# US 10,480,994 B2 · Electronic housing including a grooved cover > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,480,994 B2 - Document ID: US10480994B2 - Status: Granted - Kind: B2 - Application number: 15/611,266 - Filed: 2017-06-01 - Published: 2018-03-01 - Granted: 2019-11-19 - Earliest claimed: 2016-08-26 - Assignees: STMicroelectronics (Grenoble 2) SAS - Applicants: STMicroelectronics (Grenoble 2) SAS - Inventors: Karine Saxod; Jean-Michel Riviere - Web page: https://patentgrep.com/patent/US10480994B2 ## CPC - G01J 1/0271: {Housings; Attachments or accessories for photometers} - G01J 1/0403: {Mechanical elements; Supports for optical elements; Scanning arrangements} - G01V 8/10: Detecting, e.g. by using light barriers (by reflection from the object G01S17/00) - H05K 1/18: structurally associated with non-printed electric components (H05K1/16 takes precedence) - H05K 3/284: {for encapsulating mounted components (H05K1/185 takes precedence)} - H10F 55/25: wherein the radiation-sensitive devices and the electric light source are all semiconductor devices - H10F 77/50: Encapsulations or containers (for photovoltaic modules H10F19/80) - H10W 90/00: Package configurations - H05K 2201/10151: Sensor - H05K 2201/10378: Interposers - G01J: MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY (light sources F21, H01J, H01K, H05B; investigating properties of materials by optical means G01N) - G01V: GEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS (means for indicating the location of accidentally buried, e.g. snow-buried, persons A63B29/02) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A microchip has a rear face attached to a front mounting face of a support plate. An encapsulation cover for the microchip is mounted to the support plate. The encapsulation cover includes a front wall, a peripheral wall extending from the front wall and an inside partition extending from the front wall and between opposite sides of the peripheral wall. The inside partition passes locally above the microchip to delimit two cavities. A bonding material is interposed between encapsulation cover and the support plate and microchip. An end part of the inside partition of the cover, adjacent to the front face of the microchip, include an accumulation and containment recess that is configured to at least partly receive the bonding material. ## Claims ### Claim 1 An apparatus, comprising: a support plate having a front mounting face; at least one microchip having a rear face attached to the front mounting face of the support plate and having a front face; an encapsulation cover for said at least one microchip, the encapsulation cover including a peripheral wall, a front wall and an inside partition passing locally above said at least one microchip and delimiting two cavities; and a bonding material interposed between the support plate and the peripheral wall so as to attach the peripheral wall to the support plate and further interposed between the at least one microchip and the inside partition of the cover so as to attach the inside partition to the front face of the at least one microchip; wherein at least an end part of the inside partition of the encapsulation cover adjacent to the front face of the at least one microchip includes at least one accumulation and containment recess configured to at least partly receive the bonding material; and wherein said at least one microchip includes light radiation sensors located on opposite sides of said inside partition, wherein the front wall of the encapsulation cover includes a first opening facing a sensor located in one of the two cavities, and wherein another of the two cavities includes another microchip attached to the support plate, this another microchip including a light radiation emitter, and wherein the front wall of the encapsulation cover further includes a second opening facing the light radiation emitter. ### Claim 2 (depends on 1) The apparatus according to claim 1, wherein at least a portion of said inside partition of the encapsulation cover is attached by the bonding material to the front face of the at least one microchip. ### Claim 3 (depends on 1) The apparatus according to claim 1, wherein said at least one accumulation and containment recess comprises a groove extending longitudinally along a bottom surface of the inside partition. ### Claim 4 (depends on 3) The apparatus according to claim 3, wherein said groove extends at least above the front face of the at least one microchip and between opposite edges of the at least one microchip. ### Claim 5 (depends on 1) The apparatus according to claim 1, wherein the peripheral wall and the inside partition of the encapsulation cover have edges which are located at a distance from the front face of the support plate and flanks of the at least one microchip, and wherein the bonding material includes layers between the peripheral wall and the front face and between the inside partition and the flanks of the at least one microchip. ### Claim 6 (depends on 1) The apparatus according to claim 1, wherein said at least one accumulation and containment recess includes at least one main groove extending longitudinally along a bottom surface of the inside partition and further includes secondary grooves extending longitudinally along the bottom surface of the inside partition parallel to and located on opposite sides of the at least one main groove. ### Claim 7 (depends on 6) The apparatus according to claim 6, wherein a depth of the main groove is greater than a depth of the secondary grooves. ### Claim 8 (depends on 1) The apparatus according to claim 1, wherein the end part of the inside partition, adjacent to the front face of the at least one microchip, includes at least one opening extending transversely to the inside partition to form a vent. ### Claim 9 (depends on 1) The apparatus according to claim 1, wherein the cover and the bonding material are opaque. ### Claim 10 (depends on 1) The apparatus according to claim 1, further including light transmissive elements mounted in said first and second openings. ### Claim 11 An apparatus, comprising: a support plate having a front mounting face; a microchip having a rear face attached to the front mounting face of the support plate and a front face including