# US 10,479,897 B2 · Producing an apparatus by covering an electronic component with a conformal coating containing metal nanoparticles > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,479,897 B2 - Document ID: US10479897B2 - Status: Granted - Kind: B2 - Application number: 14/156,635 - Filed: 2014-01-16 - Published: 2015-07-16 - Granted: 2019-11-19 - Earliest claimed: 2014-01-16 - Assignees: International Business Machines Corporation - Applicants: International Business Machines Corporation - Inventors: Dylan J. Boday; Joseph Kuczynski; Jason T. Wertz; Jing Zhang - Web page: https://patentgrep.com/patent/US10479897B2 ## CPC - C09D 5/10: containing metal dust - C09D 7/67: {Particle size smaller than 100 nm} - C09D 7/68: {Particle size between 100-1000 nm} - C09D 183/04: Polysiloxanes - C23F 15/00: Other methods of preventing corrosion or incrustation - H05K 1/09: Use of materials for the {conductive, e.g. } metallic pattern - H05K 1/181: associated with surface mounted components - H05K 3/284: {for encapsulating mounted components (H05K1/185 takes precedence)} - C08K 3/015: Biocides (macromolecular substances as carriers for biocide material A01N25/10) - C08K 2003/0806: {Silver} - C08K 2003/085: {Copper} - C09D 5/084: {Inorganic compounds} - H05K 3/285: {Permanent coating compositions} - H05K 2201/0215: Metallic fillers - H05K 2201/0257: Nanoparticles - H05K 2201/09872: Insulating conformal coating - H05K 2201/10022: Non-printed resistor - H05K 2201/10636: Leadless chip, e.g. chip capacitor or resistor - Y02P 70/50: Manufacturing or production processes characterised by the final manufactured product - C09D: COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR (cosmetics A61K; processes for applying liquids or other fluent materials to surfaces, in general, B05D; staining wood B27K5/02; glazes or vitreous enamels C03C; natural resins, French polish, drying-oils, driers, turpentine, per se, C09F; polishing compositions other than French polish, ski waxes C09G; adhesives or use of materials as adhesives C09J; materials for sealing or packing joints or covers C09K3/10; materials for stopping leaks C09K3/12; processes for the electrolytic or electrophoretic production of coatings C25D) - C23F: NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE (working metal by laser beams B23K26/00; desurfacing by applying flames B23K7/00; working of metal by electro-erosion B23H; producing decorative effects by removing surface material, e.g. by engraving, by etching, B44C1/22; electrolytic etching or polishing C25F); INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09) - Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS ## Abstract A method for producing an apparatus includes covering an electronic component with a conformal coating that includes a polymer and metal nanoparticles blended with the polymer. The electronic component is mounted on a substrate and electrically connected by metal conductors. The conformal coating overlies the metal conductors. ## Claims ### Claim 1 A method for producing an apparatus, comprising the steps of: providing an electronic component mounted on a substrate and electrically connected by metal conductors; applying a conformal coating composition in an at least partially uncured state over the electronic component and the substrate, wherein the conformal coating composition comprises a polymer and metal nanoparticles blended with the polymer, wherein the metal nanoparticles have an average diameter within the range of 5 nm to 200 nm, and wherein the concentration of the metal nanoparticles in the conformal coating composition is approximately 5 wt % of the conformal coating and provides a level of electrical conduction sufficiently below the electric conducting percolation threshold to avoid shorting of the electronic component and the substrate; and curing the conformal coating composition applied over the electronic component and the substrate to produce a conformal coating that overlies the metal conductors. ### Claim 2 (depends on 1) The method as recited in claim 1, wherein the step of applying a conformal coating composition in an at least partially uncured state over the electronic component and the substrate includes the step of applying the conformal coating composition by dipping, spraying, spin-coating, casting, brushing, rolling, and/or syringe. ### Claim 3 (depends on 1) The method as recited in claim 1, wherein the electronic component is a gate resistor of a resistor network array, and wherein the metal conductors comprise an inner silver layer of the gate resistor. ### Claim 4 (depends on 1) The method as recited in claim 1, wherein the metal nanoparticles are selected from a group consisting of copper nanoparticles and silver nanoparticles; and combinations thereof. ### Claim 5 (depends on 1) The method as recited in claim 1, wherein the metal nanoparticles include copper nanoparticles. ### Claim 6 (depends on 1) The method as recited in claim 1, wherein the metal nanoparticles have an average diameter of approximately 100 nm. ### Claim 7 (depends on 1) The method as recited in claim 1, wherein the polymer includes a room temperature-vulcanizable (RTV) silicone rubber composition. ### Claim 8 A method for producing an apparatus, comprising the steps of: providing an electronic component mounted on a substrate and electrically connected by metal conductors; applying a conformal coating composition in an at least partially uncured state over the electronic component and the substrate, wherein the conformal coating composition comprises a polymer and copper nanoparticles blended with the polymer, wherein the copper nanoparticles have an average diameter of approximately 100 nm, and wherein the copper nanoparticles comprise approximately 5 wt % of the conformal coating composition; and curing the conformal coating composition applied over the electronic component and the substrate to produce a conformal coating that overlies the metal conductors.