# US 10,479,086 B2 · Process for making a molded device assembly and printhead assembly > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,479,086 B2 - Document ID: US10479086B2 - Status: Granted - Kind: B2 - Application number: 16/112,966 - Filed: 2018-08-27 - Published: 2018-12-20 - Granted: 2019-11-19 - Earliest claimed: 2013-06-27 - Assignees: Hewlett-Packard Development Company, L.P. - Applicants: Hewlett-Packard Development Company, L.P. - Inventors: Chien-Hua Chen; Thomas R Strand; Michael G Groh - Web page: https://patentgrep.com/patent/US10479086B2 ## CPC - B41J 2/1637: {molding} - B29C 69/001: {a shaping technique combined with cutting, e.g. in parts or slices combined with rearranging and joining the cut parts (for reinforced material B29C70/545; B29C49/4278, B29C51/268 take precedence)} - B41J 2/14016: {Structure of bubble jet print heads} - B41J 2/1404: {Geometrical characteristics} - B41J 2/14072: {Electrical connections, e.g. details on electrodes, connecting the chip to the outside...} - B41J 2/14145: {Structure of the manifold} - B41J 2/14201: {Structure of print heads with piezoelectric elements} - B41J 2/1433: {Structure of nozzle plates} - B41J 2/155: for line printing - B41J 2/1601: {Production of bubble jet print heads (B41J2/1606, B41J2/162 take precedence)} - B41J 2/1603: {of the front shooter type} - B41J 2/1607: {Production of print heads with piezoelectric elements (B41J2/1606, B41J2/162 take precedence)} - B41J 2/162: {Manufacturing of the nozzle plates} - B41J 2/1623: {bonding and adhesion} - B41J 2/1628: {dry etching} - B41J 2/1632: {machining} - B41J 2/1645: {thin film formation by spincoating} - H05K 1/186: {manufactured by mounting on or connecting to patterned circuits before or during embedding} - H05K 3/284: {for encapsulating mounted components (H05K1/185 takes precedence)} - H05K 3/32: electrically connecting electric components or wires to printed circuits - B41J 2002/14411: {Groove in the nozzle plate} - B41J 2002/14419: {Manifold} - B41J 2002/14491: {Electrical connection} - B41J 2202/19: Assembling head units - B41J 2202/20: Modules - H05K 3/4007: {Surface contacts, e.g. bumps (H05K3/4092 takes precedence; deposition of finish layers on pads H05K3/24; forming solder bumps H05K3/3465)} - H05K 2203/0228: Cutting, sawing, milling or shearing - H05K 2203/1316: Moulded encapsulation of mounted components - B41J: TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS - B29C: SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING (making preforms B29B11/00; making laminated products by combining previously unconnected layers which become one product whose layers will remain together B32B37/00 - B32B41/00) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract In one example, a process for making a micro device assembly includes placing a micro device on a front part of a printed circuit board, molding a molding on the printed circuit board surrounding the micro device, and then forming a channel to the micro device in a back part of the printed circuit board. ## Claims ### Claim 1 A process for making a micro device assembly, comprising: placing a micro device on a front part of a printed circuit board; molding a molding on the printed circuit board surrounding the micro device; and then in a single operation, forming a channel to the micro device in a back part of the printed circuit board and opening a fluid passage in the micro device to the channel. ### Claim 2 (depends on 1) The process of claim 1, wherein forming a channel in the printed circuit board and opening a fluid passage in the micro device in a single operation includes cutting through the back part of the printed circuit board and into the micro device. ### Claim 3 (depends on 2) The process of claim 2, wherein the cutting includes sawing through the back part of the printed circuit board and into the micro device. ### Claim 4 (depends on 3) The process of claim 3, wherein the sawing includes plunging a saw blade through the back part of the printed circuit board and into the micro device. ### Claim 5 (depends on 4) The process of claim 4, wherein the molding includes molding a single monolithic molding on the printed circuit board and over the micro device. ### Claim 6 (depends on 5) The process of claim 5, wherein the molding includes molding the single monolithic molding over part of the micro device. ### Claim 7 A process for making a printhead assembly, comprising: arranging printhead dies on a front face of a printed circuit board; electrically connecting the dies to the printed circuit board; molding a single cover on