# US 10,479,910 B2 · Primer composition, adhering method, and electric/electronic part

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- Number: US 10,479,910 B2
- Document ID: US10479910B2
- Status: Granted
- Kind: B2
- Application number: 15/553,407
- Filed: 2016-02-23
- Published: 2018-04-19
- Granted: 2019-11-19
- Earliest claimed: 2015-02-26
- Assignees: Dow Toray Co., Ltd.
- Applicants: Dow Corning Toray Co., Ltd.
- Inventors: Ryosuke Yamazaki; Hiroaki Yoshida; Shin Yoshida
- Web page: https://patentgrep.com/patent/US10479910B2

## CPC

- C09D 183/10: Block or graft copolymers containing polysiloxane sequences (obtained by polymerising a compound having a carbon-to-carbon double bond on to a polysiloxane C09D151/08, C09D153/00)
- C08L 83/10: Block- or graft-copolymers containing polysiloxane sequences (obtained by polymerising a compound having a carbon-to-carbon double bond on to a polysiloxane C08L51/08, C08L53/00)
- C09D 5/00: Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced {(electrically insulating plastics, resins or waxes H01B3/30)}; Filling pastes
- C09D 5/002: {Priming paints (C09D5/08 takes precedence)}
- C09D 7/40: Additives
- C08L 2203/20: use in electrical or conductive gadgets
- H10W 72/884: {Die-attach connectors and bond wires}
- H10W 74/00: Encapsulations, e.g. protective coatings
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- C09D: COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR (cosmetics A61K; processes for applying liquids or other fluent materials to surfaces, in general, B05D; staining wood B27K5/02; glazes or vitreous enamels C03C; natural resins, French polish, drying-oils, driers, turpentine, per se, C09F; polishing compositions other than French polish, ski waxes C09G; adhesives or use of materials as adhesives C09J; materials for sealing or packing joints or covers C09K3/10; materials for stopping leaks C09K3/12; processes for the electrolytic or electrophoretic production of coatings C25D)
- C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06)
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A primer composition is provided. The primer composition comprises: (A) an organosiloxane block copolymer represented by the average unit formula: (R12SiO2/2)a(R2SiO3/2)b, wherein each R1 and R2 is independently an alkyl group having 1 to 12 carbon atoms, an aryl group having 6 to 20 carbon atoms, or an aralkyl group having 7 to 20 carbon atoms, “a” is a number in the range of 0.40 to 0.90, “b” is a number in the range of 0.10 to 0.60, and “a+b”=1.00, and having 0.5 to 35.0 mol % of silicon atom-bonded hydroxyl groups or silicon atom-bonded alkoxy groups, in which resinous siloxane blocks are connected by linear siloxane blocks; (B) a curing catalyst; and (C) an organic solvent. The primer composition improves the adhesion of silicone-cured products to base materials of optical semiconductor elements, package materials, substrates etc., and can suppress peeling or cracking caused by heat cycles.

## Claims

### Claim 1

An article comprising a base material, a silicone cured product, and a primer layer adhering the silicone cured product to the base material,
wherein the primer layer comprises the reaction product of a primer composition comprising:
(A) an organosiloxane block copolymer represented by the average unit formula:
(R12SiO2/2)a(R2SiO3/2)b
wherein each R1 and R2 is independently an alkyl group having 1 to 12 carbon atoms, an aryl group having 6 to 20 carbon atoms, or an aralkyl group having 7 to 20 carbon atoms, “a” is a number in the range of 0.40 to 0.90, “b” is a number in the range of 0.10 to 0.60, and “a+b”=1.00, having 0.5 to 35.0 mol % of silicon atom-bonded hydroxyl groups or silicon atom-bonded alkoxy groups, in addition to being a solid at 25° C. and having a softening point of 200° C. or lower, in which resinous siloxane blocks represented by the formula:
[R2SiO3/2]
wherein R2 is the same as above, are connected by linear siloxane blocks represented by the formula:
—(R12SiO2/2)n—
wherein R1 is the same as above, and “n” is a number in the range of 10 to 400;
(B) a curing catalyst, in an amount to promote curing of this composition; and
(C) an organic solvent; and
wherein the silicone cured product comprises the reaction product of a curable silicone composition different from the primer composition.

### Claim 2 (depends on 1)

The article according to claim 1, wherein R1 in component (A) is an alkyl group and/or an aryl group.

### Claim 3 (depends on 1)

The article according to claim 1, wherein R2 in component (A) is an aryl group.

### Claim 4 (depends on 1)

The article according to claim 1, wherein component (B) is a condensation reaction catalyst.

### Claim 5 (depends on 1)

The article according to claim 1, wherein component (C) is an aromatic hydrocarbon based solvent, or a mixed solvent of the aromatic hydrocarbon based solvent and an aliphatic hydrocarbon based solvent.

### Claim 6 (depends on 4)

The article according to claim 4, wherein the primer composition is a condensation reaction curable silicone composition.

### Claim 7 (depends on 6)

The article according to claim 6, wherein the curable silicone composition is a hydrosilylation reaction curable silicone composition.

### Claim 8 (depends on 1)

The article according to claim 1, wherein the base material is an electric/electronic part.

### Claim 9 (depends on 1)

A method of forming the article according to claim 1, with the article comprising the base material, the silicone cured product, and the primer layer adhering the silicone cured product to the base material, the method comprising:
applying the primer composition onto the base material;
removing the organic solvent (C) to obtain the primer layer; and
subsequently applying the curable silicone composition onto the primer layer for curing to form the silicone cured product.

### Claim 10 (depends on 9)

The method according to claim 9, wherein the curable silicone composition and the primer layer are simultaneously cured.

### Claim 11 (depends on 8)

The article according to claim 8, wherein the electric/electronic part is an optical semiconductor apparatus.

### Claim 12 (depends on 2)

The article according to claim 2, wherein R2 in component (A) is an aryl group.