# US 10,481,351 B2 · Semicondcutor packages

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- Number: US 10,481,351 B2
- Document ID: US10481351B2
- Status: Granted
- Kind: B2
- Application number: 16/224,801
- Filed: 2018-12-19
- Published: 2019-05-16
- Granted: 2019-11-19
- Earliest claimed: 2017-07-27
- Assignees: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicants: Taiwan Semiconductor Manufacturing Co., Ltd.
- Inventors: Chuei-Tang Wang; Jeng-Shien Hsieh; Hsing-Kuo Hsia; Chen-Hua Yu
- Web page: https://patentgrep.com/patent/US10481351B2

## CPC

- G02B 6/4246: {Bidirectionally operating package structures}
- G02B 6/12004: {Combinations of two or more optical elements}
- G02B 6/122: Basic optical elements, e.g. light-guiding paths
- G02B 6/428: {containing printed circuit boards [PCB]}
- G02B 6/4214: {the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device (G02B6/4246 takes precedence)}
- G02B 2006/12121: {Laser}
- H10W 72/07207: {Temporary substrates, e.g. removable substrates}
- H10W 72/241: {Dispositions, e.g. layouts}
- H10W 72/874: {On different surfaces}
- H10W 72/926: {Multiple bond pads having different sizes}
- H10W 72/9413: {on encapsulations}
- H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

Semiconductor packages are provided. The semiconductor package includes a photonic integrated circuit, an electronic integrated circuit and a high performance integrated circuit. The electronic integrated circuit is disposed aside the photonic integrated circuit and electrically connected to the photonic integrated circuit through a first redistribution structure. The high performance integrated circuit is disposed aside the electronic integrated circuit and electrically connected to the electronic integrated circuit through a second redistribution structure.

## Claims

### Claim 1

A semiconductor package, comprising:
a photonic integrated circuit;
an electronic integrated circuit, disposed aside the photonic integrated circuit and electrically connected to the photonic integrated circuit through a first redistribution structure; and
a high performance integrated circuit, disposed aside the electronic integrated circuit and electrically connected to the electronic integrated circuit through a second redistribution structure.

### Claim 2 (depends on 1)

The semiconductor package as claimed in claim 1, wherein the first redistribution structure is disposed between the electronic integrated circuit and the photonic integrated circuit.

### Claim 3 (depends on 1)

The semiconductor package as claimed in claim 1, wherein the first redistribution structure and the second redistribution structure are disposed at opposite sides of the photonic integrated circuit.

### Claim 4 (depends on 1)

The semiconductor package as claimed in claim 1, wherein the photonic integrated circuit and the high performance integrated circuit are both disposed between the first redistribution structure and the second redistribution structure.

### Claim 5 (depends on 1)

The semiconductor package as claimed in claim 1, wherein the high performance integrated circuit, the photonic integrated circuit and the electronic integrated circuit are stacked, and the photonic integrated circuit is disposed between the electronic integrated circuit and the high performance integrated circuit.

### Claim 6 (depends on 1)

The semiconductor package as claimed in claim 1, wherein the high performance integrated circuit, the electronic integrated circuit and the photonic and the electronic integrated circuit are all disposed over the first redistribution structure and the second redistribution structure.

### Claim 7 (depends on 1)

The semiconductor package as claimed in claim 1, wherein the electronic integrated circuit is disposed between the high performance integrated circuit and the photonic integrated circuit.

### Claim 8

A semiconductor package, comprising:
a photonic integrated circuit comprising an optical dielectric waveguide, wherein a portion of the optical dielectric waveguide is exposed;
a laser die, optically coupled to the photonic integrated circuit; and
an electronic integrated circuit electrically connected to the photonic integrated circuit.

### Claim 9 (depends on 8)

The semiconductor package as claimed in claim 8, wherein the photonic integrated circuit comprises a passivation layer having an opening, and at least a portion of the optical dielectric waveguide is disposed in the opening.

### Claim 10 (depends on 9)

The semiconductor package as claimed in claim 9, wherein a top surface of the optical dielectric waveguide is higher than a top surface of the passivation layer.

### Claim 11 (depends on 8)

The semiconductor package as claimed in claim 8, further comprising a molding compound encapsulating the photonic integrated circuit, and the optical dielectric waveguide covers a portion of the molding compound.

### Claim 12 (depends on 8)

The semiconductor package as claimed in claim 8, further comprising a redistribution structure between the photonic integrated circuit and the laser die, wherein the optical dielectric waveguide is embedded in the redistribution structure.

### Claim 13 (depends on 8)

The semiconductor package as claimed in claim 8, wherein a material of the optical dielectric waveguide comprises oxide or optical polymer.

### Claim 14 (depends on 8)

The semiconductor package as claimed in claim 8, further comprising a package substrate, wherein the photonic integrated circuit and the electronic integrated circuit are disposed above the package substrate.

### Claim 15 (depends on 14)

The semiconductor package as claimed in claim 14, wherein the package substrate comprises an opening, and the laser die is disposed in the opening.

### Claim 16

A semiconductor package, comprising:
a photonic integrated circuit;
a laser die, disposed over the photonic integrated circuit;
an electronic integrated circuit, electrically connected to the photonic integrated circuit; and
a redistribution structure, disposed between the photonic integrated circuit and the laser die and comprising an optical dielectric layer optically coupling the laser die and the photonic integrated circuit.

### Claim 17 (depends on 16)

The semiconductor package as claimed in claim 16, wherein the redistribution structure is disposed between the photonic integrated circuit and the electronic integrated circuit.

### Claim 18 (depends on 16)

The semiconductor package as claimed in claim 16, further comprising a package substrate, wherein the redistribution structure is disposed between the package substrate and the photonic integrated circuit and the electronic integrated circuit.

### Claim 19 (depends on 18)

The semiconductor package as claimed in claim 18, wherein the package substrate comprises an opening, and the laser die is disposed in the opening.

### Claim 20 (depends on 16)

The semiconductor package as claimed in claim 16, further comprising a light coupler disposed over the photonic integrated circuit, wherein the optical dielectric layer is disposed between and optically coupling the photonic integrated circuit and the light coupler.