# US 10,478,617 B2 · Thin-film electrode assembly with soft overmold > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,478,617 B2 - Document ID: US10478617B2 - Status: Granted - Kind: B2 - Application number: 15/597,187 - Filed: 2017-05-17 - Published: 2018-11-22 - Granted: 2019-11-19 - Earliest claimed: 2017-05-17 - Assignees: Verily Life Sciences LLC - Applicants: Verily Life Sciences LLC - Inventors: Brian Pepin; Shiv Sabesan; Bo Lu - Web page: https://patentgrep.com/patent/US10478617B2 ## CPC - A61N 1/0551: {Spinal or peripheral nerve electrodes} - A61N 1/0553: {Paddle shaped electrodes, e.g. for laminotomy} - A61N 1/0556: {Cuff electrodes} - A61N 1/056: {Transvascular endocardial electrode systems} - H01B 3/306: {Polyimides or polyesterimides} - H01B 3/307: {Other macromolecular compounds} - A61N 1/0526: {Head electrodes (A61N1/0551 takes precedence)} - A61N 1/3606: {adapted for a particular treatment} - H05K 1/0283: {Stretchable printed circuits} - H05K 2201/09263: Meander - A61N: ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY (measurement of bioelectric currents A61B; surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body A61B18/00; anaesthetic apparatus in general A61M; incandescent lamps H01K; infrared radiators for heating H05B) - H01B: CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES (selection for magnetic properties H01F1/00; waveguides H01P {; printed circuits H05K}) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract The present disclosure relates to implantable neuromodulation devices and methods of fabrication, and in particular to a thin-film electrode assemblies and methods of fabricating the thin-film electrode assembly to include a soft overmold. Particularly, aspects of the present invention are directed to a thin-film electrode assembly that includes an overmold and a supporting structure formed within a portion of the overmold. The overmold includes a first polymer and the supporting structure includes a second polymer, different from the first polymer. The thin-film electrode assembly also includes a wire formed within a portion of the supporting structure, and an electrode formed on a top surface of the supporting structure and in electrical contact with the wire. The electrode has a top surface that is raised above a top surface of the overmold by a predetermined distance. ## Claims ### Claim 1 A thin-film electrode assembly comprising: an overmold comprising a first polymer; a supporting structure formed within a portion of the overmold, wherein the supporting structure comprises a second polymer, different from the first polymer; a wire formed within a portion of the supporting structure; an electrode formed on a top surface of the supporting structure and in electrical contact with the wire, wherein the electrode comprises a top surface that is raised above a top surface of the overmold by a predetermined distance; another supporting structure formed within another portion of the overmold; another wire formed within a portion of the another supporting structure; and another electrode formed on a top surface of the another supporting structure and in electrical contact with the another wire, wherein the another electrode comprises a top surface that is raised above the top surface of the overmold by the predetermined distance, and wherein the supporting structure and the electrode are isolated from the another supporting structure and the another electrode by a region of the overmold. ### Claim 2 (depends on 1) The thin-film electrode assembly of claim 1, wherein the first polymer layer comprises polyimide or liquid crystal polymer (LCP), and the second polymer layer comprises silicone. ### Claim 3 (depends on 1) The thin-film electrode assembly of claim 1, further comprising a contact formed within the portion of the supporting structure that provides the electrical contact between the electrode and the wire. ### Claim 4 (depends on 1) The thin-film electrode assembly of claim 1, wherein the top surface of the supporting structure is coplanar with the top surface of the overmold. ### Claim 5 (depends on 1) The thin-film electrode assembly of claim 1, wherein the wire is embedded within the portion of the supporting structure. ### Claim 6 (depends on 1) The thin-film electrode assembly of claim 1, wherein the supporting structure is embedded within the overmold. ### Claim 7 (depends on 1) The thin-film electrode assembly of claim 1, further comprising an additional supporting structure formed within the region of the overmold, and an additional wire formed within a portion of the additional supporting structure, wherein the supporting structure and the electrode are isolated from the additional supporting structure by a first portion of the region of the overmold and the another supporting structure and the another electrode are isolated from the additional supporting structure by a second portion of the region of the overmold; and wherein the supporting structure and the another supporting structure have a first shape that are non-expandable, and the additional supporting structure has a second shape that is expandable. ### Claim 8 (depends on 1) The thin-film electrode assembly of claim 1, further comprising an additional supporting structure formed within the region of the overmold, wherein the supporting structure and the electrode are isolated from the additional supporting structure by a first portion of the region of the overmold and the another supporting structure and the another electrode are isolated from the additional supporting structure by a second portion of the region of the overmold. ### Claim 9 (depends on 8) The thin-film electrode assembly of claim 8, further comprising an additional wire formed within a portion of the additional supporting structure, wherein a top surface of the additional supporting structure is coplanar with the top surface of the overmold, the supporting structure, and the another supporting structure. ### Claim 10 (depends on 9) The thin-film electrode assembly of claim 9, wherein the wire is embedded within the portion of the supporting structure, the another wire is embedded within the portion of the another supporting structure, and the additional wire is embedded within the portion of the additional supporting structure. ### Claim 11 (depends on 1) The thin-film electrode assembly of claim 1, wherein the predetermined distance is greater than 0.5 μm. ### Claim 12 A thin-film electrode assembly comprising: an overmold comprising silicone; a first support structure within a first portion of the overmold, wherein the first support structure includes polyimide or liquid crystal polymer (LCP) and a wire, and the first support structure has a first shape that is non-expandable; a second support structure within a second portion of the overmold, wherein the second support structure includes the polyimide or LCP and the wire, and the second support structure has a second shape that is different from the first shape that is expandable; and an electrode formed on a top surface of the first supporting structure and in electrical contact with the wire, wherein the electrode comprises a top surface that is raised above a top surface of the overmold by a predetermined distance. ### Claim 13 (depends on 12) The thin-film electrode assembly of claim 12, further comprising one or more contact pads in electrical contact with the wire. ### Claim 14 (depends on 12) The thin-film electrode assembly of claim 12, further comprising a contact formed within first support structure that provides electrical contact between the electrode and the wire. ### Claim 15 (depends on 12) The thin-film electrode assembly claim 12, further comprising: a third support structure within a third portion of the overmold, wherein the third support structure includes the polyimide or LCP and the wire, and the third support structure has the first shape; another electrode formed on a top surface of the third supporting structure and in electrical contact with the wire; and a fourth support structure within a fourth portion of the overmold, wherein the fourth support structure includes the polyimide or LCP and the wire, and the fourth support structure has the second shape. ### Claim 16 (depends on 15) The thin-film electrode assembly of claim 15, wherein the first support structure is in physical contact with the second support structure, the third support structure is in physical contact with the second support structure and the fourth support structure, and the third support structure is isolated from the first support structure by the second support structure and the overmold. ### Claim 17 (depends on 12) The thin-film electrode assembly of claim 12, wherein the predetermined distance is greater than 0.5 μm.