# US 10,481,653 B2 · Compositions having a matrix and encapsulated phase change materials dispersed therein, and electronic devices assembled therewith

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- Number: US 10,481,653 B2
- Document ID: US10481653B2
- Status: Granted
- Kind: B2
- Application number: 15/143,869
- Filed: 2016-05-02
- Published: 2016-11-17
- Granted: 2019-11-19
- Earliest claimed: 2013-12-19
- Assignees: Henkel IP & Holding GmbH
- Applicants: Henkel IP & Holding GmbH
- Inventors: My N. Nguyen; Jason Brandi; Emilie Barriau
- Web page: https://patentgrep.com/patent/US10481653B2

## CPC

- B32B 27/08: of synthetic resin
- G06F 1/203: {for portable computers, e.g. for laptops}
- H10W 40/25: characterised by their materials
- H10W 40/251: {Organics}
- H10W 40/257: {having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh or porous structures (H10W40/254, H10W40/251 take precedence)}
- H10W 40/73: for cooling by change of state
- H10W 42/20: protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
- B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N)
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

Provided herein are compositions made from a matrix and encapsulated phase change material particles dispersed therein, and electronic devices assembled therewith.

## Claims

### Claim 1

A consumer electronic article of manufacture comprising:
a housing comprising at least one housing substrate having an interior surface and an exterior surface;
a combination comprising a composition and a substrate on which the composition is disposed, the composition comprising a matrix and encapsulated phase change material particles dispersed therein, wherein:
the matrix comprises a pressure sensitive adhesive or an acrylic emulsion,
the encapsulated phase change material has a melting point in the range of about 30° C. to about 100° C.,
the composition comprises:
about 10 to about 80% by volume of the matrix and
about 20 to about 90% by volume of the encapsulated phase change material,
the substrate is selected from the group consisting of a metallic, a metal-coated polymeric, a graphite or a metal-coated graphitic substrate, on which the composition is disposed, and wherein the combination is disposed on at least a portion of the interior surface of the at least one housing substrate; and
at least one semiconductor package comprising an assembly comprising at least one of
I.
a semiconductor chip;
a heat spreader; and
a thermal interface material therebetween, or
II.
a heat spreader;
a heat sink; and
a thermal interface material therebetween.

### Claim 2 (depends on 1)

The article of claim 1, further comprising a venting element to disperse generated heat from the semiconductor assembly from the article.

### Claim 3 (depends on 1)

The article of manufacture of claim 1, wherein the housing comprises at least two substrates.

### Claim 4 (depends on 1)

The article of manufacture of claim 1, wherein the housing comprises a plurality of substrates.

### Claim 5 (depends on 1)

The article of manufacture of claim 1, wherein the substrates are dimensioned and disposed to engage one another.

### Claim 6 (depends on 1)

The article of manufacture of claim 1, wherein the composition is disposed on at least a portion of the interior surface of the at least one housing substrate, the complementary exterior surface of which comes into contact with the end user when in use.

### Claim 7 (depends on 1)

The article of manufacture of claim 1, wherein the composition further comprises thermally insulating materials.

### Claim 8 (depends on 7)

The article of manufacture of claim 7, wherein the thermally insulating materials in the composition comprise a gas.

### Claim 9 (depends on 7)

The article of manufacture of claim 7, wherein the thermally insulating materials in the composition comprise air.

### Claim 10 (depends on 7)

The article of manufacture of claim 7, wherein the thermally insulating materials in the composition comprise a gas within a hollow sphere-like vessel.

### Claim 11 (depends on 7)

The article of manufacture of claim 7, wherein the thermally insulating materials are used at a concentration within the range of 25% to 99% by volume in the composition.

### Claim 12 (depends on 1)

The article of manufacture of claim 1, wherein the composition facilitates the transfer of heat from an electronic component to a heat sink.

### Claim 13 (depends on 1)

The article of manufacture of claim 1, wherein the thermal interface material has a melting point of approximately 37° C.

### Claim 14 (depends on 1)

The article of manufacture of claim 1, wherein the encapsulated phase change material has a melting point of approximately 37° C.

### Claim 15 (depends on 1)

The article of manufacture of claim 1, wherein the thermal interface material has a melting point of approximately 52° C.

### Claim 16 (depends on 1)

The article of manufacture of claim 1, wherein the encapsulated phase change material has a melting point of approximately 52° C.

### Claim 17 (depends on 1)

The article of manufacture of claim 1, wherein the article is a notebook personal computer, tablet personal computer or a handheld device.