# US 10,481,585 B2 · Printed circuit board design and manufacturing > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,481,585 B2 - Document ID: US10481585B2 - Status: Granted - Kind: B2 - Application number: 15/863,721 - Filed: 2018-01-05 - Published: 2018-09-27 - Granted: 2019-11-19 - Earliest claimed: 2017-03-21 - Assignees: Tempo Automation, Inc. - Applicants: Tempo Automation, Inc. - Inventors: Jeffrey McAlvay; Shannon Lincoln; Jesse Koenig; Thomas Anderson; Jonas Neubert; Shashank Samala; Ryan Saul - Web page: https://patentgrep.com/patent/US10481585B2 ## CPC - G05B 19/4097: characterised by using design data to control NC machines, e.g. CAD/CAM (G05B19/4093 takes precedence) - H05K 3/0005: {for designing circuits by computer} - G05B 2219/45031: Manufacturing semiconductor wafers - Y02P 90/02: Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS] - G05B: CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS (systems for controlling or regulating non-electric variables G05D; systems for regulating electric or magnetic variables G05F; control devices or systems insofar as characterised by mechanical features only G05G) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS ## Abstract A spatial model of a printed circuit board assembly is generated based on an input file. The spatial model is used to determine a spatial feature not directly specified in the input file. A manufacturing parameter is determined based at least in part on the determined spatial feature. A proposal to manufacture the printed circuit board assembly is generated programmatically based at least in part on the determined manufacturing parameter. ## Claims ### Claim 1 A system, comprising: a processor configured to: generate a spatial model of a printed circuit board assembly based on at least one input file; use the spatial model to determine one or more spatial features not specified directly in the at least one input file; determine one or more manufacturing parameters based at least in part on the determined one or more spatial features not specified directly in the at least one input file; determine which of the one or more manufacturing parameters influence a proposal to manufacture the printed circuit board assembly, wherein the proposal includes a cost and/or time to manufacture the printed circuit board assembly; generate programmatically, based at least in part on the determined one or more manufacturing parameters, the proposal to manufacture the printed circuit board assembly; identify one or more manufacturing parameters that can be modified, wherein the one or more identified manufacturing parameters include one or more corresponding adjustments to the one or more of the identified manufacturing parameters, wherein the one or more corresponding adjustments will result in an improvement to the proposal to manufacture the printed circuit board assembly; and specify to a client device one or more of the identified manufacturing parameters; and a memory coupled to the processor and configured to provide the processor with instructions. ### Claim 2 (depends on 1) The system of claim 1, wherein the at least one input file is a design file, a manufacturing data file, or a Bill of Materials (BOM). ### Claim 3 (depends on 1) The system of claim 1, wherein the processor is further configured to control manufacture of the printed circuit board assembly according to the determined one or more manufacturing parameters. ### Claim 4 (depends on 1) The system of claim 1, wherein the at least one input file is a Bill of Materials (BOM) and a design file, wherein the processor is further configured to determine a mismatch between at least one component of the BOM and at least one component of the design file. ### Claim 5 (depends on 1) The system of claim 1, wherein the processor is further configured to convert the input file into a standard format. ### Claim 6 (depends on 1) The system of claim 1, wherein the one or more spatial features not specified directly in the input file are not represented by a text field of the input file. ### Claim 7 (depends on 1) The system of claim 1, wherein the one or more spatial features are determined using a computational geometry data structure. ### Claim 8 (depends on 1) The system of claim 1, wherein the processor is further configured to receive from the client device an indication to modify a design of the printed circuit board assembly. ### Claim 9 (depends on 8) The system of claim 8, wherein the processor is further configured to modify the design of the printed circuit board assembly based on the indication. ### Claim 10 (depends on 1) The system of claim 1, wherein the processor is further configured to identify one or more manufacturing parameters that can be modified that will result in an improvement to the proposal to manufacture the printed circuit board. ### Claim 11 (depends on 10) The system of claim 10, wherein the improvement comprises a reduction of the overall time to manufacture the printed circuit board assembly. ### Claim 12 (depends on 10) The system of claim 10, wherein the improvement comprises a reduction to the overall cost to manufacture the printed circuit board assembly. ### Claim 13 (depends on 1) The system of claim 1, wherein to generate the spatial model, the processor is configured to extract geometry data from the at least one input file. ### Claim 14 (depends on 1) The system of claim 1, wherein the spatial model is generated by combining data from multiple input files comprising a combination of one or more design files, one or more manufacturing data files, and/or one or more BOMs. ### Claim 15 A method, comprising: generating a spatial model of a printed circuit board assembly based on at least one input file; using the spatial model to determine one or more spatial features not specified directly in the at least one input file; determining one or more manufacturing parameters based at least in part on the determined one or more spatial features not specified directly in the at least one input file; determining which of the one or more manufacturing parameters influence a proposal to manufacture the printed circuit board assembly, wherein the proposal includes a cost and/or time to manufacture the printed circuit board assembly; generating programmatically based at least in part on the determined one or more proposal influencing manufacturing parameters the proposal to manufacture the printed circuit board assembly; identifying one or more manufacturing parameters that can be modified, wherein the one or more identified manufacturing parameters include one or more corresponding adjustments to the one or more of the identified manufacturing parameters, wherein the one or more corresponding adjustments will result in an improvement to the proposal to manufacture the printed circuit board assembly; and specifying to a client device one or more of the identified manufacturing parameters. ### Claim 16 (depends on 15) The method of claim 15, wherein generating the spatial model includes extracting geometry data from the at least one input file. ### Claim 17 A computer program product, the computer program product being embodied in a tangible non-transitory computer readable storage medium and comprising computer instructions for: generating a spatial model of a printed circuit board assembly based on at least one input file; using the spatial model to determine one or more spatial features not specified directly in the at least one input file; determining one or more manufacturing parameters based at least in part on the determined one or more spatial features not specified directly in the at least one input file; determining which of the one or more manufacturing parameters influence a proposal to manufacture the printed circuit board assembly, wherein the proposal includes a cost and/or time to manufacture the printed circuit board assembly; generating programmatically, based at least in part on the determined one or more proposal influencing manufacturing parameters, the proposal to manufacture the printed circuit board assembly; identifying one or more manufacturing parameters that can be modified, wherein the one or more identified manufacturing parameters include one or more corresponding adjustments to the one or more of the identified manufacturing parameters, wherein the one or more corresponding adjustments will result in an improvement to the proposal to manufacture the printed circuit board assembly; and specifying to a client device one or more of the identified manufacturing parameters.