# US 10,480,092 B2 · Apparatus and method of contact electroplating of isolated structures

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- Number: US 10,480,092 B2
- Document ID: US10480092B2
- Status: Granted
- Kind: B2
- Application number: 16/190,314
- Filed: 2018-11-14
- Published: 2019-04-18
- Granted: 2019-11-19
- Earliest claimed: 2016-07-18
- Assignees: Ecsi Fibrotools, Inc.
- Applicants: ECSI Fibrotools, Inc.
- Inventors: Igor V. Kadija
- Web page: https://patentgrep.com/patent/US10480092B2

## CPC

- C25D 5/18: Electroplating using modulated, pulsed or reversing current
- C25D 5/02: Electroplating of selected surface areas
- C25D 5/06: Brush or pad plating
- C25D 5/20: Electroplating using ultrasonic waves
- C25D 7/123: {Semiconductors first coated with a seed layer or a conductive layer}
- C25D 17/005: {Contacting devices}
- C25D 17/14: for pad-plating
- H05K 3/241: {characterised by the electroplating method; means therefor, e.g. baths or apparatus}
- H10P 14/47: Electrolytic deposition, i.e. electroplating; Electroless plating
- H10W 20/043: {for electroplating}
- H10W 20/056: {by filling conductive material into holes, grooves or trenches}
- H10W 70/05: of insulating or insulated package substrates, or of interposers, or of redistribution layers (manufacture or treatment of leadframes H10W70/04)
- C25D 17/001: {Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells}
- H05K 3/188: {by direct electroplating}
- C25D: PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

The presently disclosed apparatus and method offer the capability to electroplate pure metals or alloys onto substrates, having no current collectors or being connected to the power supply by a low conductivity seed layer. Thus, the disclosed system enables pure metal or alloy deposition on various substrates, including flexible electronic circuits, wafers for IC processing, and discrete electronic devices in surface finishing applications.

## Claims

### Claim 1

A method of electroplating metal onto a substrate, the method comprising:
immersing an apparatus for electroplating a metal onto a substrate in an electroplating solution comprising the metal to be electroplated, wherein the apparatus comprises:
a substrate comprising a seed pattern with a resistance of 0.001 Ω·cm-100,000 Ω·cm;
a working electrode comprising fine flexible metal mesh, metal fiber cloth, metal fiber with polymer thread, or metal web, wherein the working electrode has a thickness of 1.5 mm or less;
a counter electrode comprising fine metal mesh, metal fiber cloth, metal web, or metal mesh; and
a chemically inert porous and flexible material that directly contacts both the working electrode and the counter electrode;
positioning current collectors to link both electrodes to a respective polarity of a power supply;
activating the power supply;
electroplating 1-2 microns of the metal onto the fine metal mesh, metal fiber cloth, or metal web of the working electrode;
deactivating the power supply;
positioning the apparatus to establish uniform intimate contact with the substrate such that the fine flexible metal mesh, metal fiber cloth, metal web, or metal fiber with polymer thread of the working electrode directly contacts the chemically inert porous and flexible material and directly contacts the seed pattern of the substrate, wherein the chemically inert porous and flexible material is configured to compress the metal mesh, metal fiber cloth, metal web, or metal fiber with polymer thread of the working electrode;
proceeding with DC or reverse pulse electroplating for about 2 to 120 seconds to achieve conductivity specified for a single or multiple conveyorized step processing of the seed pattern;
moving the apparatus to remove the uniform intimate contact with the substrate after the DC or reverse pulse electroplating or proceeding with a next step of conveyorized processing; and
optionally introducing a new substrate.

### Claim 2 (depends on 1)

The method of claim 1, further comprising initiating a vibratory motion in the apparatus to enable exchange of matter at an apparatus/substrate interface prior to the proceeding with DC or reverse pulse electroplating.

### Claim 3 (depends on 1)

The method of claim 1, wherein the apparatus is arranged horizontally or vertically.

### Claim 4 (depends on 1)

The method of claim 1, wherein the working electrode and counter electrode are constructed from gold, silver, copper, nickel, palladium, platinum, titanium, stainless steel, cobalt, thallium, tantalum, rhodium, iridium, ruthenium, osmium or alloys of gold, alloys of silver, alloys of copper, tungsten, vanadium, alloys of nickel, alloys of palladium, alloys of platinum, platinized titanium, platinum clad niobium or tantalum, gold plated stainless steel, copper, nickel, or combinations thereof.

### Claim 5 (depends on 1)

The method of claim 1, wherein the chemically inert porous and flexible material is selected from the group comprising porous polymer sponge, pile cloth material, or combinations thereof.

### Claim 6 (depends on 1)

The method of claim 1, wherein the chemically porous and flexible material has a porosity of at least 40%.

### Claim 7 (depends on 1)

The method of claim 1, wherein the apparatus is formed in a pad configuration or a roller configuration.

### Claim 8 (depends on 1)

The method of claim 1, wherein the apparatus comprises a detachable perforated compressing pad constructed from a chemically stable rigid polymer material to exert uniform compression.

### Claim 9 (depends on 1)

The method of claim 1, wherein the fine flexible metal mesh of the working electrode, the fine metal mesh of the counter electrode, or both are platinized titanium, nickel, gold-plated copper, or stainless steel.

### Claim 10 (depends on 1)

The method of claim 1, further comprising a recirculation element to provide and recirculate electrolyte through the apparatus.

### Claim 11 (depends on 1)

The method of claim 1, further comprising an internal element to provide electrolyte or metal ions to a dry substrate upon contact.

### Claim 12 (depends on 1)

The method of claim 1, wherein the power supply is connected to the respective polarity of each electrode, and wherein the power supply has a forward and reverse pulse capability of about 0.01 to 5000 Hertz.

### Claim 13 (depends on 1)

The method of claim 1, wherein the apparatus further comprises a compression element to enable uniform compression and vibratory motion of the apparatus in the frequency range of 1-100 Hertz and amplitude in the range of 0.64-6.4 mm.

### Claim 14 (depends on 1)

The method of claim 1, wherein the apparatus further comprises a flip-over device synchronized with a power supply.

### Claim 15 (depends on 1)

The method of claim 1, wherein the working electrode is configured to be parallel to the substrate when in use.

### Claim 16 (depends on 1)

The method of claim 1, wherein the apparatus is configured to electroplate the patterned seed layer with a thickness of 0.1-10 microns of desired metal.

### Claim 17 (depends on 1)

The method of claim 1, wherein the seed pattern comprises metal, carbon, toner, or combinations thereof.

### Claim 18 (depends on 1)

The method claim 1, wherein the working electrode is porous and has a porosity of about 30-99%.

### Claim 19 (depends on 1)

The method of claim 1, wherein the working electrode, counter electrode, or both are constructed from wires with a diameter of about 10 micron to about 1.0 millimeter.

### Claim 20 (depends on 1)

The method of claim 1, wherein the working electrode, counter electrode, or both are constructed from wires with a diameter of about 10 nanometers to about 1.0 millimeter.