# US 10,478,154 B2 · Ultrasound sensor element, ultrasound sensor array assembly, ultrasound transmit sensor element, imaging device, ultrasound transducer, and method of performing an ultrasound scan > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,478,154 B2 - Document ID: US10478154B2 - Status: Granted - Kind: B2 - Application number: 14/772,669 - Filed: 2014-03-07 - Published: 2015-12-31 - Granted: 2019-11-19 - Earliest claimed: 2013-03-07 - Assignees: Sharp Kabushiki Kaisha - Applicants: Sharp Kabushiki Kaisha - Inventors: Christopher James Brown; Michael Robert Prior-Jones; Benjamin James Hadwen - Web page: https://patentgrep.com/patent/US10478154B2 ## CPC - A61B 8/4477: {using several separate ultrasound transducers or probes} - A61B 8/14: Echotomography - A61B 8/4455: {Features of the external shape of the probe, e.g. ergonomic aspects} - A61B 8/4488: {the transducer being a phased array} - A61B 8/4494: {characterised by the arrangement of the transducer elements} - A61B 8/462: {characterised by constructional features of the display} - B06B 1/0207: {Driving circuits (specially adapted for particular applications, see the relevant subclass, e.g. G01; circuits for steering transducer arrays G10K11/34; basic circuits H03)} - B81C 1/00246: {Monolithic integration, i.e. micromechanical structure and electronic processing unit are integrated on the same substrate} - G01S 7/52079: {Constructional features (constructional features of transducers B06B; mounting transducers G10K11/00; constructional features of ultrasonic medical diagnostic devices A61B8/44)} - G01S 7/5208: {with integration of processing functions inside probe or scanhead} - G01S 7/52084: {related to particular user interfaces (special user input means for ultrasonic medical diagnostic devices A61B8/467)} - G01S 15/8913: {using separate transducers for transmission and reception} - G01S 15/8925: {the array being a two-dimensional transducer configuration, i.e. matrix or orthogonal linear arrays} - G01S 15/8927: {using simultaneously or sequentially two or more subarrays or subapertures} - G01S 15/8993: {Three dimensional imaging systems} - G10K 11/341: {Circuits therefor} - G10K 11/346: {using phase variation} - A61B 8/4281: {characterised by sound-transmitting media or devices for coupling the transducer to the tissue} - A61B 8/58: {Testing, adjusting or calibrating the diagnostic device} - B06B 2201/51: Electrostatic transducer - B81B 2201/0292: Sensors not provided for in B81B2201/0207 - B81B2201/0285 - B81B 2207/015: the micromechanical device and the control or processing electronics being integrated on the same substrate - B81C 2203/0735: Post-CMOS, i.e. forming the micromechanical structure after the CMOS circuit - G01S 7/5202: {for pulse systems} - G01S 7/52025: {for pulse systems (G01S7/52034 takes precedence)} - A61B: DIAGNOSIS; SURGERY; IDENTIFICATION (usefulness limited to only animals A61D) - B06B: METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, {e.g.} FOR PERFORMING MECHANICAL WORK IN GENERAL (for particular applications, see the relevant subclasses, e.g. B07B1/40, B23Q17/12, B24B31/06; measurement of mechanical vibrations G01H; in direction finding, locating, distance or velocity measuring G01S; {generating seismic energy G01V1/02}; control of mechanical vibrations in general G05D; sound-producing devices, e.g. bells, sirens, whistles G10K, {e.g. methods or devices for transmitting, conducting, or directing sound in general G10K11/00}; generation of electrical oscillations H03B; electromechanical resonators in general H03H; electromechanical transducers {for communication techniques, e.g. microphones, speakers} H04R) - B81C: PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS (making microcapsules or microballoons B01J13/02; processes or apparatus specially adapted for the manufacture or treatment of piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/01) - G01S: RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES - G10K: SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR - B81B: MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/00, H10N35/00) ## Abstract Methods and apparatus for ultrasound imaging using ultrasound sensor elements comprising thin film transistors. Specifically, ultrasound elements for use in a two dimensional array of ultrasound elements, two dimensional arrays of ultrasound elements, ultrasound sensor element array assemblies, ultrasound imaging devices and methods of performing an ultrasound scan using a two dimensional array of ultrasound elements. A sensor element comprises: an ultrasound transducer, a transmit circuit configured to provide an electrical signal to the