# US 10,483,010 B2 · Reduction of surface and embedded substrate charge by controlled exposure to vacuum ultraviolet (VUV) light in low-oxygen environment > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,483,010 B2 - Document ID: US10483010B2 - Status: Granted - Kind: B2 - Application number: 15/258,397 - Filed: 2016-09-07 - Published: 2018-03-08 - Granted: 2019-11-19 - Earliest claimed: 2016-09-07 - Assignees: Lam Research Corporation - Applicants: Lam Research AG - Inventors: Rafal Dylewicz; Reinhold Schwarzenbacher; Xia Man; Kenichi Sano; David Lou; Milan Pliska - Web page: https://patentgrep.com/patent/US10483010B2 ## CPC - G21K 1/14: using charge exchange devices, e.g. for neutralising or changing the sign of the electrical charges of beams (producing or accelerating neutral particle beams H05H3/00) - H10P 72/0414: {using mainly spraying means, e.g. nozzles} - H10P 72/0436: {mainly by radiation} - H10P 14/6538: {by exposure to UV light} - G21K: HANDLING OF PARTICLES OR IONISING RADIATION NOT OTHERWISE PROVIDED FOR; IRRADIATION DEVICES; GAMMA RAY OR X-RAY MICROSCOPES - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 ## Abstract A system for reducing surface and embedded charge in a substrate includes a substrate support configured to support a substrate. A vacuum ultraviolet (VUV) assembly is arranged adjacent to the substrate and includes a housing and a VUV lamp that is connected to the housing and that generates and directs ultraviolet (UV) light at the substrate. A movement device is configured to move at least one of the VUV assembly and the substrate support during exposure of the substrate to the UV light to reduce surface and embedded charge in the substrate. ## Claims ### Claim 1 A system for reducing surface and embedded charge in a substrate, comprising: a substrate support configured to support a substrate; a vacuum ultraviolet (VUV) assembly, of a processing chamber, that is arranged adjacent to the substrate support and that includes a housing and a VUV lamp that is connected to the housing and that generates and directs ultraviolet (UV) light at the substrate, wherein the housing includes: a first inlet to receive an oxygen-reducing purge gas; a first fluid channel in fluid communication with the first inlet, wherein the first fluid channel has an annular shape; and a first outlet in fluid communication with the first fluid channel; and a movement device configured to move the VUV assembly during exposure of the substrate to the UV light to reduce surface and embedded charge in the substrate, wherein the first outlet directs the oxygen-reducing purge gas into a gap between the VUV lamp and the substrate, and wherein the first outlet comprises one of: a plurality of spaced nozzles passing from the first fluid channel through a substrate-facing surface of the housing; and an annular slot passing from the first fluid channel through the substrate-facing surface of the housing. ### Claim 2 (depends on 1) The system for reducing surface and embedded charge of claim 1, further comprising: a gas delivery system for supplying the oxygen-reducing purge gas, wherein the oxygen-reducing purge gas has an oxygen content that is less than 5% by mass. ### Claim 3 (depends on 1) The system for reducing surface and embedded charge of claim 1, wherein the housing includes: a second inlet to receive ambient gas; a second fluid channel in fluid communication with the second inlet; and a second outlet in fluid communication with the second fluid channel and a vacuum source. ### Claim 4 (depends on 1) The system for reducing surface and embedded charge of claim 1, wherein the housing is configured to draw ambient gas through the housing under vacuum supplied by a vacuum source remote from the VUV assembly to cool the VUV assembly. ### Claim 5 (depends on 1) The system for reducing surface and embedded charge of claim 1, wherein the movement device includes a rotating device configured to rotate the substrate support relative to the VUV assembly during exposure of the substrate to the UV light generated by the VUV lamp. ### Claim 6 (depends on 1) The system for reducing surface and embedded charge of claim 1, wherein the movement device is configured to move the VUV assembly relative to the substrate support while the UV light is generated by the VUV lamp. ### Claim 7 (depends on 1) The system for reducing surface and embedded charge of claim 1, wherein the movement device includes: a substrate rotating device configured to rotate the substrate support during exposure of the substrate to the UV light generated by the VUV lamp; and a radial movement device configured to move the VUV assembly in a radial direction relative to the substrate support while the substrate support is rotating and while the UV light is generated by the VUV lamp. ### Claim 8 (depends on 1) The system for reducing surface and embedded charge of claim 1, wherein the VUV lamp has an exposure period that is between 5 seconds and 15 seconds. ### Claim 9 (depends on 1) The system for reducing surface and embedded charge of claim 1, wherein the first fluid channel circumscribes the VUV lamp. ### Claim 10 (depends on 1) The system for reducing surface and embedded charge of claim 1, further comprising: a VUV array including a plurality of the VUV assembly, wherein the movement device includes a scanning device configured to scan the VUV array across a surface of the substrate. ### Claim 11 (depends on 1) A treatment system for exposing a substrate to liquid, comprising: the system for reducing surface and embedded charge of claim 1; and at least one liquid dispenser to dispense liquid on the substrate. ### Claim 12 (depends on 11) The treatment system of claim 11, further comprising one of a spin chuck and a pin chuck including the substrate support. ### Claim 13 (depends on 1) The system for reducing surface and embedded charge of claim 1, wherein the VUV lamp and the substrate support are located in the processing chamber, wherein the processing chamber is one of a closed processing chamber and an open processing chamber that is open to a clean room environment, and wherein ambient gas in the processing chamber has a pressure greater than or equal to 800 hPa. ### Claim 14 A method for reducing surface and embedded charge in a substrate, comprising: arranging a substrate on a substrate support; arranging a vacuum ultraviolet (VUV) assembly, of a processing chamber, including a housing and a VUV lamp adjacent to the substrate, wherein the housing of the VUV assembly includes: a first inlet to receive an oxygen-reducing purge gas; a first fluid channel in fluid communication with the first inlet, wherein the first fluid channel has an annular shape; and a first outlet in fluid communication with the first fluid channel; directing, by the first outlet, the oxygen-reducing purge gas into a gap between the VUV lamp and the substrate, wherein the first outlet comprises one of: a plurality of spaced nozzles passing from the first fluid channel through a substrate-facing surface of the housing; and an annular slot passing from the first fluid channel through the substrate-facing surface of the housing; and directing ultraviolet (UV) light at the substrate while moving the VUV assembly during exposure of the substrate to the UV light to reduce surface and embedded charge in the substrate. ### Claim 15 (depends on 14) The method of claim 14, further comprising discharging the VUV lamp during an exposure period that is between 5 seconds and 15 seconds. ### Claim 16 (depends on 14) The method of claim 14, further comprising: arranging the substrate support and the VUV assembly in the processing chamber, wherein the processing chamber is one of a closed processing chamber and an open processing chamber that is open to a clean room environment; and supplying gas having an oxygen content that is less than 5 mass-% to the processing chamber. ### Claim 17 (depends on 14) The method of claim 14, further comprising drawing ambient gas through the housing under vacuum supplied by a vacuum source that is remote from the VUV assembly to cool the VUV assembly. ### Claim 18 (depends on 14) The method of claim 14, wherein the moving includes rotating the substrate support during exposure of the substrate to the UV light generated by the VUV lamp while moving the VUV assembly in a radial direction relative to the substrate support. ### Claim 19 (depends on 14) The method of claim 14, further comprising: arranging the VUV assembly in a VUV array including a plurality of the VUV assembly; and scanning the VUV array across a surface of the substrate arranged on the substrate support.