# US 10,478,859 B2 · High frequency ultrasonic transducer and matching layer comprising cyanoacrylate

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- Number: US 10,478,859 B2
- Document ID: US10478859B2
- Status: Granted
- Kind: B2
- Application number: 15/345,479
- Filed: 2016-11-07
- Published: 2017-05-25
- Granted: 2019-11-19
- Earliest claimed: 2006-03-02
- Assignees: Fujifilm Sonosite, Inc.
- Applicants: FUIJIFILM SonoSite, Inc.
- Inventors: Nicholas Christopher Chaggares; James Mehi; Desmond Hirson
- Web page: https://patentgrep.com/patent/US10478859B2

## CPC

- B06B 3/00: Methods or apparatus specially adapted for transmitting mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B 1/06: operating with piezoelectric effect or with electrostriction (piezoelectric or electrostrictive devices per se H10N30/00)
- B06B 1/067: {which is used as, or combined with, an impedance matching layer}
- B32B 7/12: using interposed adhesives or interposed materials with bonding properties
- G10K 9/122: using piezoelectric driving means {(G10K9/121 takes precedence)}
- G10K 11/02: Mechanical acoustic impedances; Impedance matching, e.g. by horns; Acoustic resonators
- G10K 11/30: using refraction, e.g. acoustic lenses
- H10N 30/50: having a stacked or multilayer structure
- A61B 8/4209: {by using holders, e.g. positioning frames}
- Y10T 156/10: Methods of surface bonding and/or assembly therefor
- Y10T 428/31855: Of addition polymer from unsaturated monomers
- B06B: METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, {e.g.} FOR PERFORMING MECHANICAL WORK IN GENERAL (for particular applications, see the relevant subclasses, e.g. B07B1/40, B23Q17/12, B24B31/06; measurement of mechanical vibrations G01H; in direction finding, locating, distance or velocity measuring G01S; {generating seismic energy G01V1/02}; control of mechanical vibrations in general G05D; sound-producing devices, e.g. bells, sirens, whistles G10K, {e.g. methods or devices for transmitting, conducting, or directing sound in general G10K11/00}; generation of electrical oscillations H03B; electromechanical resonators in general H03H; electromechanical transducers {for communication techniques, e.g. microphones, speakers} H04R)
- B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- G10K: SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
- H10N: ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- A61B: DIAGNOSIS; SURGERY; IDENTIFICATION (usefulness limited to only animals A61D)
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

In one aspect, matching layers for an ultrasonic transducer stack having a matching layer comprising a matrix material loaded with a plurality of micron-sized and nano-sized particles. In another aspect, the matrix material is loaded with a plurality of heavy and light particles. In another aspect, an ultrasound transducer stack comprises a piezoelectric layer and at least one matching layer. In one aspect, the matching layer comprises a composite material comprising a matrix material loaded with a plurality of micron-sized and nano-sized particles. In a further aspect, the composite material can also comprise a matrix material loaded with a plurality of heavy and light particles. In a further aspect, a matching layer can also comprise cyanoacrylate.

## Claims

### Claim 1

An ultrasonic transducer stack, comprising:
a plurality of layers comprising:
a piezoelectric layer;
at least one matching layer that comprises a first matching layer, which comprises cyanoacrylate; and
a lens layer comprising TPX,
wherein each layer of the plurality of layers has a top surface and an opposed bottom surface, wherein the first matching layer is connected to and underlies the bottom surface of the lens layer, and wherein the piezoelectric layer underlies the bottom surface of the matching layer.

### Claim 2 (depends on 1)

The ultrasonic transducer stack of claim 1, wherein the first matching layer is about a ¼ acoustic wavelength matching layer.

### Claim 3 (depends on 2)

The ultrasonic transducer stack of claim 2, wherein the acoustic impedance of the first matching layer is between about 2.0 MegaRayles (MR) to about 3.5 MegaRayles (MR).

### Claim 4 (depends on 2)

The ultrasonic transducer stack of claim 2, wherein the acoustic impedance of the first matching layer is between about 2.5 MegaRayles (MR) to about 2.8 MegaRayles (MR).

### Claim 5 (depends on 2)

The ultrasonic transducer stack of claim 2, wherein the acoustic impedance of the lens layer is about 1.8 MegaRayles (MR).

### Claim 6 (depends on 1)

The ultrasonic transducer stack of claim 1, wherein the acoustic impedance of the lens is substantially the same as the acoustic impedance of water.

### Claim 7 (depends on 1)

The ultrasonic transducer stack of claim 1, wherein the piezoelectric layer can generate ultrasound at a frequency of at least about 20 megahertz (MHz).

### Claim 8 (depends on 7)

The ultrasonic transducer stack of claim 7, wherein the piezoelectric layer can generate ultrasound at a frequency of about 20 MHz, 25 MHz, 30 MHz, 35 MHz, 40 MHz, 45 MHz, 50 MHz, 55 MHz, 60 MHz, or higher for transmission through the first matching layer and then through the lens layer.

### Claim 9 (depends on 1)

The ultrasonic transducer stack of claim 1, further comprising a second matching layer located between the top surface of the piezoelectric layer and the bottom surface of the first matching layer.

### Claim 10 (depends on 9)

The ultrasonic transducer stack of claim 9, wherein the top surface of the second matching layer is bonded to the bottom surface of the first matching layer using a bonding material.

### Claim 11 (depends on 10)

The ultrasonic transducer stack of claim 10, wherein the bonding material forms a bondline layer between the first matching layer and the second matching layer.

### Claim 12 (depends on 11)

The ultrasonic transducer stack of claim 11, wherein the bondline layer has an elevational thickness of less than about 5 microns.

### Claim 13 (depends on 11)

The ultrasonic transducer stack of claim 11, wherein the bondline layer has an elevational thickness of between about 1 micron to about 5 microns.

### Claim 14 (depends on 11)

The ultrasonic transducer stack of claim 11, wherein the bondline layer has an elevational thickness of between about 1 micron to about 3 microns.