# US 10,483,040 B1 · Electronic component

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 10,483,040 B1
- Document ID: US10483040B1
- Status: Granted
- Kind: B1
- Application number: 16/198,038
- Filed: 2018-11-21
- Granted: 2019-11-19
- Earliest claimed: 2018-09-14
- Assignees: Samsung Electro-Mechanics Co., Ltd.
- Applicants: Samsung Electro-Mechanics Co., Ltd.
- Inventors: Ho Yoon Kim; Sang Soo Park; Woo Chul Shin
- Web page: https://patentgrep.com/patent/US10483040B1

## CPC

- H01G 2/06: specially adapted for mounting on a printed-circuit support
- H01G 4/232: electrically connecting two or more layers of a stacked or rolled capacitor
- H01G 4/40: Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
- H05K 1/181: associated with surface mounted components
- H01G 4/30: Stacked capacitors (H01G4/33 takes precedence)
- H05K 3/3442: {having edge contacts, e.g. leadless chip capacitors, chip carriers}
- H05K 2201/049: PCB for one component, e.g. for mounting onto mother PCB
- H05K 2201/10015: Non-printed capacitor
- H05K 2201/10378: Interposers
- H05K 2201/10636: Leadless chip, e.g. chip capacitor or resistor
- Y02P 70/50: Manufacturing or production processes characterised by the final manufactured product
- H01G: CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric H01B3/00; capacitors having potential barriers H10D1/62, H10K10/10)
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS

## Abstract

An electronic component includes: a multilayer ceramic capacitor including a capacitor body and a pair of external electrodes, and an interposer including an interposer body having grooves and a pair of external terminals. Each of the external terminals includes a bonding portion, a mounting portion and a connection portion; and ΔL=|A−A′|/2 in which A is a distance from one end portion of the interposer in a length direction to one end portion of the multilayer ceramic capacitor in the length direction, A′ is a distance from the other end portion of the interposer in the length direction to the other end portion of the multilayer ceramic capacitor in the length direction, and ΔL is an offset between the multilayer ceramic capacitor and the interposer in the length direction, and ΔL/L≤0.100 in which L is a length of the multilayer ceramic capacitor.

## Claims

### Claim 1

An electronic component comprising:
a multilayer ceramic capacitor including a capacitor body and a pair of external electrodes disposed on opposite ends of the capacitor body, respectively; and
an interposer including an interposer body having grooves in opposite surfaces thereof, respectively, and a pair of external terminals disposed at opposite ends of the interposer body, respectively,
wherein each of the external terminals includes a bonding portion disposed on an upper surface of the interposer body and connected to a respective one of the external electrodes, a mounting portion disposed on a lower surface of the interposer body, and a connection portion disposed on a respective one of the grooves of the interposer body to connect the bonding portion and the mounting portion to each other, and
ΔL/L≤0.100 in which L is a length of the multilayer ceramic capacitor and ΔL=|A−A′|/2, where A is a distance from one end portion of the interposer in a length direction to one end portion of the multilayer ceramic capacitor in the length direction, and A′ is a distance from the other end portion of the interposer in the length direction to the other end portion of the multilayer ceramic capacitor in the length direction.

### Claim 2 (depends on 1)

The electronic component of claim 1, wherein the multilayer ceramic capacitor has a length of 0.8 mm or less and a width of 0.4 mm or less.

### Claim 3 (depends on 1)

The electronic component of claim 1, wherein the multilayer ceramic capacitor has a thickness of 0.7 mm or less.

### Claim 4 (depends on 1)

The electronic component of claim 1, further comprising conductive adhesive portions disposed between the external electrodes and the external terminals, respectively.

### Claim 5 (depends on 1)

The electronic component of claim 1, wherein the interposer body is formed of an insulator.

### Claim 6 (depends on 1)

The electronic component of claim 1, wherein the capacitor body has first and second surfaces opposing each other, third and fourth surfaces connected to the first and second surfaces and opposing each other, and fifth and sixth surfaces connected to the first and second surfaces, connected to the third and fourth surfaces, and opposing each other, and includes a plurality of dielectric layers and a plurality of first and second internal electrodes alternately arranged in a direction connecting the first and second surfaces to each other with each of the dielectric layers interposed therebetween, and
ends of the first and second internal electrodes are exposed through the third and fourth surfaces, respectively, to be connected to the pair of external electrodes, respectively.

