# US 10,483,039 B2 · Conductive paste for external electrode and method for manufacturing electronic component including the conductive paste for external electrode > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,483,039 B2 - Document ID: US10483039B2 - Status: Granted - Kind: B2 - Application number: 15/950,421 - Filed: 2018-04-11 - Published: 2018-10-18 - Granted: 2019-11-19 - Earliest claimed: 2017-04-17 - Assignees: Murata Manufacturing Co., Ltd. - Applicants: Murata Manufacturing Co., Ltd. - Inventors: Yasuhiro Nishisaka - Web page: https://patentgrep.com/patent/US10483039B2 ## CPC - H01G 4/0085: {Fried electrodes} - B22F 1/0048 - B22F 1/0062 - C09D 5/24: Electrically-conducting paints {(conductive materials H01B1/00)} - H01B 1/16: the conductive material comprising metals or alloys - H01G 4/228: Terminals - B22F 1/0011 - B22F 2301/10: Copper - B22F 2304/10: Micron size particles, i.e. above 1 micrometer up to 500 micrometer - H01G: CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric H01B3/00; capacitors having potential barriers H10D1/62, H10K10/10) - B22F: WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER (making alloys by powder metallurgy C22C); APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER - C09D: COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR (cosmetics A61K; processes for applying liquids or other fluent materials to surfaces, in general, B05D; staining wood B27K5/02; glazes or vitreous enamels C03C; natural resins, French polish, drying-oils, driers, turpentine, per se, C09F; polishing compositions other than French polish, ski waxes C09G; adhesives or use of materials as adhesives C09J; materials for sealing or packing joints or covers C09K3/10; materials for stopping leaks C09K3/12; processes for the electrolytic or electrophoretic production of coatings C25D) - H01B: CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES (selection for magnetic properties H01F1/00; waveguides H01P {; printed circuits H05K}) ## Abstract A conductive paste for an external electrode that includes a conductive metal powder; a glass frit having an average particle diameter D50 of not more than 0.8 μm and having a flat shape with an average flatness of 1.5 to 5.5; and a binder resin. A method of manufacturing an electronic component includes preparing an electronic component element; applying the conductive paste for an external electrode onto an outer surface of the electronic component element; and baking the applied conductive paste to form an external electrode. ## Claims ### Claim 1 A conductive paste for an external electrode, the conductive paste comprising: a conductive metal powder; a glass frit having an average particle diameter D50 of not more than 0.8 μm and having a flat shape with an average flatness of 1.5 to 5.5; and a binder resin. ### Claim 2 (depends on 1) The conductive paste for an external electrode according to claim 1, wherein the glass frit contains at least one selected from Ba, Ti, Al, Zn and Sr. ### Claim 3 (depends on 1) The conductive paste for an external electrode according to claim 1, wherein the glass frit contains a B—Si-based glass. ### Claim 4 (depends on 3) The conductive paste for an external electrode according to claim 3, wherein a shape of the conductive metal powder is spherical. ### Claim 5 (depends on 4) The conductive paste for an external electrode according to claim 4, wherein the conductive metal powder is a Cu powder having an average particle diameter D50 of not more than 1.0 μm. ### Claim 6 (depends on 1) The conductive paste for an external electrode according to claim 1, wherein a shape of the conductive metal powder is spherical. ### Claim 7 (depends on 6) The conductive paste for an external electrode according to claim 6, wherein the conductive metal powder is a Cu powder having an average particle diameter D50 of not more than 1.0 μm. ### Claim 8 (depends on 1) The conductive paste for an external electrode according to claim 1, wherein the conductive metal powder is a Cu powder having an average particle diameter D50 of not more than 1.0 μm. ### Claim 9 (depends on 1) The conductive paste for an external electrode according to claim 1, wherein the binder resin is an acrylic resin. ### Claim 10 A method for manufacturing an electronic component, the method comprising: preparing an electronic component element; applying conductive paste for an external electrode onto an outer surface of the electronic component element, the conductive paste comprising: a conductive metal powder; a glass frit having an average particle diameter D50 of not more than 0.8 μm and having a flat shape with an average flatness of 1.5 to 5.5; and a binder resin; and baking the conductive paste to form an external electrode on the outer surface of the electronic component element. ### Claim 11 (depends on 10) The method for manufacturing an electronic component according to claim 10, further comprising drying the conductive paste on the outer surface of the electronic component element before the conductive paste is baked. ### Claim 12 (depends on 10) The method for manufacturing an electronic component according to claim 10, wherein the glass frit contains at least one selected from Ba, Ti, Al, Zn and Sr. ### Claim 13 (depends on 10) The method for manufacturing an electronic component according to claim 10, wherein the glass frit contains a B—Si-based glass. ### Claim 14 (depends on 13) The method for manufacturing an electronic component according to claim 13, wherein a shape of the conductive metal powder is spherical. ### Claim 15 (depends on 14) The method for manufacturing an electronic component according to claim 14, wherein the conductive metal powder is a Cu powder having an average particle diameter D50 of not more than 1.0 μm. ### Claim 16 (depends on 10) The method for manufacturing an electronic component according to claim 10, wherein a shape of the conductive metal powder is spherical. ### Claim 17 (depends on 16) The method for manufacturing an electronic component according to claim 16, wherein the conductive metal powder is a Cu powder having an average particle diameter D50 of not more than 1.0 μm. ### Claim 18 (depends on 10) The method for manufacturing an electronic component according to claim 10, wherein the conductive metal powder is a Cu powder having an average particle diameter D50 of not more than 1.0 μm. ### Claim 19 (depends on 10) The method for manufacturing an electronic component according to claim 10, wherein the binder resin is an acrylic resin.