# US 10,479,913 B2 · Silicone composition and a pressure sensitive adhesive film having a pressure sensitive adhesive layer made from the composition

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- Number: US 10,479,913 B2
- Document ID: US10479913B2
- Status: Granted
- Kind: B2
- Application number: 15/518,660
- Filed: 2015-09-28
- Published: 2017-08-17
- Granted: 2019-11-19
- Earliest claimed: 2014-10-16
- Assignees: Dow Silicones Corporation
- Applicants: Dow Corning Corporation
- Inventors: Kyungdong Han; Gunn Jo; Bokyung Kim
- Web page: https://patentgrep.com/patent/US10479913B2

## CPC

- C09J 7/38: Pressure-sensitive adhesives [PSA]
- C08K 3/36: Silica
- C08L 83/04: Polysiloxanes
- C09J 183/04: Polysiloxanes
- C08G 77/12: containing silicon bound to hydrogen
- C08G 77/20: containing silicon bound to unsaturated aliphatic groups
- C09J 183/14: in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms (C09J183/10 takes precedence)
- C09J 2301/302: the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
- C09J 2400/10: Presence of inorganic materials
- C09J 2467/006: in the substrate
- C09J 2471/006: in the substrate
- C09J 2479/086: in the substrate
- C09J 2483/00: Presence of polysiloxane
- C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H)
- C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09)
- C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06)
- C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS

## Abstract

A pressure sensitive adhesive film comprises a substrate film and a pressure sensitive adhesive (PSA) layer formed on a surface of the substrate film. The PSA layer is formed from a silicone composition comprising: a diorganopolysiloxane having at least two alkenyl groups in a molecule and having a viscosity at 25° C. of from 10,000 to 1,000,000 mPa·s; (B) a diorganopolysiloxane having at least one alkenyl group in a molecule, and being raw and rubber-like at 25° C. or having a viscosity at 25° C. of more than 1,000,000 mPa·s; (C) an organopolysiloxane resin represented by the following average unit formula: (R13SiO1/2)x(SiO4/2)1.0, wherein each R1 represents a halogen-substituted or unsubstituted monovalent hydrocarbon group free from an alkenyl group and x is a number from 0.5 to 1.0; (D) an organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule; (E) silica fine powder; and (F) a hydrosilylation catalyst.

## Claims

### Claim 1

A silicone composition comprising:
(A) a diorganopolysiloxane having at least two alkenyl groups in a molecule and having a viscosity at 25° C. of from 10,000 to 1,000,000 mPa·s, in an amount of from 60 to 80 mass % based on the mass of the composition;
(B) a diorganopolysiloxane having at least one alkenyl group in a molecule, and being raw and rubber-like at 25° C. or having a viscosity at 25° C. of more than 1,000,000 mPa·s, in an amount of from greater than 0 to 10 mass % based on the mass of the composition;
(C) an organopolysiloxane resin represented by the following average unit formula:
(R13SiO1/2)x(SiO4/2)1.0
wherein each R1 represents a halogen-substituted or un-substituted monovalent hydrocarbon group free from an alkenyl group and x is a number from 0.5 to 1.0, in an amount of from 0.5 to 20 mass % based on the mass of the composition;
(D) an organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule, in a quantity that provides from 0.1 to 10 moles of the silicon-bonded hydrogen atoms in this component per 1 mole of the total alkenyl groups in the composition;
(E) silica fine powder in an amount of from 0.5 to 5 mass % based on the mass of the composition; and
(F) a hydrosilylation catalyst in a quantity that accelerates hydrosilylation of the composition.

### Claim 2 (depends on 1)

The silicone composition of claim 1, further comprising (G) an anchorage additive, in an amount of from 0.1 to 5 mass % based on the mass of the composition.

### Claim 3 (depends on 1)

The silicone composition of claim 1, further comprising (H) a reaction inhibitor, in an amount of from 0.1 to 5 mass % based on the mass of the composition.

