Apparatus, system, and method for cooling devices containing multiple components

A system comprising:

• a multi-chip module comprising:
• a first module designed to operate at temperatures below a first threshold temperature;
• and
• a second module that is:
• positioned in an opening within the first module such that the second module is surrounded by the first module;
• and
• designed to operate at temperatures below a second threshold temperature, the first threshold temperature being higher than the second threshold temperature;
• a base that is capable of supporting a plurality of heatsinks and that is coupled to the multi-chip module;
• a first heatsink that:
• is secured to the base;
• and
• transfers heat away from the first module such that the first module operates at a temperature below the first threshold temperature;
• and
• a second heatsink that:
• is secured to the base;
• transfers heat away from the second module;
• includes a plurality of sides that extend from the base;
• and
• is at least partially thermally isolated from the first heatsink by a region of empty space that:
• is located between each side of the second heatsink that extends from the base and the first heatsink such that the second heatsink is surrounded by the first heatsink;
• and
• is dimensioned to reduce heat transfer between the first heatsink and the second heatsink such that the second module operates at a temperature below the second threshold temperature.

A method comprising:

• securing, to a base capable of supporting a plurality of heatsinks, a first heatsink designed to transfer heat away from a first component of a device, the first component being designed to operate at temperatures below a first threshold temperature;
• securing, to the base, a second heatsink that:
• is designed to transfer heat away from a second component of the device, the second component being:
• designed to operate at temperatures below a second threshold temperature that is different from the first threshold temperature;
• and
• positioned in an opening within the first component such that the second component is surrounded by the first component;
• includes a plurality of sides that extend from the base;
• and
• is at least partially thermally isolated from the first heatsink by a region of empty space that:
• is located between each side of the second heatsink that extends from the base and the first heatsink such that the second heatsink is surrounded by the first heatsink;
• and
• is dimensioned to reduce heat transfer between the first heatsink and the second heatsink;
• coupling the base to the device such that:
• the first component operates at a temperature below the first threshold temperature;
• and
• the second component operates at a temperature below the second threshold temperature.