# US 10,479,061 B2 · Component bonding device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,479,061 B2 - Document ID: US10479061B2 - Status: Granted - Kind: B2 - Application number: 14/743,305 - Filed: 2015-06-18 - Published: 2015-12-24 - Granted: 2019-11-19 - Earliest claimed: 2014-06-23 - Assignees: Panasonic Intellectual Property Management Co., Ltd. - Applicants: Panasonic Intellectual Property Management Co., Ltd. - Inventors: Akira Kameda; Shinjiro Tsuji - Web page: https://patentgrep.com/patent/US10479061B2 ## CPC - B32B 37/0046: {characterised by constructional aspects of the apparatus} - B25J 15/0052: {multiple gripper units or multiple end effectors} - B25J 15/0616: {with vacuum} - B30B 15/30: Feeding material to presses - B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM - B25J: MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES ({manipulators specially adapted for use in surgery A61B34/70; manipulators used in cleaning hollow articles B08B9/04}; manipulators associated with rolling mills B21B39/20; manipulators associated with forging machines B21J13/10; {manipulators associated with picking-up and placing mechanisms B23P19/007}; means for holding wheels or parts thereof B60B30/00; {vehicles with ground-engaging propulsion means, e.g. walking members B62D57/02, B62D57/032; devices for picking-up and depositing articles or materials between conveyors B65G47/90, B65G47/91; manipulators with gripping or holding means for transferring packages B65H67/065}; cranes B66C; {manipulators used in the protection or supervision of pipe-line installations F17D5/00; walking equipment adapted for nuclear steam-generators F22B37/006}; manipulators specially adapted for, or associated with, nuclear reactors G21C; {apparatus used for handling wafers during manufacture or treatment of semiconductor H10P72/50}) - B30B: PRESSES IN GENERAL (producing ultra-high pressure or ultra-high pressure and high temperature to effect modifications of a substance, e.g. for making artificial diamonds B01J3/00 ){(compressing means for refuse receptacles B65F1/1405)} ## Abstract A component bonding device includes a bonding tool which sucks a film-like component and which bonds the film-like component to a substrate. The bonding tool includes: a plurality of suction blocks, each of which has a suction hole for sucking the film-like component; and a suction block holding portion which has a block holding-available region capable of holding the plurality of suction blocks, and which holds the plurality of suction blocks so as to be arranged in a row in the block holding-available region. The suction block holding portion allows change of a holding position of at least one of the plurality of suction blocks to any desired position in the block holding-available region. ## Claims ### Claim 1 A component bonding device comprising: a bonding tool that sucks a film-like component and bonds the film-like component to a substrate, a substrate holding portion that holds the substrate, a backup stage that supports a lower surface of the substrate held by the substrate holding portion, and a lifting cylinder configured to move the bonding tool up and down to bond the film-like component to the substrate, wherein the bonding tool comprises: a plurality of suction blocks, each of which has a suction hole for sucking the film-like component; and a suction block holding portion which has a block holding-available region capable of holding the plurality of suction blocks, and which holds the plurality of suction blocks so as to be arranged in a row in the block holding-available region, and wherein the suction block holding portion includes a first member and a second member which is arranged on a front surface of the first member, wherein the block holding-available region has a passage which is opened downward at the suction block holding portion and between the first member and the second member, wherein the plurality of the section blocks are clamped between the front surface of the first member and a rear surface of the second member and slidably guided along the passage wherein the suction block holding portion allows change of a holding position of at least one of the plurality of suction blocks to any desired position in the block holding-available region, and wherein the backup stage and each of the plurality of suction blocks sandwich the film-like component and the substrate and the film-like component is pressed against and bonded to the substrate when the lifting cylinder lowers the bonding tool. ### Claim 2 (depends on 1) The component bonding device according to claim 1, wherein at least one of the plurality of suction blocks is detachable from the suction block holding portion. ### Claim 3 A component bonding device comprising: a bonding tool that sucks a film-like component and bonds the film-like component to a substrate, wherein the bonding tool comprises: a plurality of suction blocks, each of which has a suction hole for sucking the film-like component; and a suction block holding portion which has a block holding-available region capable of holding the plurality of suction blocks, and which holds the plurality of suction blocks so as to be arranged in a row in the block holding-available region, and wherein the suction block holding portion includes a first member and a second member which is arranged on a front surface of the first member, wherein the block holding-available region has a passage which is opened downward at the suction block holding portion and between the first member and the second member, wherein the plurality of the suction blocks are clamped between the first member and the second member and slidably guided along the passage, wherein the suction block holding portion allows change of a holding position of at least one of the plurality of suction blocks to any desired position in the block holding-available region, and, wherein the component bonding device further comprises: a heater that heats the plurality of suction blocks, wherein the heater is provided in either the first member or the second member. ### Claim 4 A component bonding device comprising: a bonding tool that sucks a film-like component and bonds the film-like component to a substrate, a substrate holding portion that holds the substrate, a lifting cylinder configured to move the bonding tool up and down to bond the film-like component to the substrate, wherein the bonding tool comprises: a plurality of suction blocks, each of which has a suction hole for sucking the film-like component; and a suction block holding portion which has a block holding-available region capable of holding the plurality of suction blocks, and which holds the plurality of suction blocks so as to be arranged in a row in the block holding-available region, and wherein the suction block holding portion includes a first member and a second member confronting the first member, wherein the block holding-available region has a passage which is opened downward at the suction block holding portion and between the first member and the second member, wherein each of the plurality of the suction blocks has a first face, a second face on a reverse side from the first face, a third face between the first face and the second face, and a fourth face on a reverse side from the third face and provided with the suction hole, wherein the first member has a first face in contact with the first face of the each of the plurality of the suction blocks, and a second face in contact with the third face of the each of the plurality of the suction blocks, wherein the second member has a face opposite the first face of the first member and in contact with the second face of the each of the plurality of the suction blocks, wherein the plurality of the suction blocks are clamped between the first face of the first member and the face of the second member and slidably guided along the passage, wherein the suction block holding portion allows change of a holding position of at least one of the plurality of suction blocks to any desired position in the block holding-available region, and wherein the film-like component is pressed by the fourth face of each of the plurality of suction blocks against the substrate and bonded to the substrate when the lifting cylinder lowers the bonding tool. ### Claim 5 (depends on 4) The component bonding device according to claim 4, further comprising: a backup stage having an upper face that supports a lower surface of the substrate held by the substrate holding portion, wherein the backup stage and the forth fourth face of each of the plurality of suction blocks sandwich the film-like component is pressed against and bonded to the substrate whose lower surface is supported by the backup stage when the lifting cylinder lowers the bonding tool, and wherein the second face of the first member is opposed to the upper face of the backup stage.