a first optical sensor and a second optical sensor; an encapsulation cover including a front wall, a peripheral wall projecting from the front wall and an inside partition projecting from the front wall and extending between opposite sides of said peripheral wall; wherein the peripheral wall is mounted by an adhesive to the front mounting face; wherein the inside partition is mounted by an adhesive to a front face of the microchip in a position that extends between the first and second optical sensors; and wherein a bottom edge of the inside partition adjacent to the front face of the microchip includes at least one accumulation and containment recess configured to at least partly receive the adhesive material and constrain the received adhesive material from creeping towards either of the first and second optical sensors; and wherein said first and second optical sensors of said microchip are located on opposite sides of said inside partition, wherein the front wall of the encapsulation cover includes a first opening facing the first optical sensor located in one of the two cavities, and wherein another of the two cavities includes another microchip attached to the support plate, this another microchip including a light radiation emitter, and wherein the front wall of the encapsulation cover further includes a second opening facing the light radiation emitter. ### Claim 12 (depends on 11) The apparatus of claim 11, wherein the least one accumulation and containment recess comprises: at least one main groove extending longitudinally along the bottom edge of the inside partition; and secondary grooves extending longitudinally along the bottom edge of the inside partition parallel to and located on opposite sides of the at least one main groove. ### Claim 13 (depends on 12) The apparatus of claim 12, wherein a depth of the at least one main groove is greater than a depth of the secondary grooves. ### Claim 14 (depends on 11) The apparatus of claim 11, wherein the least one accumulation and containment recess comprises: a first main groove extending longitudinally along the bottom edge of the inside partition; a second main groove extending longitudinally along the bottom edge of the inside partition parallel to the first main groove; and a first secondary groove extending longitudinally along the bottom edge of the inside partition parallel to and located between the first and second main grooves. ### Claim 15 (depends on 14) The apparatus of claim 14, wherein a depth of the first and second main grooves is greater than a depth of the secondary groove. ### Claim 16 (depends on 11) The apparatus of claim 11, wherein said inside partition includes opposed side walls extending between the bottom edge of the inside partition and the front wall, and further including a vent in communication with the at least one accumulation and containment recess and extending between the opposed side walls. ### Claim 17 (depends on 11) The apparatus of claim 11, further including light transmissive elements mounted in said first and second openings. ### Claim 18 An apparatus, comprising: a support plate having a front mounting face; a microchip having a rear face attached to the front mounting face of the support plate and a front face; an encapsulation cover including a front wall, a peripheral wall projecting from the front wall and an inside partition projecting from the front wall and extending between opposite sides of said peripheral wall; wherein the peripheral wall is mounted by an adhesive to the front mounting face; wherein the inside partition is mounted by an adhesive to a front face of the microchip; and wherein a bottom edge of the inside partition adjacent to the front face of the microchip includes at least one accumulation and containment recess configured to at least partly receive the adhesive material, said at least one accumulation and containment recess comprising: at least one main groove extending longitudinally along the bottom edge of the inside partition; and secondary grooves extending longitudinally along the bottom edge of the inside partition parallel to and located on opposite sides of the at least one main groove; wherein a depth of the at least one main groove is greater than a depth of the secondary grooves. ### Claim 19 (depends on 18) The apparatus of claim 18, wherein said inside partition includes opposed side walls extending between the bottom edge of the inside partition and the front wall, and further including a vent in communication with the at least one accumulation and containment recess and extending between the opposed side walls. ### Claim 20 An apparatus, comprising: a support plate having a front mounting face; a microchip having a rear face attached to the front mounting face of the support plate and a front face; an encapsulation cover including a front wall, a peripheral wall projecting from the front wall and an inside partition projecting from the front wall and extending between opposite sides of said peripheral wall; wherein the peripheral wall is mounted by an adhesive to the front mounting face; wherein the inside partition is mounted by an adhesive to a front face of the microchip; and wherein a bottom edge of the inside partition adjacent to the front face of the microchip includes at least one accumulation and containment recess configured to at least partly receive the adhesive material, said at least one accumulation and containment recess comprising: a first main groove extending longitudinally along the bottom edge of the inside partition; a second main groove extending longitudinally along the bottom edge of the inside partition parallel to the first main groove; and a first secondary groove extending longitudinally along the bottom edge of the inside partition parallel to and located between the first and second main grooves; wherein a depth of the first and second main grooves is greater than a depth of the secondary groove. ### Claim 21 (depends on 20) The apparatus of claim 20, wherein said inside partition includes opposed side walls extending between the bottom edge of the inside partition and the front wall, and further including a vent in communication with the at least one accumulation and containment recess and extending between the opposed side walls.