the printed circuit board surrounding exposed fluid dispensing nozzles on each die; and then forming channels to the dies in a back part of the printed circuit board and opening a fluid passage in each die simultaneously with forming a corresponding channel in the printed circuit board. ### Claim 8 (depends on 7) The process of claim 7, wherein the forming and the opening include sawing through the back part of the printed circuit board to form the channels and into the dies to open the fluid passages. ### Claim 9 (depends on 8) The process of claim 8, wherein the sawing includes plunging a saw blade through the back part of the printed circuit board and into the dies. ### Claim 10 (depends on 7) The process of claim 7, wherein the molding includes molding recesses in the cover molding, or molding bumps in the cover molding, or molding recesses and bumps in the cover molding. ### Claim 11 (depends on 7) The process of claim 7, wherein: the electrically connecting includes wire bonding terminals on the dies to terminals on the printed circuit board; and the molding includes molding a cover on the printed circuit board surrounding exposed fluid dispensing nozzles on each die and completely covering the wire bonds. ### Claim 12 A printhead assembly, comprising: a printed circuit board; a printhead die sliver mounted to a front part of the printed circuit board, the die sliver having fluid ejectors, fluid chambers each near an ejector, passages in a back part of the die through which fluid may flow to the chambers, and nozzles at a front part of the die sliver through which fluid may be ejected from the chambers; a molding covering the printed circuit board and surrounding the nozzles at the front part of the die sliver; and a single channel that extends through the back part of the printed circuit board and into the back part of the die sliver to the passages in the die sliver. ### Claim 13 (depends on 12) The printhead assembly of claim 12, wherein: the printhead die sliver includes multiple printhead die slivers each mounted to a front part of the printed circuit board and each having fluid ejectors, fluid chambers each near an ejector, passages in a back part of the die sliver through which fluid may flow to the chambers, and nozzles at a front part of the die sliver through which fluid may be ejected from the chambers; the molding is a single monolithic molding covering the printed circuit board and surrounding the nozzles at the front part of each of the die slivers; and the single channel includes multiple single channels each extending through the back part of the printed circuit board and into the back part of a corresponding one of the die slivers to the passages in the die sliver. ### Claim 14 (depends on 13) The printhead assembly of claim 13, wherein the die slivers are arranged generally end to end along a length of the printhead in a staggered configuration in which each die sliver overlaps another die sliver. ### Claim 15 (depends on 1) The process of claim 1, wherein: placing a micro device on a front part of a printed circuit board comprises placing a single printhead die on the front part of the printer circuit board; molding a molding on the printed circuit board surrounding the micro device comprises molding a molding on the printed circuit board surrounding the single die and over part of the single die; and forming a channel to the micro device in a back part of the printed circuit board and opening a fluid passage in the micro device to the channel in a single operation comprises forming a channel to the single die in the back part of the printed circuit board and opening a fluid passage in the single die in a single operation. ### Claim 16 (depends on 1) The process of claim 1, wherein: placing a micro device on a front part of a printed circuit board comprises placing multiple printhead dies on the front part of the printed circuit board in a staggered configuration in which each die overlaps another die; molding a molding on the printed circuit board surrounding the micro device comprises molding a molding on the printed circuit board surrounding each die and over part of the each die; and forming a channel to the micro device in a back part of the printed circuit board and opening a fluid passage in the micro device to the channel in a single operation comprises, in one single operation or in each of multiple single operations, forming multiple channels in a back part of the printed circuit board each to a corresponding one or more of the dies and opening a fluid passage in each die to the corresponding channel.