# US 10,479,079 B2 · Liquid ejecting head and liquid ejecting apparatus

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- Number: US 10,479,079 B2
- Document ID: US10479079B2
- Status: Granted
- Kind: B2
- Application number: 15/845,833
- Filed: 2017-12-18
- Published: 2018-06-28
- Granted: 2019-11-19
- Earliest claimed: 2016-12-22
- Assignees: Seiko Epson Corporation
- Applicants: Seiko Epson Corporation
- Inventors: Satoshi Kimura; Hitoshi Matsumoto; Wataru Takahashi; Satoshi Suzuki
- Web page: https://patentgrep.com/patent/US10479079B2

## CPC

- B41J 2/1433: {Structure of nozzle plates}
- B41J 2/1408: {Structure dealing with thermal variations, e.g. cooling device, thermal coefficients of materials}
- B41J 2/14274: {of stacked structure type, deformed by compression/extension and disposed on a diaphragm}
- B41J 2/1612: {of stacked structure type, deformed by compression/extension and disposed on a diaphragm}
- B41J 2002/14362: {Assembling elements of heads}
- B41J 2202/08: dealing with thermal variations, e.g. cooling
- B41J: TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS

## Abstract

A liquid ejecting head (recording head) includes a structure (flow path member) having a plurality of stacked plates (a nozzle plate, a flow path plate, and a diaphragm) in which end surfaces at both sides in one direction are aligned. At least two plates of the plates (the nozzle plate, the flow path plate, and the diaphragm) have different coefficients of linear expansion in the one direction, and holding members are fixed to the end surfaces of the structure (flow path member) at both sides in the one direction, the holding members having stiffness higher than stiffness of a plate having the highest coefficient of linear expansion in the one direction among the plates (the nozzle plate, the flow path plate, and the diaphragm).

## Claims

### Claim 1

A liquid ejecting head comprising:
a structure having a plurality of stacked plates in which end surfaces at both sides in one direction are aligned, at least two plates of the plurality of staked plates have different coefficients of linear expansion in the one direction; and
holding members configured to fix to and directly contact the structure at the end surfaces thereof at both sides in the one direction, the holding members having stiffness higher than stiffness of a plate having the highest coefficient of linear expansion in the one direction among the plates,
wherein each of the holding members has a recessed portion, the recessed portion includes a first surface facing an upper surface of the structure and a second surface facing a lower surface.

### Claim 2 (depends on 1)

The liquid ejecting head according to claim 1, wherein the end surfaces of the structure are fit in the recessed portions.

### Claim 3 (depends on 2)

A liquid ejecting apparatus comprising:
a liquid ejecting head according to claim 2.

### Claim 4 (depends on 1)

The liquid ejecting head according to claim 1, wherein the recessed portion includes a third surface facing the end surface of the structure, the end surface of the structure is in contact with the third surface of the recessed portion.

### Claim 5 (depends on 4)

A liquid ejecting apparatus comprising:
a liquid ejecting head according to claim 4.

### Claim 6 (depends on 4)

The liquid ejecting head according to claim 4, wherein the first surface of the recessed portion is inclined with respect to the upper surface of the structure, and the second surface of the recessed portion is inclined with respect to the lower surface of the structure.

### Claim 7 (depends on 6)

The liquid ejecting head according to claim 6, wherein a filler is provided in a space between the upper surface of the structure and the first surface, and a filler is provided in a space between the lower surface of the structure and the second surface.

### Claim 8 (depends on 1)

The liquid ejecting head according to claim 1, wherein a filler is provided between the structure and the holding members.

### Claim 9 (depends on 8)

A liquid ejecting apparatus comprising:
a liquid ejecting head according to claim 8.

### Claim 10 (depends on 1)

The liquid ejecting head according to claim 1, wherein in the structure including the plates, a plate contains silicon as a main component and a plate contains a metal as a main component.

### Claim 11 (depends on 10)

A liquid ejecting apparatus comprising:
a liquid ejecting head according to claim 10.

### Claim 12 (depends on 1)

A liquid ejecting apparatus comprising:
a liquid ejecting head according to claim 1.

### Claim 13 (depends on 1)

The liquid ejecting head according to claim 1, wherein the holding members are fixed to and directly contact the structure at the end surfaces thereof without the need for an adhesive to fix the holding members to the at least two plates.

### Claim 14 (depends on 1)

The liquid ejecting head according to claim 1, wherein the at least two plates comprise at least three plates, wherein a first plate of the three plates is sandwiched between the other two plates of the three plates, the first plate having a lower coefficient of linear expansion in the one direction than the other two plates.

### Claim 15 (depends on 1)

The liquid ejecting head according to claim 1, wherein the at least two plates comprise at least three plates, wherein a first plate of the three plates is sandwiched between the other two plates of the three plates, the first plate comprising a different material than the other two plates.

### Claim 16 (depends on 1)

The liquid ejecting head according to claim 1, wherein the first surface of the recessed portion is inclined with respect to the upper surface of the structure, the second surface of the recessed portion is inclined with respect to the lower surface of the structure, and the structure is held between the first surface and the second surface.

### Claim 17 (depends on 16)

The liquid ejecting head according to claim 16, wherein a filler is provided in a space surrounded by the end surface of the structure, the first surface and the second surface.
