# US 10,478,827 B2 · Devices for manipulating magnetic particles, and methods of fabricating the devices and the use thereof > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,478,827 B2 - Document ID: US10478827B2 - Status: Granted - Kind: B2 - Application number: 15/060,835 - Filed: 2016-03-04 - Published: 2016-09-08 - Granted: 2019-11-19 - Earliest claimed: 2015-03-04 - Assignees: McMaster University - Applicants: McMaster University - Inventors: Leyla Soleymani; Seyed Mohammadamin Hosseini - Web page: https://patentgrep.com/patent/US10478827B2 ## CPC - B03C 1/288: {disposed at the outer circumference of a recipient} - B03C 1/0335: {using coils} - B03C 1/286: {disposed at the inner circumference of a recipient, e.g. magnetic drain bolt} - H01F 41/308: {lift-off processes, e.g. ion milling, for trimming or patterning} - B03C 2201/18: Magnetic separation whereby the particles are suspended in a liquid - B03C 2201/26: for use in medical or biological applications - H01F 2007/068: {using printed circuit coils} - B03C: MAGNETIC OR ELECTROSTATIC SEPARATION OF SOLID MATERIALS FROM SOLID MATERIALS OR FLUIDS; SEPARATION BY HIGH-VOLTAGE ELECTRIC FIELDS (separating isotopes B01D59/00; combinations of magnetic or electrostatic separation with separation of solids by other means B03B, B07B) - H01F: MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES ## Abstract A device for manipulating magnetic particles, and the method of fabricating and use thereof. The device includes a substrate; a conductive element formed onto the substrate in a pattern shaped to enhance a magnetic field generated in response to an applied current; an insulating layer to isolate the conductive element from a magnetic element; and a magnetic element formed onto the insulating layer to enhance a magnetic force resulting from the magnetic field generated by the conductive element. The magnetic element can be shaped similarly to the conductive element, and edges of the magnetic element are substantially aligned with edges of the conductive element. During fabrication, the substrate and the conductive element can be heated to cause the substrate to shrink thereby resulting in a wrinkled structure at the conductive element. The device can be used to manipulate the magnetic particles within a biological sample, such as cells and/or biomolecules. ## Claims ### Claim 1 A device for manipulating magnetic particles, the device comprising: a substrate; a conductive element formed onto the substrate in a meandering design pattern shaped to enhance a magnetic field generated in response to a current applied to the conductive element, the conductive element including one of a microstructure having a high aspect ratio and a nanostructure having a high aspect ratio, the conductive element having a wrinkled structure resulting from the substrate being shrunk during fabrication of the device; an insulating layer; and a magnetic element formed onto the insulating layer, the insulating layer isolates the conductive element from the magnetic element, and the magnetic element enhances a magnetic force resulting from the magnetic field generated by the conductive element. ### Claim 2 (depends on 1) The device of claim 1, further comprising a metallic seed layer deposited onto the insulating layer, the metallic seed layer to act as a conductive path for growth of the magnetic element. ### Claim 3 (depends on 2) The device of claim 2, wherein the metallic seed layer comprises one of copper, titanium, titanium oxide, titanium nitride, tungsten, aluminum, chromium, and noble metals. ### Claim 4 (depends on 1) The device of claim 1, wherein the conductive element comprises an on-chip coil. ### Claim 5 (depends on 1) The device of claim 1, wherein the magnetic element is shaped in the design pattern, and edges of the magnetic element are substantially aligned with corresponding edges of the conductive element. ### Claim 6 (depends on 1) The device of claim 1, wherein the meandering design pattern comprises a mesh shape. ### Claim 7 (depends on 1) The device of claim 1, wherein the substrate comprises a shrinkable material. ### Claim 8 (depends on 1) The device of claim 1, wherein the substrate comprises a polymer material. ### Claim 9 (depends on 1) The device of claim 1, wherein the conductive element comprises one of copper, titanium, titanium oxide, titanium nitride, tungsten, aluminum, chromium, and noble metals. ### Claim 10 (depends on 1) The device of claim 1, wherein the magnetic element comprises one of nickel, iron, permalloy, supermalloy, mu-metal, cobalt-iron