# US 10,481,023 B2 · Mechanical quantity measuring device and sensor unit > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,481,023 B2 - Document ID: US10481023B2 - Status: Granted - Kind: B2 - Application number: 15/107,246 - Filed: 2015-01-26 - Published: 2017-04-20 - Granted: 2019-11-19 - Earliest claimed: 2014-01-30 - Assignees: Hitachi Automotive Systems, Ltd. - Applicants: Hitachi Automotive Systems, Ltd. - Inventors: Hanae Shimokawa; Hiroyuki Oota; Atsushi Kazama; Shohei Hata; Takuto Yamaguchi; Atsuo Soma; Kisho Ashida; Junji Onozuka; Kentarou Miyajima; Masayuki Hio - Web page: https://patentgrep.com/patent/US10481023B2 ## CPC - G01L 9/0048: {Details about the mounting of the diaphragm to its support or about the diaphragm edges, e.g. notches, round shapes for stress relief} - G01L 19/04: Means for compensating for effects of changes of temperature {, i.e. other than electric compensation} - G01L 19/147: {Details about the mounting of the sensor to support or covering means} - H10W 72/5449: {not being orthogonal to a side surface of the chip, e.g. fan-out arrangements} - H10W 72/884: {Die-attach connectors and bond wires} - H10W 72/932: {Plan-view shape, i.e. in top view} - G01L: MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE (weighing G01G) - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A mechanical quantity measuring device includes: a sensor chip having a strain detector formed on a surface of a semiconductor substrate and a plurality of electrodes connected to the strain detector; a stem having ascot that protrudes from an adjacent peripheral portion and has an upper surface that is attached to a lower surface of the sensor chip by a bonding material formed from a metallic material or a glass material; a lead-out wiring part including a plurality of wires that are electrically connected to the plurality of electrodes; and a fixing part for fixing the stem, wherein: the stem and the fixing part are integrally molded or fixed through metallic bonding or mechanical bonding. ## Claims ### Claim 1 A mechanical quantity measuring device comprising: a sensor chip having a strain detector formed on a surface of a semiconductor substrate and a plurality of electrodes; a stem having a seat that protrudes from an adjacent peripheral portion and has an upper surface that is attached to a lower surface of the sensor chip by a bonding material formed from a metallic material or a glass material; a lead-out wiring part including a plurality of wires that are electrically connected to the plurality of electrodes; and a fixing part configured to fix the stem, wherein: the stem and the fixing part are metallically bonded to one another, the stem is a rectangular-shaped plate member, the seat has a rectangular shape larger than the sensor chip, and the sensor chip is bonded to the stem via the bonding material, the bonding material including solder containing Sn-3.5 wt %, Ag-0.5 wt %, or Au-20 wt %. ### Claim 2 (depends on 1) The mechanical quantity measuring device according to claim 1, wherein: the fixing part is an object to be measured that has a larger area than that of the stem and fixes the peripheral portion of the stem. ### Claim 3 (depends on 2) The mechanical quantity measuring device according to claim 2, wherein: a region in the stem where the seat is formed has higher rigidity than rigidity of the peripheral portion. ### Claim 4 (depends on 1) The mechanical quantity measuring device according to claim 1, wherein: a groove that is narrower than the seat and protrudes beyond an outer circumference of the seat is formed in a surface of the stem that is a reverse side of a surface to which the sensor chip is bonded. ### Claim 5 (depends on 4) The mechanical quantity measuring device according to claim 4, wherein: the groove is formed across the seat from its one side to its opposite side. ### Claim 6 (depends on 5) The mechanical quantity measuring device according to claim 5, wherein: the groove that extends across the seat is formed so that one end and another end of the groove do not extend beyond the peripheral portion of the stem. ### Claim 7 (depends on 4) The mechanical quantity measuring device according to claim 4, wherein: the stem has at least a pair of groove parts that is parallel to or perpendicular to the groove and is formed in the peripheral portion adjacent to the seat. ### Claim 8 (depends on 4) The mechanical quantity measuring device according to claim 4, wherein: the stem has a frame-like groove part that surrounds the seat and is formed in the peripheral portion adjacent to the seat. ### Claim 9 (depends on 1) The mechanical quantity measuring device according to claim 1, wherein: the fixing part is formed as a cylindrical pressure introducing part. ### Claim 10 (depends on 9) The mechanical quantity measuring device according to claim 9, wherein: the fixing part has an opening that exposes at least part of a surface of the stem that is a reverse side of a surface to which the sensor chip is bonded; and the sensor chip measures pressure inside the cylindrical fixing part. ### Claim 11 (depends on 9) The mechanical quantity measuring device according to claim 9, wherein: a metal layer is formed at at least one of the upper surface of the seat and the lower surface of the sensor chip. ### Claim 12 (depends on 9) The mechanical quantity measuring device according to claim 9, wherein: the bonding material is formed so that its outer peripheral portion reaches at least part of an outer circumference of the seat. ### Claim 13 (depends on 1) The mechanical quantity measuring device according to claim 1, wherein: the seat is formed on the stem by means of film formation. ### Claim 14 (depends on 1) The mechanical quantity measuring device according to claim 1, wherein: a height of the seat from the adjacent peripheral portion is 300 μm or less.