US 10,477,748 B2Granted

Component mounting device and component mounting method

AssigneePanasonic Intellectual Property Management Co., Ltd.

InventorsShinji Yamamoto, Hiroyuki Fujiwara

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Abstract

A component mounting device that mounts on a board a fitting component to be attached by a mechanical fitting or engagement to a to-be-attached part formed in the board. The component mounting device includes a mounting head which carries out a moving and mounting operation in which the fitting component is taken out from a component supply part by sucking and holding the fitting component, moved and mounted on the to-be-attached part, and pressed by a first load, and a pressing operation in which the fitting component is pressed by a second load larger than the first load, and a head control part which controls the mounting head to suck and hold a neighborhood of a central portion of an upper surface of the fitting component in the moving and mounting operation, and to press a press part corresponding to the to-be-attached part in the pressing operation.

Claims2

Dependent claims

A component mounting method that mounts components on a board, the components including a fitting component to be attached by a mechanical fitting or engagement to a to-be-attached part formed in the board by a mounting head, the component mounting method comprising:

a moving and mounting process of taking out the fitting component from a component supply part by sucking and holding the fitting component, moving and mounting the fitting component to the to-be-attached part of the board and pressing the fitting component by a first load;
and
a pressing process of pressing the fitting component that is moved and mounted on the to-be-attached part by a second load larger than the first load,
wherein the mounting head is controlled to suck and hold a neighborhood of a central portion of an upper surface of the fitting component in the moving and mounting process, separate from the neighborhood of the central portion of the upper surface of the fitting component and move to an area above a press part set so as to correspond to the to-be-attached part and different from the neighborhood of the central portion of the upper surface of the fitting component and press the press part in the pressing process.

1 more element

Dependencies are inferred from the claim text.

Facts

Application: 14/769,227Filed 20 Feb 2014
Priority: JP 2013-03168221 Feb 2013
Published: US 2016/0007514 A17 Jan 2016
Granted: 12 Nov 2019
Term ends: Not estimatedThe source records don’t support an estimate.

Classification6 codes

H05K 13/0408
Pick-and-place heads or apparatus, e.g. with jaws: incorporating a pick-up tool
H05K 13/0413
Pick-and-place heads or apparatus, e.g. with jaws: with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g.…
Y10T 29/4913
On flat or curved insulated base, e.g., printed circuit, etc.: assembling to base an electrical component, e.g., capacitor, etc.
Y10T 29/53191
Means to assemble electrical device: means to apply vacuum directly to position or hold work part