# US 10,478,797 B2 · Bio-sensing and temperature-sensing integrated circuit > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,478,797 B2 - Document ID: US10478797B2 - Status: Granted - Kind: B2 - Application number: 15/866,051 - Filed: 2018-01-09 - Published: 2018-05-24 - Granted: 2019-11-19 - Earliest claimed: 2014-09-17 - Assignees: Taiwan Semiconductor Manufacturing Company, Ltd. - Applicants: Taiwan Semiconductor Manufacturing Company, Ltd. - Inventors: Tung-Tsun Chen; Yi-Shao Liu; Jui-Cheng Huang; Chin-Hua Wen; Felix Ying-Kit Tsui; Yung-Chow Peng - Web page: https://patentgrep.com/patent/US10478797B2 ## CPC - B01J 19/0046: {Sequential or parallel reactions, e.g. for the synthesis of polypeptides or polynucleotides; Apparatus and devices for combinatorial chemistry or for making molecular arrays (synthesis methods per se C40B50/00)} - B01J 2219/00495: Means for heating or cooling the reaction vessels - B01J 2219/00585: Parallel processes - B01J 2219/00596: Solid-phase processes - B01J 2219/00716: Heat activated synthesis - B01J 2219/00722: Nucleotides - B01J: CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS ## Abstract An integrated circuit includes two or more rows of heating elements, two or more columns of heating elements, and a plurality of sensing areas. Each sensing area is between two adjacent rows of the rows of heating elements, between two adjacent columns of the columns of heating elements, and includes a bio-sensing device and a temperature-sensing device. ## Claims ### Claim 1 An integrated circuit comprising: two or more rows of heating elements; two or more columns of heating elements; a plurality of sensing areas, each sensing area of the plurality of sensing areas being between two adjacent rows of the rows of heating elements and being between two adjacent columns of the columns of heating elements; and a control unit configured to receive: a first digital code based on a plurality of bio-sensing signals corresponding to the plurality of sensing areas; and a second digital code based on a plurality of temperature-sensing signals corresponding to the plurality of sensing areas. ### Claim 2 (depends on 1) The integrated circuit of claim 1, further comprising a heater driver, wherein the control unit is configured to control the rows of heating elements and the columns of heating elements through the heater driver based on the second digital code. ### Claim 3 (depends on 1) The integrated circuit of claim 1, further comprising a heater driver, wherein the control unit is configured to control the rows of heating elements and the columns of heating elements through the heater driver in an open-loop manner. ### Claim 4 (depends on 1) The integrated circuit of claim 1, wherein the control unit is configured to select a subset of the plurality of bio-sensing signals based on a plurality of selection signals, and the first digital code is based on the subset of the plurality of bio-sensing signals. ### Claim 5 (depends on 4) The integrated circuit of claim 4, wherein the plurality of selection signals further selects a subset of the plurality of temperature-sensing signals, and the second digital code is based on the subset of the plurality of temperature-sensing signals. ### Claim 6 (depends on 1) The integrated circuit of claim 1, wherein the plurality of sensing areas comprises an array of M×N sensing areas, the two or more columns of heating elements comprise M+1 columns of heating elements, and the two or more rows of heating elements comprise N+1 rows of heating elements. ### Claim 7 (depends on 1) The integrated circuit of claim 1, wherein the plurality of sensing areas comprises an array of M×N sensing areas, the two or more columns of heating elements comprise M×2 columns of heating elements, and the two or more rows of heating elements comprise N×2 rows of heating elements. ### Claim 8 An integrated circuit, comprising: two or more rows of heating elements; two or more columns of heating elements; a plurality of sensing areas, each sensing area of the plurality of sensing areas: being between two adjacent rows of the rows of heating elements; being between two adjacent columns of the columns of heating elements; and comprising a bio-sensing device configured to generate a bio-sensing signal and a temperature-sensing device configured to generate a temperature-sensing signal, the plurality of sensing areas thereby being configured to generate a plurality of bio-sensing signals and a plurality of temperature-sensing signals; and a control unit configured to receive a first digital code based on the plurality of bio-sensing signals and a second digital code based on the plurality of temperature-sensing signals. ### Claim 9 (depends on 8) The integrated circuit of claim 8, wherein, for each sensing area of the plurality of sensing areas, the bio-sensing device is configured to generate the bio-sensing signal responsive to an electrical characteristic of a sensing film, and the temperature-sensing device is configured to generate the temperature-sensing signal responsive to a temperature of the sensing film. ### Claim 10 (depends on 9) The integrated circuit of claim 