Board level shields and systems and methods of applying board level shielding

A multilayer board level shield comprising an electrically-conductive shielding layer disposed between inner and outer dielectric layers, wherein the multilayer board level shield has an overall thickness of about 25 microns or less, and wherein the multilayer board level shield has sufficient flexibility to be reconfigurable generally over one or more components on a substrate to thereby provide board level shielding for the one or more components, wherein:

• the electrically-conductive shielding layer is electrically coupled to a ground of a printed circuit board of a system in package, and wherein the multilayer board level shield is draped, flexed, or wrapped generally over one or more components of the printed circuit to thereby provide board level shielding for the one or more components with a shielding effectiveness greater than 40 decibels up to 4 gigahertz;
• the inner and outer dielectric layers comprise inner and outer dielectric thermoplastic layers;
• the electrically-conductive shielding layer comprises an electrically-conductive foil between the inner and outer dielectric thermoplastic layers;
• the electrically-conductive foil is electrically coupled directly to one or more ground traces of the printed circuit board without requiring any bond pads and without requiring a board level shield fence or frame;
• and
• one or more dielectric joints are defined between the printed circuit board and the outer dielectric thermoplastic layer that attach the multilayer board level shield to the printed circuit board.