# US 10,483,098 B2 · Display apparatus and method of manufacturing the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,483,098 B2 - Document ID: US10483098B2 - Status: Granted - Kind: B2 - Application number: 15/585,357 - Filed: 2017-05-03 - Published: 2017-11-09 - Granted: 2019-11-19 - Earliest claimed: 2016-05-03 - Assignees: Samsung Display Co., Ltd. - Applicants: Samsung Display Co., Ltd. - Inventors: Dongbin Um; Jihong Hwang; Hayoung Choi - Web page: https://patentgrep.com/patent/US10483098B2 ## CPC - G02F 1/133305: {Flexible substrates, e.g. plastics, organic film} - G02F 1/133345: {Insulating layers (G02F1/1335, G02F1/1337, G02F1/135, G02F1/136 take precedence)} - G02F 1/13454: {Drivers integrated on the active matrix substrate (G02F1/136277 takes precedence)} - H10D 86/0212: {comprising manufacture, treatment or coating of substrates} - H10D 86/411: {characterised by materials, geometry or structure of the substrates} - H10D 86/60: wherein the TFTs are in active matrices - G02F 2201/50: Protective arrangements - G02F 2202/28: Adhesive materials or arrangements - Y02E 10/549: Organic PV cells - Y02P 70/50: Manufacturing or production processes characterised by the final manufactured product - G02F: OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS - H10D: INORGANIC ELECTRIC SEMICONDUCTOR DEVICES - Y02E: REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION - Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS ## Abstract A method of manufacturing a display apparatus is provided as follows. A substrate having a display portion on an upper surface of the substrate is prepared. A protection film having an opening is attached to a lower surface of the substrate so that the protection film overlaps the display portion. A support film is attached to the lower surface so that the support film is disposed within the opening of the protection film. A driving circuit chip is attached to the upper surface so that the driving chip is spaced apart from the display portion and the opening. At least a part of the support film is removed. The substrate is bent along a longitudinal direction of the opening. ## Claims ### Claim 1 A method of manufacturing a display apparatus, the method comprising: preparing a substrate having a display portion on an upper surface of the substrate; attaching a protection film having an opening to a lower surface of the substrate so that the protection film overlaps the display portion; attaching a support film to the lower surface so that the support film is disposed within the opening of the protection film, wherein the support film is spaced apart from the protection film before the support film is attached to the lower surface; attaching a driving circuit chip to the upper surface so that the driving circuit chip is spaced apart from the display portion and the opening; removing at least a part of the support film; and bending the substrate along a longitudinal direction of the opening. ### Claim 2 (depends on 1) The method of claim 1, wherein the removing of the at least a part of the support film is performed after the attaching of the driving circuit chip is performed. ### Claim 3 (depends on 1) The method of claim 1, wherein the support film comprises a support film base and an adhesive layer, wherein the adhesive layer is interposed between the substrate and the support film base, and wherein the removing of the at least a part of the support film comprises: removing the support film base so that the adhesive layer remains attached to the lower surface of the substrate. ### Claim 4 (depends on 1) The method of claim 1, further comprising: forming a preparatory protection film on a lower film; cutting the preparatory protection film into the protection film and the support film, wherein the cutting of the preparatory protection film is performed before the attaching of protection film and attaching of the support film. ### Claim 5 (depends on 1) The method of claim 1, wherein the support film comprises a different material from a material of the protection film. ### Claim 6 (depends on 1) The method of claim 1, wherein a surface of the support film attached to the substrate is concave toward the substrate. ### Claim 7 (depends on 1) The method of claim 1, further comprising: forming a bending protection layer on the upper surface of the substrate so that the bending protection layer overlaps the opening. ### Claim 8 (depends on 1) The method of claim 1, further comprising: applying a liquid phase filler in the opening after the removing of the support film; and hardening the liquid phase filler after the bending of the substrate. ### Claim 9 (depends on 1) The method of claim 1, further comprising: filling at least partially a filler in the opening before the bending of the substrate. ### Claim 10 (depends on 1) The method of claim 1, wherein an area of the support film is smaller than an area of the opening. ### Claim 11 (depends on 1) The method of claim 1, wherein the protection film comprises a protection film base and a first adhesive layer, wherein the support film comprises a support film base and a second adhesive layer, and wherein the protection film base and the support film base are respectively attached to the lower surface of the substrate via the first adhesive layer and the second adhesive layer. ### Claim 12 (depends on 1) The method of claim 1, further comprising: forming a cushion layer on the protection film after the bending of the substrate, wherein an upper surface of the cushion layer is in contact with a first portion of the protection film and a lower surface of the cushion layer is in contact with a second portion of the protection film, and wherein the bending of the substrate is performed to the extent that the first and second portions face each other. ### Claim 13 (depends on 1) The method of claim 1, wherein the attaching of the protection film and the attaching of the support film are performed at substantially the same time. ### Claim 14 A method of manufacturing a display apparatus, the method comprising: preparing a substrate having a display portion on an upper surface of the substrate; attaching a protection film having an opening to a lower surface of the substrate so that the protection film overlaps the display portion, wherein the protection film comprises a protection film base and a first adhesive layer; attaching a support film to the lower surface so that the support film is disposed within the opening of the protection film, wherein the support film comprises a support film base and a second adhesive layer; attaching a driving circuit chip to the upper surface of the substrate so that the driving circuit chip is spaced apart from the display portion and the opening; removing the support film to expose the second adhesive layer so that the second adhesive layer is exposed through the opening of the protection film; bending the substrate along a longitudinal direction of the opening so that the substrate has a curved surface overlapping the opening of the protection film; and performing a first hardening process on the exposed second adhesive layer. ### Claim 15 (depends on 14) The method of claim 14, wherein the first hardening process is performed so that the second adhesive layer has a hardness to the extent that the second adhesive layer after the first hardening process is performed prevents the substrate from losing the curved surface. ### Claim 16 (depends on 14) The method of claim 14, wherein the substrate further comprises an inorganic insulating layer, a first conductive layer and an organic material layer stacked on each other to form a stacked structure, and wherein before the removing of the support film is performed, the stacked structure overlaps the support film disposed within the opening of the protection film. ### Claim 17 (depends on 14) The method of claim 14, wherein the first hardening process includes irradiation of a laser, irradiation of an UV ray or a heat treatment process. ### Claim 18 (depends on 16) The method of claim 16, further comprising: forming a groove in the inorganic insulating layer, wherein the organic material layer fills the groove of the inorganic insulating layer. ### Claim 19 (depends on 14) The method of claim 14, further comprising: forming a filler on the curved surface of the substrate, wherein the filler is in contact with the second adhesive layer, and wherein the filler is hardened by a second hardening process. ### Claim 20 A method of manufacturing a display apparatus, the method comprising: preparing a substrate having a display portion on an upper surface of the substrate; attaching a protection film having an opening to a lower surface of the substrate so that the protection film overlaps the display portion; attaching a driving circuit chip to the upper surface so that the driving circuit chip is spaced apart from the display portion and the opening; applying a liquid phase filler in the opening, wherein the liquid phase filler extends across the opening in a first direction; and bending the substrate along a longitudinal direction of the opening substantially perpendicular to the first direction. ### Claim 21 (depends on 20) The method of claim 20, further comprising: hardening the liquid phase filler after the bending of the substrate.