# US 10,479,850 B2 · Shape forming process and application thereof for creating structural elements and designed objects

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- Number: US 10,479,850 B2
- Document ID: US10479850B2
- Status: Granted
- Kind: B2
- Application number: 15/645,998
- Filed: 2017-07-10
- Published: 2017-10-26
- Granted: 2019-11-19
- Earliest claimed: 2013-11-15
- Applicants: Robert J. Fleming
- Inventors: Robert J. Fleming
- Web page: https://patentgrep.com/patent/US10479850B2

## CPC

- B29C 64/118: using filamentary material being melted, e.g. fused deposition modelling [FDM]
- B29C 64/106: using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
- B29C 64/135: the energy source being concentrated, e.g. scanning lasers or focused light sources
- B29C 64/188: involving additional operations performed on the added layers, e.g. smoothing, grinding or thickness control (surface shaping B29C59/00; after-treatment of articles without altering their shape B29C71/00)
- B29C 70/021: {Combinations of fibrous reinforcement and non-fibrous material}
- B29D 11/00009: {Production of simple or compound lenses}
- B29D 11/00432: {Auxiliary operations, e.g. machines for filling the moulds (B29D11/00125 takes precedence)}
- B33Y 10/00: Processes of additive manufacturing
- B33Y 80/00: Products made by additive manufacturing
- C03C 25/285: Acrylic resins
- C08F 120/32: containing epoxy radicals
- C08F 122/10: Esters
- C08J 5/08: glass fibres
- H01B 1/20: Conductive material dispersed in non-conductive organic material {(organic macromolecular compounds or compositions C08)}
- H05K 3/0014: {Shaping of the substrate, e.g. by moulding}
- B29K 2105/0002: {monomers or prepolymers}
- B29K 2105/122: {microfibres or nanofibers}
- B29K 2995/0005: Conductive
- B29L 2031/3425: {Printed circuits}
- B33Y 30/00: Apparatus for additive manufacturing; Details thereof or accessories therefor
- C08F 222/103: {of trialcohols, e.g. trimethylolpropane tri(meth)acrylate}
- H05K 1/0284: {Details of three-dimensional rigid printed circuit boards (H05K1/119 takes precedence; shaping of the substrate H05K3/0014)}
- Y10T 428/2933: Coated or with bond, impregnation or core
- B29C: SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING (making preforms B29B11/00; making laminated products by combining previously unconnected layers which become one product whose layers will remain together B32B37/00 - B32B41/00)
- B29D: PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE (making granules B29B9/00; making preforms B29B11/00)
- B33Y: ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- C03C: CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C08F: MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08J: WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H (working, e.g. shaping, of plastics B29)
- H01B: CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES (selection for magnetic properties H01F1/00; waveguides H01P {; printed circuits H05K})
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- B29K: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR {MOULDS, } REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29L: INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

A tool provided that individually creates three-dimensional structural elements which are sequentially positioned into formation of a shaped object.

## Claims

### Claim 1

A device comprising:
a fiber source to supply a continuous length of fiber to one or more target locations;
a fiber guide to control a movement of the fiber from the fiber source along 3-axes and one or more rotational axes;
a resin delivery mechanism positioned to deposit liquefied resin to the one or more target locations and on the fiber;
a rotatable stage to provide rotational movement in X and Y directions for manipulating the fiber at the one or more target locations;
an energy source positioned to provide energy to resin deposited and cured at the given target location, sufficient to liquefy a tip portion; and
a controller to position curation of the deposited resin at the given target location, so that with manipulation of the fiber at the one or more target locations, the liquified resin is structured into a three-dimensional structural element of a larger body.

### Claim 2 (depends on 1)

The device of claim 1, wherein the fiber guide includes a manipulation tip that shapes the fiber.

### Claim 3 (depends on 2)

The device of claim 2, wherein the manipulation tip shapes the fiber prior to depositing of the liquefied resin.

### Claim 4 (depends on 2)

The device of claim 2, wherein the manipulation tip shapes the fiber and liquid resin combination.

### Claim 5 (depends on 4)

The device of claim 4, wherein the manipulation tip shapes the fiber and liquid resin combination prior to curation.

### Claim 6 (depends on 1)

The device of claim 1, wherein the fiber source provides the fiber that is one or more of a glass fiber, carbon fiber, natural fiber, conductive wire, a monofilament, fiber bundle, ribbon, film, or tape.

### Claim 7 (depends on 1)

The device of claim 1, wherein the energy source includes ultraviolet light.

### Claim 8 (depends on 1)

The device of claim 1, wherein a knife or laser is used to cut the three-dimensional structural element after curing.

### Claim 9 (depends on 1)

The device of claim 1, wherein the three-dimensional structural element includes a conductive material.

### Claim 10 (depends on 9)

The device of claim 9, wherein the larger body includes a network of electrical traces formed from the conductive material, the network of electrical traces providing electrical functionality through the conductive material.

### Claim 11 (depends on 1)

The device of claim 1, wherein the liquified resin is a monomer with one or more acrylate, epoxide, isocyanate, or a vinyl reactive group.

### Claim 12 (depends on 11)

The device of claim 11, wherein the liquified resin includes one of a free-radical ultraviolet photoinitiator formulation, or a cationic ultraviolet photoinitiator formulation.