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US 10,480,611 B2Granted
Method for improved semiconductor processing equipment tool pedestal / pad vibration isolation and reduction
OwnerSuk K. Kim-Whittyinventor
Life of this patent
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Abstract
The present disclosure provides a method, system, and fabrication facility that eliminates or substantially reduces process-limiting vibrations within a high-precision device manufacturing facility, wherein an elevated structure supports high-precision device manufacturing equipment and provides vibration reduction spacing between a floor and an upper surface of said elevated structure.
Claims11
A method for eliminating, or substantially reducing, process-limiting vibrations within a high-precision device manufacturing facility, comprising:
- using a hybrid tool pedestal system for supporting high-precision device manufacturing equipment and provides vibration reduction spacing between a floor and an upper surface of an elevated structure, the method comprising of the following steps:
- separating a base of said elevated structure from the floor using first vibration isolation pad structure;
- filling a hollow portion of a vertical support structure with a vibration dampening materials, said vertical support structure separating said base from said upper surface and further comprising concrete mix to reduce/isolate vibration and improve stiffness;
- separating said vertical support structure from the upper surface of said elevated structure using a second vibration isolation pad structure;
- wherein said first vibration isolation pad structure, said vibration dampening materials, and said second vibration isolation pad structure coordinate to eliminate, or substantially reduce, the ability of vibrations from the floor to reach high-precision device manufacturing equipment operating on the upper surface of said elevated structure;
- and
- adding an EMI insulation or absorbing material added to said vertical support structure and
- performing a degaussing process on said vertical support structure for removing magnetic arc blow to create said hybrid tool pedestal with EMI barrier;
- caulking a solid composite vibration isolation plate between a plurality of points of connections between said solid composite vibration isolation plate and said tool pedestal pad, and a raised floor system providing a floor upon which rests said hybrid tool pedestal system;
- applying a sound proofing adhesive to selected joints associated with said vertical support structure;
- and
- caulking said solid composite vibration isolation plate between the points of contact and the vertical support structure for further isolation of vibration frequencies transmitted through a building structure within which occurs said method for eliminating, or substantially reducing, process-limiting vibrations.
9 more elements
A vibration isolation and reducing system for eliminating or substantially reducing process-limiting vibrations within a high-precision device manufacturing facility, comprising:
- a hybrid tool pedestal system for supports high-precision device manufacturing equipment and provides vibration reduction spacing between a floor and an upper surface of said an elevated structure, the hybrid tool pedestal system comprising:
- first vibration isolation pad structure for separating a base of said elevated structure from the floor;
- a vibration dampening material for filling a hollow portion of a vertical support structure, said vertical support structure separating said base from said upper surface and further comprising of additional materials to be added into a concrete mix to improve/reduce/isolate vibration and improve stiffness;
- a second vibration isolation pad structure for separating said vertical support structure from the upper structure of said elevated structure;
- wherein said first vibration isolation pad structure, said vibration dampening material, and said second vibration isolation pad structure coordinate to eliminate, or substantially reduce, the ability of vibrations from the floor to reach high-precision device manufacturing equipment operating on the upper surface of said elevated structure;
- and further
- an EMI barrier applied to the hybrid tool pedestal system formed by adding EMI insulation or absorbing material and performing a degaussing step on said hybrid tool pedestal for removing magnetic arc blow relating to use of said hybrid tool pedestal system;
- and
- an structural bracing of “X” style, wherein the system extends from said floor to a ceiling of existing or outdated buildings to stiffen the existing building and to meet newer tool vibration requirements such as advance lithograph tools, where the optional structural bracing of “X” style works in conjunction with an extended hybrid tool pedestal, wherein a base of the extended hybrid tool pedestal extends from the floor of a sub process level to above a process level to meet extended vibration requirements, wherein along with the extended hybrid tool pedestal, additional horizontal structural members are added for future service of tooling, such as a service crane for semiconductor production process tools, and wherein the base of the extended hybrid tool pedestal varies due to different multiple levels per each semiconductor facility.
6 more elements
A high-precision device manufacturing facility having eliminated, or substantially reduced, process-limiting vibrations there within, comprising:
- a plurality of hybrid tool pedestal structures for supporting high-precision device manufacturing equipment and providing vibration reduction spacing between a floor and an upper surface of an elevated structure, selected ones of said plurality elevated structures further comprising:
- first vibration isolation pad structure for separating a base of said elevated structure from the floor;
- a vibration dampening material for filling a hollow portion of a vertical support structure, said vertical support structure separating said base from said upper surface;
- a second vibration isolation pad structure for separating said vertical support structure from the upper surface of said elevated structure;
- wherein said first vibration isolation pad structure, said vibration dampening material, and said second vibration isolation pad structure coordinate to eliminate, or substantially reduce, the ability of vibrations from the floor to reach high-precision device manufacturing equipment operating on the upper surface of said elevated structure;
- and further
- an EMI barrier applied to said plurality of hybrid tool pedestal structures formed by adding EMI insulation or absorbing material and performing a degaussing step on said hybrid tool pedestal for removing magnetic arc blow relating to use of said hybrid tool pedestal;
- and
- said vibration dampening material placed between the point of connections for tool pedestal/pad and a raised floor system upon which rests said hybrid tool pedestal system;
- said vibration dampening material applied to selected joints associated with said vertical support structure;
- and said vibration dampening material placed at points of contact
- between the vertical support structure for further isolation of vibration frequencies transmitted through a building structure within which said high-precision device manufacturing facility operates.
9 more elements
Dependencies are inferred from the claim text.