# US 10,479,676 B2 · Apparatus and methods for integrated MEMS devices > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,479,676 B2 - Document ID: US10479676B2 - Status: Granted - Kind: B2 - Application number: 16/102,592 - Filed: 2018-08-13 - Published: 2018-12-06 - Granted: 2019-11-19 - Earliest claimed: 2016-04-04 - Assignees: mCube Inc. - Applicants: mCube, Inc. - Inventors: Ben Lee; Ming Hong Kuo; Wen-Chih Chen; Wensen Tsai - Web page: https://patentgrep.com/patent/US10479676B2 ## CPC - B81C 99/0045: {End test of the packaged device} - B81C 99/005: {Test apparatus} - G01R 1/0433: {Sockets for IC's or transistors} - G01R 31/2607: {Circuits therefor (G01R31/2642 takes precedence)} - H10P 72/0442: {Apparatus for placing on an insulating substrate, e.g. tape} - B81C: PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS (making microcapsules or microballoons B01J13/02; processes or apparatus specially adapted for the manufacture or treatment of piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/01) - G01R: MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES (indicating correct tuning of resonant circuits H03J3/12) - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 ## Abstract A method for a MEMS device includes receiving a diced wafer having a plurality devices disposed upon an adhesive substrate and having an associated known good device data, removing a first set of devices from the plurality of devices from the adhesive substrate in response to the known good device data, picking and placing a first set of the devices into a plurality of sockets within a testing platform, testing the first set of integrated devices includes while physically stressing the first set of devices, providing electrical power to the first set of devices and receiving electrical response data from the first set of devices, determining a second set of devices from the first set of devices, in response to the electrical response data, picking and placing the second set of devices into a transport tape media. ## Claims ### Claim 1 A method comprising: receiving in a receiving stage, a diced wafer having a plurality of integrated devices comprising CMOS and MEMS devices disposed upon an adhesive substrate, wherein the diced wafer is associated with a known good device data associated with the plurality of integrated devices; removing with a first pick and place device, a first set of integrated devices from the plurality of integrated devices from the adhesive substrate in response to the known good device data; placing with the first pick and place device, the first set of integrated devices into a plurality of sockets within a socket substrate; testing with the testing platform, the first set of integrated devices comprising: while physically stressing with the testing platform, the first set of integrated devices, providing with the plurality of sockets, electrical power to the first set of integrated devices and receiving with the plurality of sockets, electrical response data from the first set of integrated devices; determining with a processing unit coupled to the testing platform, a second set of integrated devices from the first set of integrated devices, in response to the electrical response data; removing with a second pick and place device, the second set of integrated devices from the plurality of sockets within the first substrate; and disposing the second set of integrated devices into a transport tape media. ### Claim 2 (depends on 1) The method of claim 1 wherein a number of integrated devices from the second set of integrated devices is equal to or less than a number of integrated devices from the first set of integrated devices. ### Claim 3 (depends on 1) The method of claim 1 physical stressing the first set of integrated devices comprises shaking the first set of integrated devices; and wherein the shaking comprises shaking the testing platform in a direction selected from a group consisting of: x-direction, y-direction, z-direction, x-y-direction, x-z-direction, and y-z direction. ### Claim 4 (depends on 1) The method of claim 1 physical stressing the first set of integrated devices comprises rotating the first set of integrated devices; and wherein the rotating comprises rotating the testing platform along an axis selected from a group consisting of: x-axis, y-axis, z-axis, x-y-axis, x-z-axis, and y-z axis. ### Claim 5 (depends on 1) The method of claim 1 wherein the MEMS devices are selected from a group consisting of: an accelerometer, a gyroscope, a magnetometer and a pressure sensor. ### Claim 6 (depends on 1) The method of claim 1 wherein the determining the second set of integrated devices comprises: comparing with the processing unit the electrical response data from the first set of integrated devices against threshold data to determine comparison data; and determining with the processing unit, the second set of integrated devices from the first set of integrated devices, in response to the comparison data. ### Claim 7 (depends on 6) The method of claim 6 wherein the comparison data indicates a stiction condition associated with an integrated device from the first set of integrated devices. ### Claim 8 (depends on 6) The method of claim 6 wherein the comparison data indicates an out of range condition associated with an integrated device from the first set of integrated devices. ### Claim 9 (depends on 6) The method of claim 6 wherein the comparison data indicates a ringing condition associated with an integrated device from the first set of integrated devices. ### Claim 10 (depends on 1) The method of claim 1 removing with the second pick and place device, remaining integrated devices from the first set of integrated devices not within the second set of integrated devices from the socket substrate; and placing the remaining integrated devices into a disposal region.