Selecting manufacturing settings based on historical data from manufacturing tools

A computer program product stored on a non-transitory computer readable storage medium, the computer program product comprising program code, which, when being executed by at least one computing device, causes the at least one computing device to:

• identify, from a plurality of tools for performing an operation on a semiconductor wafer:
• at least one non-candidate tool which previously performed the operation on at least one prior semiconductor wafer, wherein the at least one non-candidate tool is represented in a set of historical data, wherein the set of historical data includes a past manufacturing setting for the at least one non-candidate tool performing the operation on the at least one prior semiconductor wafer, and wherein the past manufacturing setting includes one of an etch time, an etch rate, a deposition time, or a deposition rate for performing the operation with the at least one non-candidate tool,
• a candidate tool which has not previously performed the operation on the at least one prior semiconductor wafer, and is not associated with any past manufacturing settings in the historical data, wherein the candidate tool is not represented in the set of historical data;
• determine whether the past manufacturing setting of the at least one non-candidate tool in the set of historical data correlates to performing of the operation with the candidate tool based on the past manufacturing settings for performing the operation on the at least one prior semiconductor wafer with the at least one non-candidate tool;
• in response to the past manufacturing setting in the set of historical data correlating to the performing of the operation with the candidate tool, select the past manufacturing setting as a selected manufacturing setting for the candidate tool based on the set of historical data;
• and
• causing the candidate tool to perform the operation on the semiconductor wafer with the selected manufacturing setting for the candidate tool to produce a manufactured component from the semiconductor wafer, after selecting the past manufacturing setting for the candidate tool.

A system comprising at least one computing device configured to perform a method by performing actions including:

• identify, from a plurality of tools for performing an operation on a semiconductor wafer:
• at least one non-candidate tool which previously performed the operation on at least one prior semiconductor wafer, wherein the at least one non-candidate tool is represented in a set of historical data, wherein the set of historical data a past manufacturing setting for performing the operation on the at least one prior semiconductor wafer, and wherein the past manufacturing setting includes one of an etch time, an etch rate, a deposition time, or a deposition rate for performing the operation with the at least one non-candidate tool, and
• a candidate tool which has not previously performed the operation on the at least one prior semiconductor wafer, and is not associated with any past manufacturing settings in the historical data, wherein the candidate tool is not represented in the set of historical data;
• determine whether the past manufacturing setting of the at least one non-candidate tool in the set of historical data correlates to performing of the operation with the candidate tool based on the past manufacturing setting for the at least one non-candidate tool performing the operation on the at least one prior semiconductor wafer with the at least one non-candidate tool;
• in response to the past manufacturing setting in the set of historical data correlating to the performing of the operation with the candidate tool, select the past manufacturing setting for the candidate tool as a selected manufacturing setting for the candidate tool based on the set of historical data;
• and
• cause the candidate tool to perform the operation on the semiconductor wafer with the selected manufacturing setting for the candidate tool to produce a manufactured component from the semiconductor wafer, after selecting the past manufacturing setting for the candidate tool.