# US 10,481,106 B2 · Measurement processing device, X-ray inspection device, measurement processing method, measurement processing program, and structure manufacturing method > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,481,106 B2 - Document ID: US10481106B2 - Status: Granted - Kind: B2 - Application number: 15/694,538 - Filed: 2017-09-01 - Published: 2018-05-03 - Granted: 2019-11-19 - Earliest claimed: 2015-03-03 - Assignees: Nikon Corporation - Applicants: Nikon Corporation - Inventors: Hirotomo Yashima; Fuminori Hayano; Akitoshi Kawai - Web page: https://patentgrep.com/patent/US10481106B2 ## CPC - G01N 23/083: the radiation being X-rays - G01B 15/025: {by measuring absorption} - G01B 15/045: {by measuring absorption} - G01N 23/046: using tomography, e.g. computed tomography [CT] - G06T 7/0008: {checking presence/absence} - G01B 2210/52: Combining or merging partially overlapping images to an overall image - G01N 2223/419: computed tomograph - G06T 2207/10116: X-ray image - G06T 2207/30108: Industrial image inspection - G01N: INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES (measuring or testing apparatus or processes other than immunoassay, involving enzymes or microorganisms C12M, C12Q) - G01B: MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS - G06T: IMAGE DATA PROCESSING OR GENERATION, IN GENERAL ## Abstract A measurement processing device used for an X-ray inspection device includes: a region information acquisition unit that acquires first region information based on X-rays passing through a first region that is a part of a first specimen; a storage unit that stores second region information related to a second region of a second specimen, the second region being larger than the first region; and a determination unit that determines whether or not a region corresponding to the first region is included in the second region, based on the first region information and the second region information. ## Claims ### Claim 1 A measurement processing device, comprising: a memory storing instructions; and at least one processor configured to execute the instructions to: acquire a first sliced region that is a part of a specimen, as first sliced region information, by using X-rays; and identify a position of the first sliced region in the specimen, by using the first sliced region information and shape information of the specimen. ### Claim 2 (depends on 1) The measurement processing device according to claim 1, wherein the at least one processor is further configured to execute the instructions to: store the shape information of the specimen. ### Claim 3 (depends on 1) The measurement processing device according to claim 1, wherein the shape information is design information of the specimen. ### Claim 4 (depends on 1) The measurement processing device according to claim 1, wherein the shape information is measurement information in which a first specimen with a structure equivalent to the specimen is measured by using the X-rays. ### Claim 5 (depends on 1) The measurement processing device according to claim 1, wherein the shape information is measurement information in which a first specimen with a structure equivalent to the specimen is measured by a measurement other than using the X-rays. ### Claim 6 (depends on 1) The measurement processing device according to claim 1, wherein the shape information is information related to a partial region of the specimen. ### Claim 7 (depends on 1) The measurement processing device according to claim 1, wherein the at least one processor is further configured to execute the instructions to: identify the position of the first sliced region in the specimen by comparing the shape information of the first sliced region with the shape information of the specimen. ### Claim 8 (depends on 7) The measurement processing device according to claim 7, wherein the wherein the at least one processor is further configured to execute the instructions to: acquire a region to be inspected as the first sliced region; and calculate a positional difference between a position of the region to be inspected and a position of the first sliced region. ### Claim 9 (depends on 8) The measurement processing device according to claim 8, wherein the at least one processor is further configured to execute the instructions to: determine whether or not the calculated positional difference is within a predetermined range; and instruct a further measurement of the specimen by using X-rays in case the positional difference is larger than the predetermined range. ### Claim 10 (depends on 1) The measurement processing device according to claim 1, wherein an evaluation region for evaluating a quality of the specimen is set; and the evaluation region that is set is acquired as the first sliced region. ### Claim 11 (depends on 1) The measurement processing device according to claim 1, wherein a sliced region of the specimen included in the shape information is thicker than the first sliced region. ### Claim 12 (depends on 11) The measurement processing device according to claim 11, wherein the sliced region of the specimen included in the shape information is thicker than the first sliced region in a direction orthogonal to a region surrounded by a light-emission point of the X-rays and is configured to acquire the first sliced region and a detection region to detect the X-rays passed through the specimen. ### Claim 13 (depends on 1) An X-ray inspection device, comprising: the measurement processing device according to claim 1; an X-ray source that emits X-rays on the specimen; wherein at least one processor configured to execute the instructions to: detect the X-rays passed through the specimen. ### Claim 14 (depends on 1) A structure manufacturing method, comprising: creating design information related to a structure shape; creating the structure based on the design information; acquiring shape information by measuring the shape of the created structure, using the measurement processing device according to claim 1; and comparing the design information and shape information acquired above. ### Claim 15 A measurement processing method, comprising: acquiring a first sliced region that is a part of a specimen, as first sliced region information, by using X-rays; and identifying a position of the first sliced region in the specimen by using the first sliced region information and shape information of the specimen. ### Claim 16 A measurement processing method, the measurement processing method comprising: acquiring first sliced region information related to a first sliced region that is a part of a specimen, by using X-rays; and identifying a position of the first sliced region in the specimen, based on the first sliced region information and the shape information of the specimen for identifying a position of the first sliced region in the specimen. ### Claim 17 A control device, comprising: a memory storing instructions; and at least one processor configured to execute the instructions to: send information related to a position of first sliced region information in the specimen to a display monitor, the information being identified by comparing the first sliced region information that is a part of a specimen acquired by using X-rays with shape information of the specimen. ### Claim 18 (depends on 17) The control device according to claim 17, wherein the first sliced region information is a first sliced region image representing the first sliced region, and the shape information is a shape image representing a shape of the specimen; and wherein at least one processor configured to execute the instructions to: identify a position of the first sliced region in the specimen by using the first sliced region image and the shape image. ### Claim 19 (depends on 18) The control device according to claim 18, wherein a shape included in the first sliced region is obtained from the first sliced region image, and wherein at least one processor configured to execute the instructions to: identify the position of the first sliced region information in the specimen. ### Claim 20 (depends on 17) The control device according to claim 17, wherein the shape information is design information of the specimen.