Liquid-cooled radiator

A server system comprising a plurality of electronic chips and a liquid-cooled radiator, the liquid-cooled radiator configured to cool the plurality of electronic chips, the liquid-cooled radiator comprising:

• a plurality of liquid-cooled boards;
• a condenser;
• a driver;
• a coolant conduit assembly;
• and
• a mounting bracket;
• wherein:
• the plurality of liquid-cooled boards and the condenser are mounted on the mounting bracket;
• the driver is coupled to the plurality of liquid-cooled boards and the condenser through the coolant conduit assembly;
• the coolant conduit assembly comprises a main conduit, a diverting block, and a sub-conduit;
• the diverting block is mounted to the mounting bracket;
• the plurality of liquid-cooled boards are coupled to the diverting block in parallel through the sub-conduit;
• the condenser, the driver, and the diverting block are coupled together through the main conduit;
• the driver drives coolant from the condenser to flow through the diverting block and the sub-conduit to the plurality of liquid-cooled boards;
• a flow path of the coolant is defined from the liquid-cooled boards, through the sub-conduit and the diverting block to the main conduit, from the main conduit to the condenser;
• and
• each of the plurality of liquid-cooled boards is mounted to a corresponding one of the plurality of electronic chips to disperse heat from the electronic chip.