# US 10,481,280 B2 · Radiation detecting apparatus, radiation detecting system, and manufacturing method for radiation detecting apparatus > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,481,280 B2 - Document ID: US10481280B2 - Status: Granted - Kind: B2 - Application number: 15/634,922 - Filed: 2017-06-27 - Published: 2018-01-11 - Granted: 2019-11-19 - Earliest claimed: 2016-07-07 - Assignees: Canon Kabushiki Kaisha - Applicants: Canon Kabushiki Kaisha - Inventors: Tomoaki Ichimura; Youjirou Hiratsuka - Web page: https://patentgrep.com/patent/US10481280B2 ## CPC - G01T 1/2006: {using a combination of a scintillator and photodetector which measures the means radiation intensity} - G01T 1/208: Circuits specially adapted for scintillation detectors, e.g. for the photo-multiplier section - G01T 1/2928: {using solid state detectors} - G01T 7/00: Details of radiation-measuring instruments - G01T: MEASUREMENT OF NUCLEAR OR X-RADIATION (radiation analysis of materials, mass spectrometry G01N23/00; tubes for determining the presence, intensity, density or energy of radiation or particles H01J47/00) ## Abstract A radiation detecting apparatus includes a scintillator, a pixel array in which a plurality of pixels that each converts visible light converted by the scintillator into electric signals is arranged in a two-dimensional array form on a first surface of a substrate, a plurality of connection terminal portions arranged on a periphery of the pixel array on the first surface of the substrate, and a conductive member to which a constant potential is supplied, wherein the conductive member, the pixel array, and the scintillator are arranged in this order from a side irradiated with radiation, and the scintillator is arranged on a first surface side, and wherein the conductive member is arranged in a region of a second surface opposite to the first surface of the substrate except for a region opposite to the plurality of connection terminal portions. ## Claims ### Claim 1 A radiation detecting apparatus comprising: a scintillator configured to convert irradiated radiation into visible light; a pixel array in which a plurality of pixels that each converts the visible light converted by the scintillator into electric signals is arranged in a two-dimensional array form on a first surface of a substrate; a plurality of connection terminal portions arranged on a periphery of the pixel array on the first surface of the substrate and configured to electrically connect the pixel array to an external circuit; and a conductive member to which a constant potential is supplied, wherein the conductive member, the pixel array, and the scintillator are arranged in this order from a side irradiated with radiation, and the scintillator is arranged on the first surface side, and wherein the conductive member is arranged in a region of a second surface opposite to the first surface of the substrate but does not extend to a region opposite to the plurality of connection terminal portions on the first surface. ### Claim 2 (depends on 1) The radiation detecting apparatus according to claim 1, wherein an end portion of the conductive member is positioned on the second surface and marks a boundary between the region in which the pixel array is arranged and the region opposite to the plurality of connection terminal portions. ### Claim 3 (depends on 1) The radiation detecting apparatus according to claim 1, wherein a part of an end portion of the conductive member is positioned on the second surface and marks a boundary between the regions opposite to the plurality of connection terminal portions. ### Claim 4 (depends on 1) The radiation detecting apparatus according to claim 1, further comprising a connecting portion configured to electrically connect the conductive member to a constant potential member that supplies a constant potential to the conductive member, wherein the connecting portion is arranged so as to pass between regions provided on the second surface and opposite to the plurality of connection terminal portions. ### Claim 5 (depends on 4) The radiation detecting apparatus according to claim 4, wherein the plurality of connection terminal portions includes a plurality of first connection terminal portions arranged along a first side of the substrate and a plurality of second connection terminal portions arranged along a second side adjacent to the first side of the substrate, wherein the plurality of first connection terminal portions is electrically connected to a drive circuit that drives the pixel array, wherein the plurality of second connection terminal portions is electrically connected to a readout circuit that reads out electric signals from the pixel array, and wherein the connecting portion is arranged on the second side of the substrate so as to pass between the regions provided on the second surface and opposite to the plurality of connection terminal portions. ### Claim 6 (depends on 5) The radiation detecting apparatus according to claim 5, further comprising: a plurality of first flexible wiring boards electrically connected to the plurality of first connection terminal portions; and a plurality of second flexible wiring boards electrically connected to the plurality of second connection terminal portions, wherein the connecting portion is arranged so as to pass between the plurality of second flexible wiring boards. ### Claim 7 (depends on 4) The radiation detecting apparatus according to claim 4, further comprising a supporting member configured to support the conductive member, the substrate, and the scintillator from a side of the scintillator, wherein the constant potential member is the supporting member. ### Claim 8 (depends on 7) The radiation detecting apparatus according to claim 7, wherein the supporting member includes a base and a radiation absorption plate arranged between the scintillator and the base, and wherein the constant potential member is the