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US 10,477,739 B2Granted
Thermally-conductive electromagnetic interference (EMI) absorbers positioned or positionable between board level shields and heat sinks
AssigneeLaird Technologies, Inc.
InventorsPaul Francis Dixon, Mohammadali Khorrami
Life of this patent
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Abstract
According to various aspects, exemplary embodiments are disclosed that include thermally-conductive EMI absorbers. In an exemplary embodiment, a thermally-conductive EMI absorber includes one or more portions disposed between a board level shield and a heat dissipation/removal structure. The thermally-conductive EMI absorber may be operable for attenuating EMI that propagates within the portions of the thermally-conductive EMI absorber between the board level shield and a heat dissipation/removal structure.
Claims18
An assembly comprising:
- a board level shield including an opening having a perimeter;
- a thermally-conductive electromagnetic interference (EMI) absorber configured for attenuating EMI that propagates within the thermally-conductive EMI absorber;
- and
- a structure positioned relative to the board level shield and the thermally-conductive EMI absorber such that EMI passing through the opening is blocked and redirected by the structure to propagate within the thermally-conductive EMI absorber between the board level shield and the structure;
- wherein at least a portion of the thermally-conductive EMI absorber is disposed outside the perimeter of the opening within a gap or space separating or defined between an upper surface of the board level shield and a lower surface of the structure and is configured to be operable for attenuating EMI that propagates within the at least a portion of the thermally-conductive EMI absorber between the upper surface of the board level shield and the lower surface of the structure;
- wherein the thermally-conductive EMI absorber is configured to attenuate the EMI that passes through the opening and propagates within the thermally-conductive EMI absorber before the EMI can emerge from the thermally-conductive EMI absorber;
- wherein the assembly further comprises a thermal interface material in addition to and different than the thermally-conductive EMI absorber and positioned within the opening of the board level shield;
- and
- wherein at least a portion of the thermally-conductive EMI absorber is between the thermal interface material and the structure.
6 more elements
A shield comprising:
- an upper surface having an opening therein;
- one or more sidewalls depending from the upper surface and configured for installation to a substrate generally about one or more components on the substrate;
- a thermally-conductive EMI absorber including at least a first portion over the opening and a second portion along the upper surface and disposed outside a perimeter of the opening, the thermally-conductive electromagnetic interference (EMI) absorber configured to be operable for attenuating EMI that passes through the opening and propagates within the thermally-conductive EMI absorber before the EMI can emerge from the thermally-conductive EMI absorber;
- and
- a dielectric portion positionable in direct contact with the one or more components on the substrate when the one or more sidewalls are installed to the substrate generally about the one or more components on the substrate;
- wherein the shield further comprises a thermal interface material in addition to and different than the thermally-conductive EMI absorber and positioned within the opening in the upper surface.
3 more elements
A method comprising:
- positioning a thermally-conductive EMI absorber relative to an opening in an upper surface of a shield such that at least a portion of the thermally-conductive EMI absorber is disposed outside a perimeter of the opening;
- and
- positioning the shield having the opening and the thermally-conductive EMI absorber over a heat source on a substrate, such that the thermally-conductive EMI absorber is operable for attenuating EMI that passes through the opening and propagates within the thermally-conductive EMI absorber before the EMI can emerge from the thermally-conductive EMI absorber and such that a dielectric portion is in contact with or adjacent the heat source to help prevent shorting out of the heat source;
- wherein the method includes positioning a thermal interface material including the dielectric portion relative to the thermally-conductive EMI absorber, the heat source, and the shielding, such that:
- the thermal interface material is within the opening in the upper surface of the shield,
- at least a portion of the thermally-conductive EMI absorber is between the thermal interface material and the structure, and
- the dielectric portion of the thermal interface material contacts or is adjacent the heat source.
4 more elements
Dependencies are inferred from the claim text.