### Claim 7 (depends on 6)

The electronic component of claim 6, wherein the external electrodes include:
head portions disposed on the third and fourth surfaces of the capacitor body, respectively, and connected to the ends of the first and second internal electrodes, respectively; and
band portions extending from the head portions onto portions of the first surface of the capacitor body and connected to the bonding portions of the external terminals, respectively.

### Claim 8 (depends on 7)

The electronic component of claim 7, wherein Lc≤Li in which Lc is a distance in the length direction between centers of the band portions of the external electrodes, and Li is a shortest distance in the length direction between the connection portions disposed on the grooves in the opposite surfaces of the interposer body.

### Claim 9 (depends on 1)

The electronic component of claim 1, further comprising plating layers disposed on surfaces of the external electrode and the external terminal, respectively.

### Claim 10 (depends on 1)

The electronic component of claim 1, wherein the interposer having a length and a width smaller than a length and a width of the multilayer ceramic capacitor, respectively.

### Claim 11 (depends on 1)

The electronic component of claim 1, wherein the interposer having a width greater than a width of the multilayer ceramic capacitor.

### Claim 12

An electronic component comprising:
a multilayer ceramic capacitor including a capacitor body and a pair of external electrodes disposed on opposite ends of the capacitor body, respectively; and
an interposer including an interposer body having grooves in opposite surfaces thereof, respectively, and a pair of external terminals disposed at opposite ends of the interposer body, respectively,
wherein each of the external terminals includes a bonding portion disposed on an upper surface of the interposer body and connected to a respective one of the external electrodes, a mounting portion disposed on a lower surface of the interposer body, and a connection portion disposed on a respective one of the grooves of the interposer body to connect the bonding portion and the mounting portion to each other, and
ΔW/W≤0.167 in which W is a width of the multilayer ceramic capacitor and ΔW=|B−B′|/2, where B is a distance from one end portion of the interposer in a width direction to one end portion of the multilayer ceramic capacitor in the width direction, and B′ is a distance from the other end portion of the interposer in the width direction to the other end portion of the multilayer ceramic capacitor in the width direction.

### Claim 13 (depends on 12)

The electronic component of claim 12, wherein the multilayer ceramic capacitor has a length of 0.8 mm or less and a width of 0.4 mm or less.

### Claim 14 (depends on 12)

The electronic component of claim 12, wherein the multilayer ceramic capacitor has a thickness of 0.7 mm or less.

### Claim 15 (depends on 12)

The electronic component of claim 12, further comprising conductive adhesive portions disposed between the external electrodes and the external terminals, respectively.

### Claim 16 (depends on 12)

The electronic component of claim 12, wherein the capacitor body has first and second surfaces opposing each other, third and fourth surfaces connected to the first and second surfaces and opposing each other, and fifth and sixth surfaces connected to the first and second surfaces, connected to the third and fourth surfaces, and opposing each other, and includes a plurality of dielectric layers and a plurality of first and second internal electrodes alternately arranged in a direction connecting the first and second surfaces to each other with each of the dielectric layers interposed therebetween, and
ends of the first and second internal electrodes are exposed through the third and fourth surfaces, respectively, to be connected to the pair of external electrodes, respectively.

### Claim 17 (depends on 16)

The electronic component of claim 16, wherein the external electrodes include:
head portions disposed on the third and fourth surfaces of the capacitor body, respectively, and connected to the ends of the first and second internal electrodes, respectively; and
band portions extending from the head portions onto portions of the first surface of the capacitor body and connected to the bonding portions of the external terminals, respectively.

### Claim 18 (depends on 17)

The electronic component of claim 17, wherein Lc≤Li in which Lc is a distance in the length direction between centers of the band portions of the external electrodes, and Li is a shortest distance in the length direction between the connection portions disposed on the grooves in the opposite surfaces of the interposer body.

### Claim 19 (depends on 12)

The electronic component of claim 12, wherein the interposer having a length and a width smaller than a length and a width of the multilayer ceramic capacitor, respectively.

### Claim 20 (depends on 12)

The electronic component of claim 12, wherein the interposer having a width greater than a width of the multilayer ceramic capacitor.