# US 10,481,392 B2 · Optical sensor, scanner unit, and image forming apparatus

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- Number: US 10,481,392 B2
- Document ID: US10481392B2
- Status: Granted
- Kind: B2
- Application number: 15/654,369
- Filed: 2017-07-19
- Published: 2018-01-25
- Granted: 2019-11-19
- Earliest claimed: 2016-07-22
- Assignees: Canon Kabushiki Kaisha
- Applicants: Canon Kabushiki Kaisha
- Inventors: Shunsuke Tanaka; Kazunari Fujii
- Web page: https://patentgrep.com/patent/US10481392B2

## CPC

- G02B 26/105: {with one or more pivoting mirrors or galvano-mirrors (G02B26/101 takes precedence)}
- G02B 26/127: {Adaptive control of the scanning light beam, e.g. using the feedback from one or more detectors (G02B27/0031 takes precedence)}
- H10F 77/50: Encapsulations or containers (for photovoltaic modules H10F19/80)
- H10W 72/00: Interconnections or connectors in packages
- G02B 2006/12138: {Sensor}
- H10W 72/5522: {comprising gold [Au]}
- H10W 72/59: Bond pads specially adapted therefor
- H10W 72/884: {Die-attach connectors and bond wires}
- H10W 72/981: {Auxiliary members, e.g. spacers}
- H10W 74/114: {by a substrate and the encapsulations}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL}
- G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

An optical sensor includes a bare chip mounted on a circuit board, a protection member configured to protect the bare chip, a pad connected to the bare chip via a wire, and a pattern connecting the pad and a terminal portion at an edge of the circuit board to each other. The pattern is connected to the terminal portion on a same surface as a surface on which the bare chip is mounted, and a portion of the pattern between the protection member and the terminal portion is covered with solder resist.

## Claims

### Claim 1

An optical sensor comprising:
a circuit board;
a bare chip mounted on the circuit board;
a protection member configured to protect the bare chip;
a pad connected to the bare chip via a wire; and
a pattern connecting the pad and a terminal portion at an edge of the circuit board to each other,
wherein the pattern is connected to the terminal portion on a same surface as a surface on which the bare chip is mounted, and a portion of the pattern between the protection member and the terminal portion is covered with solder resist.

### Claim 2 (depends on 1)

The optical sensor according to claim 1, wherein the protection member is a transparent acrylic resin and is configured to cover the bare chip therewith.

### Claim 3

A scanner unit comprising:
a light emission element;
a mirror configured to reflect light emitted from the light emission element; and
an optical sensor configured to detect the light reflected by the mirror,
the optical sensor including
a circuit board,
a bare chip mounted on the circuit board,
a protection member configured to protect the bare chip,
a pad connected to the bare chip via a wire, and
a pattern connecting the pad and a terminal portion at an edge of the circuit board to each other,
wherein the pattern is connected to the terminal portion on a same surface as a surface on which the bare chip is mounted, and a portion of the pattern between the protection member and the terminal portion is covered with solder resist.

### Claim 4 (depends on 3)

The scanner unit according to claim 3, wherein the light emission element is a semiconductor laser element.

### Claim 5

An image forming apparatus comprising:
an image bearing member configured to allow an image to be formed thereon;
a scanner unit configured to irradiate the image bearing member with light to form a latent image on the image bearing member,
the scanner unit including
a light emission element,
a mirror configured to reflect the light emitted from the light emission element, and
an optical sensor configured to detect the light reflected by the mirror,
the optical sensor including
a circuit board,
a bare chip mounted on the circuit board,
a protection member configured to protect the bare chip,
a pad connected to the bare chip via a wire, and
a pattern connecting the pad and a terminal portion at an edge of the circuit board to each other,
wherein the pattern is connected to the terminal portion on a same surface as a surface on which the bare chip is mounted, and a portion of the pattern between the protection member and the terminal portion is covered with solder resist;
a development unit configured to develop the latent image formed on the image bearing member; and
a transfer unit configured to transfer an image developed by the development unit onto a sheet.

### Claim 6 (depends on 5)

The image forming apparatus according to claim 5, wherein the light emission element is a semiconductor laser element.