### Claim 4 (depends on 1)

The silicone composition of claim 1, further comprising (I) an organic solvent, in an amount such that nonvolatile content in its solution is from 10 to 80 mass % based on the mass of the composition.

### Claim 5

A pressure sensitive adhesive film comprising a substrate film and a pressure sensitive adhesive layer on a surface of the substrate film, said pressure sensitive adhesive layer formed from a silicone composition comprising:
(A) a diorganopolysiloxane having at least two alkenyl groups in a molecule and having a viscosity at 25° C. of from 10,000 to 1,000,000 mPa·s, in an amount of from 60 to 80 mass % based on the mass of the composition;
(B) a diorganopolysiloxane having at least one alkenyl group in a molecule, and being raw and rubber-like at 25° C. or having a viscosity at 25° C. of more than 1,000,000 mPa·s, in an amount of from greater than 0 to 10 mass % based on the mass of the composition;
(C) an organopolysiloxane resin represented by the following average unit formula:
(R13SiO1/2)x(SiO4/2)1.0
wherein each R1 represents a halogen-substituted or un-substituted monovalent hydrocarbon group free from an alkenyl group and x is a number from 0.5 to 1.0, in an amount of from 0.5 to 20 mass % based on the mass of the composition;
(D) an organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule, in a quantity that provides from 0.1 to 10 moles of the silicon-bonded hydrogen atoms in this component per 1 mole of the total alkenyl groups in the composition;
(E) silica fine powder in an amount of from 0.5 to 5 mass % based on the mass of the composition; and
(F) a hydrosilylation catalyst in a quantity that accelerates hydrosilylation of the composition.

### Claim 6 (depends on 5)

The pressure sensitive adhesive film of claim 5, wherein the substrate film is formed from polyimide (PI), polyether-ether ketone (PEEK), polyethylene naphthalate (PEN), liquid-crystal polyarylene, polyamidoimide (PAI), polyether sulfine (PES), or polyethylene terephthalate (PET).

### Claim 7 (depends on 5)

The pressure sensitive adhesive film of claim 5, wherein the pressure sensitive adhesive layer has a thickness of from 5 μm to 10 mm.

### Claim 8 (depends on 5)

The pressure sensitive adhesive film of claim 5, wherein the pressure sensitive adhesive layer has a pencil hardness of not less than H as measured according to ASTM D3363.

### Claim 9 (depends on 2)

The silicone composition of claim 2, further comprising (H) a reaction inhibitor, in an amount of from 0.1 to 5 mass % based on the mass of the composition.

### Claim 10 (depends on 9)

The silicone composition of claim 9, further comprising (I) an organic solvent, in an amount such that nonvolatile content in its solution is from 10 to 80 mass % based on the mass of the composition.

### Claim 11 (depends on 5)

The pressure sensitive adhesive film of claim 5, wherein the silicone composition further comprises (G) an anchorage additive, in an amount of from 0.1 to 5 mass % based on the mass of the composition.

### Claim 12 (depends on 11)

The pressure sensitive adhesive film of claim 11, wherein the silicone composition further comprises (H) a reaction inhibitor, in an amount of from 0.1 to 5 mass % based on the mass of the composition.

### Claim 13 (depends on 12)

The pressure sensitive adhesive film of claim 12, wherein the silicone composition further comprises (I) an organic solvent, in an amount such that nonvolatile content in its solution is from 10 to 80 mass % based on the mass of the composition.

### Claim 14 (depends on 5)

The pressure sensitive adhesive film of claim 5, wherein the silicone composition further comprises (H) a reaction inhibitor, in an amount of from 0.1 to 5 mass % based on the mass of the composition.

### Claim 15 (depends on 5)

The pressure sensitive adhesive film of claim 5, wherein the silicone composition further comprises (I) an organic solvent, in an amount such that nonvolatile content in its solution is from 10 to 80 mass % based on the mass of the composition.

### Claim 16 (depends on 1)

The silicone composition of claim 1, wherein the diorganopolysiloxane (B) is present in an amount of from 1 to 10 mass % based on the mass of the composition.