Liquid immersion cooling platform
AssigneeTMGCore, LLC
InventorsJohn David Enright, Jacob Mertel
Life of this patent
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Abstract
A two-phase liquid immersion cooling system is described in which heat generating computer components cause a dielectric fluid in its liquid phase to vaporize. The dielectric vapor is then condensed back into a liquid phase and used to cool the computer components. Using a pressure controlled vessel and pressure controller, the disclosed system may be operated at less than ambient pressure. By controlling the pressure at which the system operates, the user may influence the temperature at which the dielectric fluid vaporizes and thereby achieve increased performance from a given computer component. Utilizing robotic arms and slot-in computing components, a self-healing computing system may be created.
Claims19
A cooling system for computing components comprising:
- a pressure controlled vessel comprising an interior wherein said vessel is configured to be operably connected to a pressure controller to reduce the interior pressure below atmospheric and above 650 torr, wherein the pressure controlled vessel is configured to comprise a volume of thermally conductive, condensable dielectric fluid in liquid and gas phase wherein the dielectric fluid has a boiling point below about 80 C. at atmospheric pressure and wherein the dielectric fluid is substantially free of water;
- one or more computer components arranged such that the one or more computer components may be at least partially submerged within the liquid phase of a volume of thermally conductive, condensable dielectric fluid;
- and
- a condenser located on a side of the pressure controlled vessel for condensing gas phase dielectric fluid to liquid phase dielectric fluid wherein the pressure controlled vessel comprises a ceiling which angles upward toward at least one side of the pressure controlled vessel.
A method for cooling computer components, the method comprising:
- providing a thermally conductive, condensable dielectric fluid in a liquid and gas phase in a pressure controlled vessel comprising a condenser located on a side of the pressure controlled vessel and wherein the pressure controlled vessel comprises a ceiling which angles upward toward at least one side of the pressure controlled vessel;
- and
- operating computer components at a pressure below ambient atmospheric pressure and above 650 torr in the presence of the thermally conductive, condensable dielectric fluid wherein the dielectric fluid is substantially free of water, wherein the computer components are at least partially in contact with the thermally conductive, condensable dielectric fluid in liquid phase and wherein the dielectric fluid condenses in the condenser located on the side of the pressure controlled vessel.
The method of cooling computer components, the method comprising:
- operating computer components at least at 1 psi less than ambient pressure and above 650 torr in a pressure controlled vessel comprising a ceiling which angles upward toward at least one side of the pressure controlled vessel, wherein the computer components are at least partially in contact with a thermally conductive, dielectric fluid, and wherein the boiling point of the dielectric fluid is below about 80° C. at atmospheric pressure and wherein the dielectric fluid is substantially free of water.
Dependencies are inferred from the claim text.