transducer for output of an ultrasound signal; and a receive circuit configured to receive an electrical signal from the transducer, based on a received reflected ultrasound signal, wherein the transmit and receive circuits each comprise one or more thin film transistors. ## Claims ### Claim 1 An ultrasound sensor array assembly comprising a two dimensional array of ultrasound sensor elements, each sensor element in the two dimensional array of ultrasound sensor elements comprising: an ultrasound transducer, a transmit circuit configured to provide an electrical signal to the transducer for output of an ultrasound signal; and a receive circuit configured to receive an electrical signal from the transducer, based on a received reflected ultrasound signal, wherein the transmit and receive circuits each comprise one or more thin film transistors; the sensor array assembly further comprising: a plurality of transmit delay circuits, wherein each transmit delay circuit is in electrical communication with each sensor element in a row of the array of sensor elements, and wherein the transmit delay circuits are configured to delay a transmit signal to the sensor elements in each row for steering a beam of emitted ultrasound; and a plurality of receive delay circuits, wherein each receive delay circuit is in electrical communication with each sensor element in a column of the array of sensor elements, and wherein the receive delay circuits are configured to delay a receive signal from the sensor elements in each column for steering the beam of received reflected ultrasound; wherein the plurality of transmit delay circuits are incorporated into a first driver circuit, and the plurality of receive delay circuits are incorporated into a second driver circuit, and the first and second driver circuits are located external and adjacent to the two dimensional array of ultrasound sensor elements. ### Claim 2 (depends on 1) The sensor array assembly according to claim 1, wherein at least one of the transmit circuit or the receive circuit is configured to be selectively enabled. ### Claim 3 (depends on 1) The sensor array assembly according to claim 1, wherein the transmit circuit comprises a level shifter configured to receive an electrical signal at a first voltage and emit an electrical signal at a second voltage for operating the transducer to emit an ultrasound signal. ### Claim 4 (depends on 1) The sensor array assembly according to claim 1, wherein the receive circuit comprises a pre-amplifier configured to receive and amplify an electrical signal from the transducer. ### Claim 5 (depends on 1) The sensor array assembly according to claim 1, wherein the receive circuit comprises an output amplifier configured to generate an output current. ### Claim 6 (depends on 2) The sensor array assembly according to claim 2, wherein the receive circuit is selectively enabled by a receive enabling circuit configured to connect the receive circuit to one of a plurality of receive lines. ### Claim 7 (depends on 1) The sensor array assembly according to claim 1, wherein the ultrasound transducer comprises a micro-electro-mechanical transducer. ### Claim 8 (depends on 1) The sensor array assembly according to claim 1, wherein the transmit delay circuits and the receive delay circuits are configured to undertake one dimensional orthogonal beam steering. ### Claim 9 (depends on 1) The sensor array assembly according to claim 1, configured to emit an ultrasound signal from one or more sensor elements forming a sub-aperture of the array. ### Claim 10 (depends on 1) An ultrasound imaging device comprising an ultrasound sensor array according to claim 1. ### Claim 11 (depends on 10) The ultrasound imaging device according to claim 10, wherein the two dimensional array of ultrasound sensor elements configured to emit ultrasound signals and receive reflected ultrasound signals is conformable, such that it may conform at least partially to the contours of a surface against which it is placed. ### Claim 12 (depends on 1) The sensor array assembly according to claim 1, further comprising a switch that switches between connecting the transducer to the transmit circuit or to the receive circuit; wherein the switch comprises a first switch transistor that is connected to the transmit circuit for actuating the transmit circuit based on a transmit switch control signal, and a second switch transistor that is connected to the receive circuit for actuating the receive circuit based on a receive switch control signal; and wherein terminals of the first switch transistor and the second switch transistor are electrically connected to the transducer at a common node.