# US 10,479,083 B2 · Peeling method of cover member and manufacturing method of liquid ejecting head > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,479,083 B2 - Document ID: US10479083B2 - Status: Granted - Kind: B2 - Application number: 15/830,384 - Filed: 2017-12-04 - Published: 2018-06-14 - Granted: 2019-11-19 - Earliest claimed: 2016-12-13 - Assignees: Seiko Epson Corporation - Applicants: Seiko Epson Corporation - Inventors: Tatsuro Hotta - Web page: https://patentgrep.com/patent/US10479083B2 ## CPC - B32B 3/266: {characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12} - B41J 2/1607: {Production of print heads with piezoelectric elements (B41J2/1606, B41J2/162 take precedence)} - B32B 3/30: characterised by a layer formed with recesses or projections, e.g. {hollows, grooves, protuberances, ribs (apertured layer B32B3/266; layer with cavities or internal voids B32B3/26)} - B32B 7/06: permitting easy separation - B32B 7/08: by mechanical means - B32B 7/12: using interposed adhesives or interposed materials with bonding properties - B32B 9/04: comprising such {particular} substance as the main or only constituent of a layer, {which is} next to another layer of {the same or of} a {different material (next to a glass layer B32B17/06; layered products with at least two ceramic layers composed mainly of ceramic B32B18/00)} - B32B 9/041: {of metal} - B32B 9/043: {of natural rubber or synthetic rubber} - B32B 9/045: {of synthetic resin} - B32B 27/28: comprising synthetic resins not wholly covered by any one of the sub-groups {B32B27/30 - B32B27/42} - B32B 27/286: {comprising polysulphones; polysulfides} - B32B 27/42: comprising condensation resins of aldehydes, e.g. with phenols, ureas or melamines - B32B 37/02: characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations - B32B 38/10: Removing layers, or parts of layers, mechanically or chemically - B32B 43/006: {Delaminating} - B41J 2/161: {of film type, deformed by bending and disposed on a diaphragm} - B41J 2/1623: {bonding and adhesion} - B41J 2/1626: {etching} - B41J 2/1628: {dry etching} - B41J 2/1629: {wet etching} - B41J 2/1631: {photolithography} - B41J 2/1632: {machining} - B41J 2/1642: {thin film formation by CVD [chemical vapor deposition]} - B41J 2/1646: {thin film formation by sputtering} - B32B 2307/202: Conductive - B32B 2307/546: Flexural strength; Flexion stiffness - B32B 2386/00: Specific polymers obtained by polycondensation or polyaddition not provided for in a single one of index codes B32B2363/00 - B32B2383/00 - B32B 2457/14: Semiconductor wafers - B81C 1/00047: {Cavities} - B81C 1/00055: {Grooves} - B81C 2201/053: Depositing a protective layers - B81C 2203/0136: Growing or depositing of a covering layer - B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM - B41J: TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS - B81C: PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS (making microcapsules or microballoons B01J13/02; processes or apparatus specially adapted for the manufacture or treatment of piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/01) ## Abstract Disclosed is a peeling method of a cover member including forming a recessed portion that opens one side surface of a substrate, on a region different from a region in which a pattern is formed and forming an opening region including the opening of the recessed portion; attaching the cover member so as to cover the one side surface; adjusting a pressure for increasing a pressure within a space formed by the recessed portion and the cover member by attaching the cover member to the substrate to be higher than a pressure on a side opposite to the space with the cover member interposed therebetween; and peeling off the cover member from the substrate, in a state where the pressure within the space is increased by the adjusting of the pressure. ## Claims ### Claim 1 A method for peeling a cover member off of a substrate, the method comprising: forming a recessed portion that opens to one side surface of a substrate, wherein the recessed portion does not completely penetrate the substrate and is formed in a region of the substrate different from a region in which a pattern is formed in the substrate, and forming an opening region including the opening of the recessed portion, on the one side surface of the substrate; attaching the cover member so as to cover the one side surface of the substrate including the opening region and the pattern; adjusting a pressure for increasing a pressure within a space formed by the recessed portion and the attached cover member to be higher than a pressure on a side opposite to the space with the cover member interposed therebetween; and peeling off the cover member from the substrate, in a state where the pressure within the space is increased by the adjusting of the pressure. ### Claim 2 (depends on 1) The method according to claim 1, wherein in the peeling off of the cover member, a region, which is a surface of the cover member on a side opposite to the substrate, and includes at least a part of a region that overlaps with the opening region of the substrate, is pulled in a direction away from the substrate when viewed in a plan view from a stacking direction of the cover member and the substrate. ### Claim 3 (depends on 2) The method according to claim 2, wherein the region for pulling the cover member includes a portion adjacent to the opening region in a region closer to an outer periphery side of the substrate than the opening region when viewed in a plan view from the stacking direction of the cover member and the substrate. ### Claim 4 (depends on 1) The method according to claim 1, wherein in the adjusting of the pressure, the pressure within the space is increased by heating the substrate. ### Claim 5 (depends on 4) The method according to claim 4, wherein a temperature of the substrate in the adjusting of the pressure is higher than a temperature of the substrate in the attaching of the cover member. ### Claim 6 (depends on 1) The method according to claim 1, wherein a temperature of the substrate after the attaching of the cover member before the adjusting of the pressure is lower than a temperature of the substrate of the attaching of the cover member. ### Claim 7 (depends on 1) The method according to claim 1, wherein in the forming of the opening region, a plurality of the groove-shaped recessed portions are juxtaposed in a direction intersecting an extension direction of the recessed portions. ### Claim 8 (depends on 1) The method according to claim 1, wherein in the forming of the opening region, a plurality of columns in which the plurality of the recessed portions are juxtaposed are arranged in a direction intersecting a juxtaposing direction in which the recessed portions are juxtaposed. ### Claim 9 (depends on 1) The method according to claim 1, wherein the peeling off of the cover member includes moving gas within the space to an outer periphery of an interface between the substrate and the cover member, and pinching and peeling off an end portion of the cover member which is peeled off from the substrate, by the gas moved in the moving of the gas. ### Claim 10 (depends on 1) A manufacturing method of a liquid ejecting head comprising: the method according to claim 1. ### Claim 11 (depends on 2) A manufacturing method of a liquid ejecting head comprising: the method according to claim 2. ### Claim 12 (depends on 3) A manufacturing method of a liquid ejecting head comprising: the method according to claim 3. ### Claim 13 (depends on 4) A manufacturing method of a liquid ejecting head comprising: the method according to claim 4. ### Claim 14 (depends on 5) A manufacturing method of a liquid ejecting head comprising: the method according to claim 5. ### Claim 15 (depends on 6) A manufacturing method of a liquid ejecting head comprising: the method according to claim 6. ### Claim 16 (depends on 7) A manufacturing method of a liquid ejecting head comprising: the method according to claim 7. ### Claim 17 (depends on 8) A manufacturing method of a liquid ejecting head comprising: the method according to claim 8. ### Claim 18 (depends on 9) A manufacturing method of a liquid ejecting head comprising: the method according to claim 9.