obtaining the stacked electrode including the multi-layered graphene film, the metal wire, and the polymer.

### Claim 16 (depends on 15)

The method according to claim 15, wherein the photoelectric conversion layer is produced by coating.

### Claim 17 (depends on 15)

The method according to claim 15, wherein the stacked electrode is pasted to the upper portion of the photoelectric conversion layer by a dry lamination.

### Claim 18 (depends on 15)

The method according to claim 15, wherein the photoelectric conversion layer is prepared on the stacked electrode.

### Claim 19 (depends on 15)

The method according to claim 15, wherein the counter electrode is an electrode obtained by stacking an ITO and a silver alloy.

### Claim 20 (depends on 15)

The method according to claim 15, wherein the counter electrode is a metal foil.

### Claim 21 (depends on 15)

The method according to claim 15, wherein the stacked electrode consists of the multi-layered graphene film, the metal wire, and the polymer.