base. ### Claim 9 (depends on 8) The radiation detecting apparatus according to claim 8, wherein the scintillator includes a scintillator layer configured to convert radiation into visual light, and a protection member configured to protect the scintillator layer by covering the scintillator layer and at least a part of the first surface of the substrate, and wherein the protection member includes a conductive layer to which a constant potential is supplied. ### Claim 10 (depends on 9) The radiation detecting apparatus according to claim 9, further comprising a housing configured to store the conductive member, the base, the scintillator, and the supporting member, and wherein the base is grounded with the housing to supply the constant potential to the conductive member. ### Claim 11 (depends on 1) The radiation detecting apparatus according to claim 1, further comprising another conductive member arranged on a side of the conductive member, the side being irradiated with radiation and supplied with a constant potential, wherein the other conductive member is larger than an orthogonal projection of the conductive member with respect to the other conductive member. ### Claim 12 A radiation detecting apparatus comprising: a scintillator configured to convert irradiated radiation into visible light; a pixel array in which a plurality of pixels that each converts the visible light converted by the scintillator into electric signals is arranged in a two-dimensional array form on a first surface of a substrate; a first conductive member fixed on a second surface opposite to the first surface of the substrate and supplied with a constant potential; and a second conductive member to which a constant potential is supplied, wherein the second conductive member, the first conductive member, the pixel array, and the scintillator are arranged in this order from a side irradiated with radiation, and the scintillator is arranged on a first surface side, and wherein the second conductive member is larger than an orthogonal projection of the first conductive member with respect to the second conductive member. ### Claim 13 (depends on 1) A radiation detecting system comprising: the radiation detecting apparatus according to claim 1; and a signal processing apparatus configured to process electric signals acquired by the radiation detecting apparatus. ### Claim 14 (depends on 12) A radiation detecting system comprising: the radiation detecting apparatus according to claim 12; and a signal processing apparatus configured to process electric signals acquired by the radiation detecting apparatus. ### Claim 15 A manufacturing method for a radiation detecting apparatus including a scintillator configured to convert irradiated radiation into visible light, a pixel array in which a plurality of pixels that each converts the visible light converted by the scintillator into electric signals is arranged in a two-dimensional array form on a first surface of a substrate, a plurality of connection terminal portions arranged on a periphery of the pixel array on the first surface of the substrate and configured to electrically connect the pixel array to an external circuit, and a conductive member to which a constant potential is supplied, the conductive member, the pixel array, and the scintillator being arranged in this order from a side irradiated with radiation and the scintillator being arranged on a first surface side, the manufacturing method comprising: arranging the conductive member in a region of a second surface opposite to the first surface of the substrate except for a region opposite to the plurality of connection terminal portions. ### Claim 16 (depends on 15) The radiation detecting apparatus manufacturing method according to claim 15, wherein, in the arranging, a connecting portion that electrically connects the conductive member to a constant potential member that supplies a constant potential to the conductive member is arranged in such a manner that the connecting portion passes between regions provided on the second surface and opposite to the plurality of connection terminal portions. ### Claim 17 (depends on 15) The radiation detecting apparatus manufacturing method according to claim 15, further comprising electrically connecting a printed circuit board to the plurality of connection terminal portions via a plurality of flexible wiring boards by connecting the plurality of flexible wiring boards to the plurality of connection terminal portions by heat pressure processing using an anisotropic conductive film in a state in which a receiving member is arranged in a region provided on the second surface and opposite to the first surface of the substrate and opposite to the plurality of connection terminal portions, wherein the region provided on the second surface opposite to the first surface of the substrate and opposite to the plurality of connection terminal portions is larger than a portion of the receiving member, the portion contacting the substrate. ### Claim 18 (depends on 17) The radiation detecting apparatus manufacturing method according to claim 17, further comprising inspecting electric characteristics of the pixel array, the plurality of flexible wiring boards and the printed circuit board, wherein, in the inspecting, the conductive member is electrically connected to at least one of the plurality of printed circuit boards via the connecting portion, and a constant potential is supplied to the conductive member. ### Claim 19 (depends on 18) The radiation detecting apparatus manufacturing method according to claim 18, further comprising removing, in a case where a failure is found in any one of the plurality of flexible wiring boards in the inspecting, any flexible wiring board having a failure in which the connecting portion is electrically disconnected from at least one of the plurality of printed circuit boards, from the plurality of connection terminal portions.