# US 10,479,084 B2 · Method for manufacturing liquid ejection head > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,479,084 B2 - Document ID: US10479084B2 - Status: Granted - Kind: B2 - Application number: 15/586,113 - Filed: 2017-05-03 - Published: 2017-08-17 - Granted: 2019-11-19 - Earliest claimed: 2013-09-09 - Assignees: Canon Kabushiki Kaisha - Applicants: Canon Kabushiki Kaisha - Inventors: Seiichiro Yaginuma; Keiji Matsumoto; Koji Sasaki - Web page: https://patentgrep.com/patent/US10479084B2 ## CPC - B41J 2/1632: {machining} - B41J 2/1603: {of the front shooter type} - B41J 2/162: {Manufacturing of the nozzle plates} - B41J 2/1623: {bonding and adhesion} - B41J 2/1626: {etching} - B41J 2/1628: {dry etching} - B41J 2/1629: {wet etching} - B41J 2/1631: {photolithography} - B41J 2/1634: {laser machining} - B41J 2/1635: {dividing the wafer into individual chips} - B41J 2/1639: {sacrificial molding} - B41J 2/1646: {thin film formation by sputtering} - Y10T 29/49401: Fluid pattern dispersing device making, e.g., ink jet - B41J: TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract A method for manufacturing liquid ejection heads includes the steps of forming ejection port members on a substrate, the ejection port members each having a liquid channel and an ejection port for ejecting liquid through the channel, the liquid channel communicating with the substrate; forming supply ports passing through the substrate to supply liquid to the channels; and forming a separation groove in the substrate to separate the substrate for each liquid ejection head. The step of forming the ejection port members includes the step of hardening a material constituting the ejection port member by heat treatment. The step of forming the separation groove is performed before the step of hardening. ## Claims ### Claim 1 A method for manufacturing liquid ejection heads, comprising the steps of: forming ejection port members on a substrate, the ejection port members each having a liquid channel and an ejection port for ejecting liquid through the liquid channel, the liquid channel communicating with the substrate; forming supply ports passing through the substrate to supply liquid to the channels; forming separation grooves in the substrate to separate the substrate for each liquid ejection head, the separation grooves not penetrating the substrate; in a state that the separation grooves are not penetrating the substrate, cutting the substrate for each liquid ejection head along the separation grooves; and forming a supporting member on the substrate, wherein the step of forming the ejection port members includes the step of hardening a material constituting the ejection port members by heat treatment, wherein the step of forming the separation groove is performed before the step of hardening, wherein the step of cutting the substrate is performed after the step of forming the ejection port members, wherein, the supply ports are formed to pass through the substrate, and the supply ports and the separation grooves are formed not to pass through the supporting member; and wherein the substrate is formed of silicon. ### Claim 2 (depends on 1) The method for manufacturing liquid ejection heads according to claim 1, wherein in the step of forming the separation groove, the separation groove is formed in the substrate by processing the substrate from a surface on which the ejection port members are to be formed. ### Claim 3 (depends on 1) The method for manufacturing liquid ejection heads according to claim 1, wherein the step of forming the supply ports and the step of forming the separation groove are performed in a same process. ### Claim 4 (depends on 1) The method for manufacturing liquid ejection heads according to claim 1, wherein the substrate has thereon an energy generating device that imparts energy for ejecting liquid to the liquid; the step of forming the supply ports and the step of forming the separation grooves are performed in a same process; and in the same process, the substrate is left in such a manner as to enclose the energy generating device. ### Claim 5 (depends on 1) The method for manufacturing liquid ejection heads according to claim 1, further comprising the step of separating the substrate and the supporting member from each other after the step of hardening. ### Claim 6 (depends on 1) The method for manufacturing liquid ejection heads according to claim 1, further comprising the step of forming second supply ports in the supporting member, the second supply ports communicating with the supply ports. ### Claim 7 (depends on 1) The method for manufacturing liquid ejection heads according to claim 1, wherein a material constituting the substrate and the material constituting the ejection port members differ from each other. ### Claim 8 (depends on 1) The method for manufacturing liquid ejection heads according to claim 1, wherein the supporting member has high thermal conductivity to uniformly dissipate heat. ### Claim 9 (depends on 1) The method for manufacturing liquid ejection heads according to claim 1, wherein the supporting member includes at least one of resin, ceramic, metal, and semiconductor. ### Claim 10 (depends on 9) The method for manufacturing liquid ejection heads according to claim 9, wherein the resin is at least one of polyethylene terephthalate, polyurethane, polyimide, polyamide, polycarbonate, polyphenylenether, epoxy resin, fluororesin, and acrylic resin. ### Claim 11 (depends on 9) The method for manufacturing liquid ejection heads according to claim 9, wherein the ceramic is at least one of carbon graphite, glass, aluminum oxide, and aluminum nitride. ### Claim 12 (depends on 9) The method for manufacturing liquid ejection heads according to claim 9, wherein the metal is at least one of stainless steel, aluminum, copper, and iron. ### Claim 13 (depends on 9) The method for manufacturing liquid ejection heads according to claim 9, wherein the semiconductor is at least one of silicon and silicon carbide. ### Claim 14 (depends on 9) The method for manufacturing liquid ejection heads according to claim 9, wherein the separation grooves are formed not to pass the substrate.