# US 10,480,993 B2 · Cylindrical package > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,480,993 B2 - Document ID: US10480993B2 - Status: Granted - Kind: B2 - Application number: 14/794,882 - Filed: 2015-07-09 - Published: 2016-08-04 - Granted: 2019-11-19 - Earliest claimed: 2015-01-29 - Assignees: Ezconn Corporation - Applicants: Ezconn Corporation - Inventors: Mao-Chieh Hsu; Shih-Lung Hsu; Jia-Cong Yu; Chin-Yin Lan - Web page: https://patentgrep.com/patent/US10480993B2 ## CPC - G01J 1/0271: {Housings; Attachments or accessories for photometers} - G01J 1/0403: {Mechanical elements; Supports for optical elements; Scanning arrangements} - G01J 1/0407: {Optical elements not provided otherwise, e.g. manifolds, windows, holograms, gratings} - G01J 1/0488: {with spectral filtering} - G01J 1/4228: {arrangements with two or more detectors, e.g. for sensitivity compensation} - G01J 9/0246: {Measuring optical wavelength} - G01J 2009/0257: {multiple, e.g. Fabry Perot interferometer} - G01J: MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY (light sources F21, H01J, H01K, H05B; investigating properties of materials by optical means G01N) ## Abstract A cylindrical package includes a cylindrical housing; a pedestal at a bottom of a cylindrical space surrounded by the cylindrical housing; an optical splitter in the cylindrical space and over the pedestal; a first photodetector in the cylindrical space and over the pedestal, wherein the first photodetector is configured to be optically coupled to the optical splitter; and a second photodetector in the cylindrical space and over the pedestal, wherein the second photodetector is configured to be optically coupled to the optical splitter. ## Claims ### Claim 1 A cylindrical package comprising: a cylindrical housing; a pedestal at a bottom of a cylindrical space surrounded by said cylindrical housing; a first circuit board in said cylindrical space, wherein said first circuit board has a working surface substantially parallel to a central axis of said cylindrical housing; an optical splitter in said cylindrical space, wherein said optical splitter has an incident surface configured to receive a main optical beam coaxial with said central axis and split said main optical beam into a first split optical beam and a second split optical beam; a first photodetector in said cylindrical space, wherein said first photodetector is configured to optically couple to said first split optical beam; a second photodetector in said cylindrical space, wherein said second photodetector is configured to optically couple to said second split optical beam; and a thermal-electric cooler in said cylindrical space and on said pedestal, wherein said second photodetector is attached onto said thermal-electric cooler; wherein said optical splitter, the first photodetector and the second photodetector are mounted onto said working surface, wherein said first split optical beam and said second split optical beam are substantially parallel to said working surface, wherein said second photodetector comprises a second circuit board with a bottom surface attached onto said thermal-electric cooler and a sidewall attached onto said working surface and a photosensitive chip on a top surface of said second circuit board, wherein said photosensitive chip optically couples to said second split optical beam. ### Claim 2 (depends on 1) The cylindrical package of claim 1 further comprising multiple pins passing through said pedestal and protruding from a top surface of said pedestal and a bottom surface of said pedestal. ### Claim 3 (depends on 1) The cylindrical package of claim 1, wherein said optical splitter has an incident surface configured to receive said main optical beam at an angle of incidence between 30 and 60 degrees. ### Claim 4 (depends on 1) The cylindrical package of claim 1 further comprising an optical interferometer in said cylindrical space, wherein said optical interferometer is in an optical path between said optical splitter and said second photodetector. ### Claim 5 (depends on 4) The cylindrical package of claim 4, wherein said optical interferometer comprises an Etalon filter. ### Claim 6 (depends on 1) The cylindrical package of claim 1, wherein said first circuit board has a sidewall attached onto said thermal-electric cooler. ### Claim 7 (depends on 1) The cylindrical package of claim 1 further comprising an optical lens optically coupling to said optical splitter, wherein said optical lens is in an optical path of said main optical beam. ### Claim 8 (depends on 1) The cylindrical package of claim 1 further comprising an optical interferometer in said cylindrical space, wherein said optical interferometer is in an optical path between said optical splitter and said second photodetector, wherein said optical interferometer is configured to receive said second split optical beam to be reflected alternately between two reflective layers of said optical interferometer multiple times so as to generate interfered optical beams of said second split optical beam, wherein said second photodetector is configured to detect an optical intensity of said interfered optical beams of said second split optical beam, and said first photodetector is configured to detect an optical intensity of said first split optical beam. ### Claim 9 (depends on 1) The cylindrical package of claim 1 is configured for a wavelength locker. ### Claim 10 A cylindrical package comprising: a cylindrical housing; a pedestal at a bottom of a cylindrical space surrounded by the cylindrical housing; a thermal-electric cooler in said cylindrical space and on said pedestal; a first circuit board in said cylindrical space, wherein said first circuit board has a working surface substantially parallel to a central axis of said cylindrical housing and a sidewall attached onto said thermal-electric cooler; a photodetector in the cylindrical space, wherein said photodetector has a bottom surface attached onto said thermal-electric cooler and a sidewall attached onto said working surface, wherein said photodetector comprises a second circuit board with a bottom surface attached onto said thermal-electric cooler and a sidewall attached onto said working surface and a photosensitive chip on a top surface of said second circuit board; and an optical splitter in said cylindrical space and on said working surface, wherein said photodetector is configured to optically couple to said optical splitter. ### Claim 11 (depends on 10) The cylindrical package of claim 10, wherein said first circuit board comprises a ceramic substrate. ### Claim 12 (depends on 10) The cylindrical package of claim 10, wherein said optical splitter has an incident surface configured to receive a main optical beam coaxial with said central axis and split said main optical beam into multiple split optical beams, wherein one of said split optical beams optically couples to said photodetector. ### Claim 13 (depends on 10) The cylindrical package of claim 10 further comprising multiple pins passing through said pedestal and protruding from a top surface of said pedestal and a bottom surface of said pedestal. ### Claim 14 (depends on 10) The cylindrical package of claim 10 further comprising an optical interferometer in said cylindrical space and on said working surface, wherein said optical interferometer is in an optical path between said optical splitter and said photodetector. ### Claim 15 (depends on 14) The cylindrical package of claim 14, wherein said optical interferometer comprises an Etalon filter.