# US 10,480,833 B2 · Heat-transferring and electrically connecting device and electronic device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,480,833 B2 - Document ID: US10480833B2 - Status: Granted - Kind: B2 - Application number: 15/801,505 - Filed: 2017-11-02 - Published: 2018-05-24 - Granted: 2019-11-19 - Earliest claimed: 2016-11-21 - Assignees: STMicroelectronics (Crolles 2) SAS; STMicroelectronics S.r.l. - Applicants: STMicroelectronics (Crolles 2) SAS; STMicroelectronics SA - Inventors: Rafael Augusto Prieto Herrera; Jean-Philippe Colonna; Perceval Coudrain - Web page: https://patentgrep.com/patent/US10480833B2 ## CPC - F25B 15/00: Sorption machines, plants or systems, operating continuously, e.g. absorption type - F28F 3/00: Plate-like or laminated elements; Assemblies of plate-like or laminated elements (specially adapted for movement F28F5/00) - G06F 1/20: Cooling means - H05K 7/2029: {using a liquid coolant with phase change in electronic enclosures (in cabinets of standardized dimensions H05K7/20536; in server cabinets H05K7/20709; in vehicle electronic casings H05K7/20845; in power control electronics H05K7/2089; in displays H05K7/20954)} - H05K 7/2039: {characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00)} - H10W 40/735: {by melting or evaporation of solids} - H10W 40/77: Auxiliary members characterised by their shape - H10W 70/688: {Flexible insulating substrates} - F25B: REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS - F28F: DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION (water and air traps, air venting F16) - G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A heat-transferring device is formed by a stack that includes at least one heat-conducting layer and at least one heat-absorbing layer. The at least one heat-conducting layer has at least one heat-collecting section placed facing a heat source and at least one heat-evacuating section placed facing a heat sink. The at least one heat-absorbing layer includes a phase-change material. One face of the at least one heat-absorbing layer is adjoined to at least one portion of at least one face of the heat-conducting layer. ## Claims ### Claim 1 A heat-transferring device, comprising a stack, said stack including: a plurality of heat-conducting layers having a first length, the plurality of heat-conducting layers including: at least one heat-collecting section of a first face of a given one of the plurality of heat-conducting layers and configured to be placed facing a heat source; and at least one heat-evacuating section of the first face of the given one of the plurality of heat-conducting layers and configured to be placed facing a heat sink; and a plurality of heat-absorbing layers having a second length, each heat-conducting layer being between two of the plurality of heat-absorbing layers, each heat-absorbing layer including a phase-change material; wherein the second length is less than the first length: wherein the plurality of heat-conducting layers and plurality of heat-absorbing layers are physically arranged such that first and second opposing ends of each heat-conducting layer extend beyond each heat-absorbing layer, and such that the first and second opposing ends of each of the heat-conducting layers are pinched so that the first ends of each of the heat-conducting layers make contact with one another and so that the second ends of each of the heat-conducting layers make contact with one another: wherein the at least one heat-collecting section of the first face of the given one of the plurality of heat-conducting layers is located at the first end of the given one of the plurality of heat-conducting layers: and wherein the at least one heat-evacuating section of the first face of the given one of the plurality of heat-conducting layers is located at the second end of the given one of the plurality of heat-conducting layers. ### Claim 2 (depends on 1) The device according to claim 1, wherein the stack comprises an alternation of a plurality of said heat-conducting layers and a plurality of said heat-absorbing layers. ### Claim 3 (depends on 1) The device according to claim 1, wherein said plurality of heat-conducting layers each comprise a metal sheet or a sheet made of graphite. ### Claim 4 (depends on 1) The device according to claim 1, wherein said plurality of heat-conducting layers each comprise at least one sheet made of a heat-conducting material and at least one face of which is covered with a layer made of an electrically insulating material. ### Claim 5 (depends on 1) The device according to claim 1, wherein said plurality of heat-absorbing layers each comprise at least one jacket containing the phase-change material. ### Claim 6 (depends on 5) The device according to claim 5, wherein said jacket is made of a flexible electrically insulating material. ### Claim 7 (depends on 1) The device according to claim 1, wherein said phase-change material comprises a material selected from the group consisting of an organic material, a metallic material and a mineral material. ### Claim 8 (depends on 1) The device according to claim 1, wherein said stack takes the form of a flexible strip. ### Claim 9 A heat-transferring and electrically connecting device, comprising: a heat-transferring device comprising a stack, said stack including: a plurality of heat-conducting layers having a first length, the plurality of heat-conducting layers including: at least one heat-collecting section of a first face of a given one of the plurality of heat-conducting layers and configured to be placed facing a heat source; and at least one heat-evacuating section of the first face of the given one of the plurality of a heat-conducting layers and configured to be placed facing a heat sink; and a plurality of heat-absorbing layers having a second length, each heat-conducting layer being between two of the plurality of heat-absorbing layers, each heat-absorbing layer including a phase-change material; wherein the second length is less than the first length: wherein the plurality of heat-conducting layers and plurality of heat-absorbing layers are physically arranged such that first and second opposing ends of each heat-conducting layer extend beyond each heat-absorbing layer, and such that the first and second opposing ends of each of the heat-conducting layers are pinched so that the first ends of each of the heat-conducting layers make contact with one another and so that the second ends of each of the heat-conducting layers make contact with one another: wherein the at least