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US 10,477,737 B2Granted
Manufacturing method of a hollow shielding structure for circuit elements
AssigneeSamsung Electronics Co., Ltd.
InventorsKeon Kuk, Il-ju Mun, Ji-woon Yeom, Yeon-kyoung Jung, Kyong-il Kim
Life of this patent
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Abstract
A hollow shielding structure for different types of circuit elements is provided. The hollow shielding structure includes at least one element mounted on a printed circuit board (PCB), a shield dam surrounding the at least one element, and a shield cover is configured to be electrically coupled to an upper portion of the shield dam and cover the at least one element, with a gap formed between the at least one element and the shield cover.
Claims3
A method for manufacturing a hollow shielding structure for different types of circuit elements, the method comprising:
- loading a printed circuit board (PCB) on which the different types of circuit elements are mounted into a working position;
- calibrating a position of a nozzle with respect to the loaded PCB;
- forming a shield dam on the PCB by discharging a material from the nozzle;
- placing a shield cover in an upper portion of the shield dam to cover the different types of circuit elements;
- and
- forming an adhesion part which electrically couples the shield dam and the shield cover by applying a conductive material between the shield dam and the shield cover.
3 more elements
Dependencies are inferred from the claim text.