alloy, and nickeliron alloy. ### Claim 11 A device for manipulating magnetic particles, the device comprising: a substrate; a conductive element formed onto the substrate in a meandering design pattern shaped to enhance a magnetic field generated in response to a current applied to the conductive element, the conductive element including one of a microstructure having a high aspect ratio and a nanostructure having a high aspect ratio; an insulating layer; and a magnetic element formed onto the insulating layer, the magnetic element is shaped in the design pattern, and edges of the magnetic element are substantially aligned with corresponding edges of the conductive element, and the insulating layer isolates the conductive element from the magnetic element, and the magnetic element enhances a magnetic force resulting from the magnetic field generated by the conductive element. ### Claim 12 (depends on 11) The device of claim 11, further comprising a metallic seed layer deposited onto the insulating layer, the metallic seed layer to act as a conductive path for growth of the magnetic element. ### Claim 13 (depends on 12) The device of claim 12, wherein the metallic seed layer comprises one of copper, titanium, titanium oxide, titanium nitride, tungsten, aluminum, chromium, and noble metals. ### Claim 14 (depends on 11) The device of claim 11, wherein the conductive element comprises a wrinkled structure resulting from the substrate being shrunk during fabrication of the device. ### Claim 15 (depends on 11) The device of claim 11, wherein the conductive element comprises an on-chip coil. ### Claim 16 (depends on 11) The device of claim 11, wherein the meandering design pattern comprises a mesh shape. ### Claim 17 (depends on 11) The device of claim 11, wherein the substrate comprises a shrinkable material. ### Claim 18 (depends on 11) The device of claim 11, wherein the substrate comprises a polymer material. ### Claim 19 (depends on 11) The device of claim 11, wherein the conductive element comprises one of copper, titanium, titanium oxide, titanium nitride, tungsten, aluminum, chromium, and noble metals. ### Claim 20 (depends on 11) The device of claim 11, wherein the magnetic element comprises one of nickel, iron, permalloy, supermalloy, mu-metal, cobalt-iron alloy, and nickel-iron alloy. ### Claim 21 A device for manipulating magnetic particles, the device comprising: a substrate; a conductive element formed onto the substrate in a meandering design pattern includes a mesh shape so as to enhance a magnetic field generated in response to a current applied to the conductive element, the conductive element including one of a microstructure having a high aspect ratio and a nanostructure having a high aspect ratio; an insulating layer; and a magnetic element formed onto the insulating layer, the insulating layer isolates the conductive element from the magnetic element, and the magnetic element enhances a magnetic force resulting from the magnetic field generated by the conductive element. ### Claim 22 (depends on 21) The device of claim 21, further comprising a metallic seed layer deposited onto the insulating layer, the metallic seed layer to act as a conductive path for growth of the magnetic element. ### Claim 23 (depends on 22) The device of claim 22, wherein the metallic seed layer comprises one of copper, titanium, titanium oxide, titanium nitride, tungsten, aluminum, chromium, and noble metals. ### Claim 24 (depends on 21) The device of claim 21, wherein the conductive element comprises a wrinkled structure resulting from the substrate being shrunk during fabrication of the device. ### Claim 25 (depends on 21) The device of claim 21, wherein the conductive element comprises an on-chip coil. ### Claim 26 (depends on 21) The device of claim 21, wherein the magnetic element is shaped in the design pattern, and edges of the magnetic element are substantially aligned with corresponding edges of the conductive element. ### Claim 27 (depends on 21) The device of claim 21, wherein the substrate comprises a shrinkable material. ### Claim 28 (depends on 21) The device of claim 21, wherein the substrate comprises a polymer material. ### Claim 29 (depends on 21) The device of claim 21, wherein the conductive element comprises one of copper, titanium, titanium oxide, titanium nitride, tungsten, aluminum, chromium, and noble metals. ### Claim 30 (depends on 21) The device of claim 21, wherein the magnetic element comprises one of nickel, iron, permalloy, supermalloy, mu-metal, cobalt-iron alloy, and nickel-iron alloy.