one heat-collecting section of the first face of the given one of the plurality of heat-conducting layers is located at the first end of the given one of the plurality of heat-conducting layers: wherein the at least one heat-evacuating section of the first face of the given one of the plurality of heat-conducting layers is located at the second end of the given one of the plurality of heat-conducting layers: and at least one electrically connecting layer. ### Claim 10 (depends on 9) The device according to claim 9, wherein said electrically connecting layer is placed on the first face of one of the plurality of heat-conducting layers. ### Claim 11 (depends on 9) The device according to claim 9, wherein said electrically connecting layer comprises a sheet made of an electrically insulating material, in which an electrically connecting network is included. ### Claim 12 (depends on 9) The device according to claim 9, wherein said one heat-collecting section and said one heat-evacuating section of the given one of the plurality of heat-conducting layers has at least one face covered by at least one of the plurality of heat-absorbing layers. ### Claim 13 (depends on 9) The device according to claim 9, wherein each of the plurality of heat-conducting layers comprise a metal sheet or a sheet made of graphite. ### Claim 14 (depends on 9) The device according to claim 9, wherein each of the plurality of heat-conducting layers comprised of at least one sheet made of a heat-conducting material and at least one face of which is covered with a layer made of an electrically insulating material. ### Claim 15 (depends on 9) The device according to claim 9, wherein each of the plurality of heat-absorbing layers comprised of at least one jacket containing the phase-change material. ### Claim 16 (depends on 15) The device according to claim 15, wherein said jacket is made of a flexible electrically insulating material. ### Claim 17 (depends on 9) The device according to claim 9, wherein said phase-change material comprises a material selected from the group consisting of an organic material, a metallic material and a mineral material. ### Claim 18 (depends on 9) The device according to claim 9, wherein said stack takes the form of a flexible strip. ### Claim 19 An electronic device, comprising: at least one electrical or electronic component; and at least one heat-transferring device comprising a stack, said stack including: a plurality of heat-conducting layers having a first length, the plurality of heat-conducting layers including: at least one heat-collecting section of a first face of a given one of the plurality of the heat-conducting layers and configured to be placed facing a heat source, the at least one heat-collecting section being located on a first end of the first face; and at least one heat-evacuating section of the first face of the given one of the plurality of the heat-conducting layers and configured to be placed facing a heat sink, the at least one heat-evacuating section being located on a second end of the first face, the second end of the first face being spaced apart from the first end of the first face along a length of the given one of the plurality of heat-conducting layers, the length of the given one of the plurality of heat-conducting layers being greater than a width of and a thickness of the given one of the plurality of heat-conducting layers; a plurality of heat-absorbing layers having a second length, each heat-conducting layer being between two of the plurality of heat-absorbing layers, each heat-absorbing layer including a phase-change material and one face that is adjoined to a second face of a corresponding one of the plurality of heat-conducting layers; wherein the second length is less than the first length; wherein the plurality of heat-conducting layers and plurality of heat-absorbing layers are physically arranged such that first and second opposing ends of each heat-conducting layer extend beyond each heat-absorbing layer, and such that the first and second opposing ends of each of the heat-conducting layers are pinched so that the first ends of each of the heat-conducting layers make contact with one another and so that the second ends of each of the heat-conducting layers make contact with one another; wherein the at least one heat-collecting section of the first face of the given one of the plurality of heat-conducting layers is located at the first end of the given one of the plurality of heat-conducting layers; wherein the at least one heat-evacuating section of the first face of the given one of the plurality of heat-conducting layers is located at the second end of the given one of the plurality of heat-conducting layers; and at least one electrically connecting layer; said at least one electrical or electronic component being mounted above said at least one heat-collecting section of said given one of the plurality of heat-conducting layers and electrically connected to said at least one electrically connecting layer; and a heat-dissipating member mounted above said at least one heat-evacuating section of said given one of the plurality of heat-conducting layers. ### Claim 20 (depends on 19) The device according to claim 19, wherein said electrically connecting layer is placed on a first face of the given one of the plurality of heat-conducting layers. ### Claim 21 (depends on 19) The device according to claim 19, wherein said electrically connecting layer comprises a sheet made of an electrically insulating material, in which an electrically connecting network is included, said at least one electrical or electronic component electrically connected to the electrically connecting network. ### Claim 22 (depends on 19) The device according to claim 19, wherein said heat-dissipating member comprises a printed circuit board, said printed circuit board being electrically connected to said electrically connecting layer. ### Claim 23 (depends on 19) The device according to claim 19, wherein said at least one electrical or electronic component comprises an electronic chip. ### Claim 24 (depends on 19) The device according to claim 19, wherein the heat-dissipating member is directly mechanically connected to the at least one heat-evacuation section of the given one of the plurality of heat-conducting layers. ### Claim 25 (depends on 19) The device according to claim 19, wherein the second end of the first face is spaced apart from the first end of the first face along an entirety of the length of the given one of the plurality of heat-conducting layers.