9, wherein the control unit is configured to adjust the temperature of the sensing film by controlling at least one heating element of the two or more rows of heating elements and two or more columns of heating elements. ### Claim 11 (depends on 8) The integrated circuit of claim 8, further comprising: a plurality of first signal paths, each first signal path of the plurality of first signal paths configured to receive a subset of the plurality of bio-sensing signals from a corresponding row of sensing areas of the plurality of sensing areas; and a plurality of second signal paths, each second signal path of the plurality of second signal paths configured to receive a subset of the plurality of temperature sensing signals from a corresponding row of sensing areas of the plurality of sensing areas. ### Claim 12 (depends on 11) The integrated circuit of claim 11, further comprising a row decoder configured to: generate, at a bio-sensing output, a first signal based on the subset of the plurality of bio-sensing signals corresponding to a selected row of sensing areas of the plurality of sensing areas, and generate, at a temperature-sensing output, a second signal based on the subset of the plurality of temperature-sensing signals corresponding to the selected row of sensing areas of the plurality of sensing areas. ### Claim 13 (depends on 12) The integrated circuit of claim 12, further comprising: a first amplifier and analog-to-digital converter (ADC) set configured to receive the first signal and generate the first digital code; and a second amplifier and ADC set configured to receive the second signal and generate the second digital code. ### Claim 14 (depends on 13) The integrated circuit of claim 13, wherein the first amplifier and ADC set is one first amplifier and ADC set of a plurality of first amplifier and ADC sets configured to process the plurality of bio-sensing signals, and/or the second amplifier and ADC set is one second amplifier and ADC set of a plurality of second amplifier and ADC sets configured to process the plurality of temperature-sensing signals. ### Claim 15 An integrated circuit comprising: two or more rows of heating elements; two or more columns of heating elements; a heater driver coupled with the two or more rows of heating elements and the two or more columns of heating elements; a plurality of sensing areas, each sensing area of the plurality of sensing areas being between two adjacent rows of the rows of heating elements and being between two adjacent columns of the columns of heating elements; and a control unit configured to: control a temperature distribution of the two or more rows of heating elements and the two or more columns of heating elements through the heater driver; receive a first digital code based on a plurality of bio-sensing signals corresponding to the plurality of sensing areas; and receive a second digital code based on a plurality of temperature-sensing signals corresponding to the plurality of sensing areas. ### Claim 16 (depends on 15) The integrated circuit of claim 15, wherein the rows of heating elements are configured to receive a plurality of row driving signals from the heater driver, and the columns of heating elements are configured to receive a plurality of column driving signals from the heater driver. ### Claim 17 (depends on 16) The integrated circuit of claim 16, wherein at least one row driving signal of the plurality of row driving signals is configured to control two or more rows of the rows of heating elements, and/or at least one column driving signal of the plurality of column driving signals is configured to control two or more columns of the columns of heating elements. ### Claim 18 (depends on 15) The integrated circuit of claim 15, wherein, for each sensing area of the plurality of sensing areas, a heating element group of a corresponding plurality of heating element groups comprises a heating element of one of the two adjacent rows of the rows of heating elements connected in series with a heating element of one of the two adjacent columns of the columns of heating elements, and the plurality of heating element groups is configured to receive a plurality of driving signals from the heater driver. ### Claim 19 (depends on 18) The integrated circuit of claim 18, wherein the plurality of sensing areas are arranged in rows and columns, the rows comprising an edge row and the columns comprising an edge column, for each sensing area of the plurality of sensing areas in the edge row, a heating element of the other one of the two adjacent rows of the rows of heating elements is configured to receive an individual control signal from the heater driver, and for each sensing area of the plurality of sensing areas in the edge column, a heating element of the other one of the two adjacent columns of the columns of heating elements is configured to receive an individual control signal from the heater driver. ### Claim 20 (depends on 18) The integrated circuit of claim 18, wherein at least one driving signal of the plurality of driving signals is configured to control two or more heating element groups of the plurality of heating element groups.